40 PIN SOCKET ZIP DIP Search Results

40 pin socket zip

Abstract: 40 pin socket zip dip 2-0068-05400-000-011-002 CERAMIC LEADLESS CHIP CARRIER LCC 32 socket 2-0068-05400 2002804845-000033027 strip socket 20 pin socket zip dip 2002803598000006005
Contextual Info: 3M IC Sockets Programming ZIP DIP Programming (ZIP DIP) 3M™ ZIP DIP Sockets Z IP (zero insertion force) D IP s are designed Tor applications where field replacement or program m ing of D IP s is required. The patented Z IP lever actuated mechanism allows easy insertion and withdrawal without lead damage.

218-3341-00-0602j

Abstract: TS-0365-14 40 pin socket zip dip 216-3340-00-0602 40 pin socket zip 220-3342-00-0602j amp zip socket 224-1275-00-0602J 228-1277-00 248-1282-00
Contextual Info: .100" 2.54 mm DIP Sockets ZIP DIP • • • • • For DIPs with .100" (2.54 mm) lead spacing Pin counts for 14-64 leads Lever actuated zero insertion force mechanism Socket easily disassembles for repairability Socket contact point of .110" (2.79 mm)

40 pin socket zip dip

Abstract: 228-1277-00 216-3340-00-0602 textool zip dip 40 pin socket zip 216-3340-00-0602J 218-3341-00-0602j zip socket TEXTOOL 216-3340 TEXTOOL
Contextual Info: .100" 2.54 mm DIP Sockets ZIP DIP • • • • • For DIPs with .100" (2.54 mm) lead spacing Pin counts for 14-64 leads Lever actuated zero insertion force mechanism Socket easily disassembles for repairability Socket contact point of .110" (2.79 mm)

40 pin socket zip dip

Abstract: 40 pin socket zip 20 pin socket zip dip 216-3340-00-0602 224-1275-00-0602J 214-3339-XX-0602J 216-3340-00-0602J 228-4817-00-0602J 220-3342-00-0602j TEXTOOL 216-3340
Contextual Info: .100" 2.54 mm DIP Sockets ZIP DIP • • • • • For DIPs with .100" (2.54 mm) lead spacing Pin counts for 14-64 leads Lever actuated zero insertion force mechanism Socket easily disassembles for repairability Socket contact point of .110" (2.79 mm)

40 pin socket zip dip

Abstract: 40 pin socket zip TEXTOOL 40 pin socket TEXTOOL 240-3639 220-3342-00-0602J 220-3342
Contextual Info: 3M Textool™.100” 2.54 mm DIP Sockets ZIP DIP • • • • • For DIPs with .100” (2.54 mm) lead spacing Pin counts for 14-64 leads Lever actuated zero insertion force mechanism Socket easily disassembles for repairability Socket contact point of .110” (2.79 mm) below top

Contextual Info: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Contextual Info: INTERPRETATION OF PRECICONTACT PART NUMBERS PR E FIX AB ABC A B CD ALPHA CHARACTERS DESIGNATE THE PRODUCT FAMILY. M ID D LE FIE LD XXX XX XXX XX XX XX X S U FFIX AB AB AB SPECIFIES SOCKET SIZE OR DIP SPACING AND NUMBER OF PINS. REPLACE XX or XXX IN THE MILL-MAX # WITH DIGITS FROM

MIL-S-83734

Abstract: lto socket precicontact CONNECTOR 83734 40 pin socket zip dip 40 pin socket zip
Contextual Info: INTERPRETATION OF PRECICONTACT PART NUMBERS PREFIX AB ABC ABCD ALPHA CHARACTERS DESIGNATE THE PRODUCT FAMILY. MIDDLE FIELD XXX XX XXX XX XX XXX SUFFIX AB AB AB SPECIFIES SOCKET SIZE OR DIP SPACING AND NUMBER OF PINS. REPLACE XX or XXX IN THE MILL-MAX # WITH DIGITS FROM

GM76C256all

Abstract: 16M-DRAM LT-860 GM23C400 GM76C28A GM23C810QA-12 LR-80 BFW12 GM23C8001 GM23C410
Contextual Info: FUNCTION GUIDE DRAM Capacity 1MBit Org 1W0 Type No 4Wt1 1Mk4 Current mA Power Supply Feature Package (m il) Avail 18DIP(300) NOW tCAC tA A Active S/B GM71C1000B/BJ/BZ-60 GM71C10008/BJ/BZ-70 GM71C 10OÛB/BJ/BZ-ÔO 60 70 80 20 20 25 30 35 40 90 eo 70 1 GM71C10006UBLJ/BLZ-60

GM76C88AL FW

Abstract: 71C4260 GM71G GM76C28A GM23C32000 LR-80 CLR-80 HR80 Tlr8
Contextual Info: FUNCTION GUIDE DRAM Capacity 1M Bit 4M Bit >rg Type No Max Access Tim e Current (mA Power Supply Feature tftAC U'AC Ia a Active GM71C1000B/BJ/BZ-60 60 20 30 90 GM71C1000B/BJ/BZ-70 70 20 35 80 GM71C1Q0ÜB/BJ/BZ-80 80 25 40 70 GM71C1000BL/BLJ/BLZ-60 60 20

40 pin socket zip dip

Abstract: 216-4840 224-4844 214483
Contextual Info: OEM ZIP DIP Sockets • BeCu contacts assure continuity with very short path to P.C. trace • Contact design prevents solder bridging and wicking • Zero insertion/extraction force achieved with simple cam rotation using a screwdriver • For use where package field replacement or

elan universal programmer

Abstract: DATAMAN-40PRO 27XXX 89CXX EM78Pxxx usb atmega 25Pxx serial isp atmel 89CXX-X PIC12XXX
Contextual Info: Dataman 40Pro www.dataman.com • Universal 40 pin ZIF socket accepts both 300/600 mil DIP devices up to 40 pin The Dataman 40Pro is a universal 40pin driver PC based programmer with ISP capabilities and USB 2.0 connectivity. Features: First member of the new USB 2.0 compatible generation of Windows based programmers. The 40Pro is built to

McKenzie socket division

Contextual Info: ZIP Sockets E L E C T R O N I C S MK McKenzie Socket Division Features LOW PROFILE • For high density m em ory using vertical •lOO (4,19 J TYP. zig -zag in-line patterns _L n r X .125 T (3,17) -.020 (0,51) TYP. Specify Contact/Shell 001B • Available in 16, 18, 2 0 , 2 4 , and 2 8 positions

Contextual Info: Package Lineup Package Lineup The packages are classified as follows, according to form, material, and the mounting methods for which they are suited. Packages TÍ Vertical type, Single lead Lead inserted type SIP ZIP Horizontal type,” Double lead — Matrix type

Contextual Info: Paradigm- PDM4M4050 256K x 32 BiCMOS/CMOS Static RAM Module Features □ High-density 8 megabit Static RAM module □ Low profile 64-pin ZIP Zig-Zag In-line vertical Package or 64 -pin SIMM (Single In-line Memory Module) □ Ultra fast access time: 10 ns (max.)

Contextual Info: ADAM TECH PRODUCTION SOCKETS IC SOCKETS ADAM TECHNOLOGIES INC. Z IP SOCKETS INTRODUCTION: Adam Tech Production Sockets perform a valuable function at a very low cost. They eliminate the need to solder expensive compo­ nents directly to the PC board. Added advantages include the abili­

land pattern for TSOP 2 86 PIN

Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS

20 pin Atmel 89C2051 microcontroller

Abstract: flash programmer circuit for AT89c2051 Atmel AT 2051 REAL TIME CLOCK using AT89C2051 led interface with 89C2051 20 pin 89C2051 AT89C2051 MICRO CONTROLLER AT89C2051 PROGRAMMING INTERFACE 2051 atmel atmel 89c2051 datasheet
Contextual Info: Tools Support 8051 Family In-Circuit Emulator The EMUL51TM-PC is a high performance in-circuit emulator specifically designed to provide an optimal environment for 8051 family microcontroller hardware and software development. The EMUL51TM-PC consists of a board which plugs directly into

20 pin Atmel 89C2051 microcontroller

Abstract: AT89C2051 PROGRAMMING INTERFACE REAL TIME CLOCK using AT89C2051 Microcontroller - AT89C2051 pin function AT89C2051 internal memory map 2051-PD 2051 atmel 2051 89C2051 REAL TIME CLOCK WITH AT89C51
Contextual Info: 8051 Family In-Circuit Emulator The EMUL51 -PC is a high performance in-circuit emulator specifically designed to provide an optimal environment for 8051 family microcontroller hardware and software development. The EMUL51-PC consists of a board which plugs directly into the IBM

amp zip socket 28

Contextual Info: ARIES ELECTRONICS INC 54E » RRIES ELECTRONICS, INC. Use Aries precision stamped collet pin Inser­ tion carriers and elim inate time consuming hand insertion of pins. Accurate alignm ent with the board hole pattern makes it fast and easy. After wave soldering the disposable insertion carrier is

Datasheet of IC 7432

Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
Contextual Info: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

Contextual Info: PDM4M6181 PDM4M6182 Pa r a u g m 256 KByte and 512 KByte Neptune Compatible Second Level Cache Modules for Intel Pentium CPUs Features Description □ 256 KByte and 512 KByte versions. □ 3.3V I/O compatible. □ Ideal for use with Intel Pentium™ CPU based

unc 5804

Abstract: XM3B XC2B-6411 j 5804 XM7A-0442-A XC4K-1542 Omron connector 64 pole-plug connector conectors 26 pins XM2S
Contextual Info: OMRON Connector Selection Year 2006 Edition For PCB-to-Cable Connection For PCB-to-PCB Connection 1 MIL Connectors XG page 5 FPC Connectors XF2 page 11 Easy Connectors for page 9 Industrial Application XN2 Half-pitch Connectors XH page 15 DIN Connectors XC