40 PIN Search Results

D1915

Abstract: Fly DS 100 6563CH
Contextual Info: CQV8110 • CQV8100 · CQV890 · CQV880 · CQV870 · CQV860 · CQV850 · CQV840 ChannelQTM 3.3 Volt Synchronous 8 Channel Queue Memory Configuration Device 131,072 x 40 65,536 x 40 32,768 x 40 16,384 x 40 8,192 x 40 4,096 x 40 2,048 x 40 1,024 x 40 CQV8110

MAX497

Abstract: MAX4456 MAX4456CPL MAX4456CQH MAX4456EPL MAX4456EQH MAX456
Contextual Info: 19-1389; Rev 0; 10/98 Low-Cost, 8x8 Video Crosspoint Switch Ordering Information PART TEMP. RANGE PIN-PACKAGE MAX4456CPL MAX4456CQH MAX4456EPL MAX4456EQH 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C 40 Plastic DIP 44 PLCC 40 Plastic DIP

MA4AGSW8-1

Abstract: indalloy 100
Contextual Info: MA4AGSW8-1 AlGaAs SP8T PIN Diode Series Switch Features V 1.00 MA4AGSW8-1 Layout Specified Performance : 50 MHz to 40 GHz Operational performance: 50 MHz to 50 GHz 2.0 dB Typical Insertion Loss at 40 GHz 30 dB Typical Isolation at 40 GHz thru 3 Diodes 22 dB Typical Isolation at 40 GHz thru 2 Diodes

HV500PJ

Abstract: SN55500
Contextual Info: ^ S u p e r te x ine . HV500 32-Channel AC Plasma Display Driver Ordering Information_ Package Options Device 40-Pin Ceramic DIP 40-Pin Plastic DIP 44-Pin J-Lead Ceramic Chip Carrier 44-Pin J-Lead Plastic Chip Carrier Die 40-Pin

Contextual Info: X2 KBA-40+ KBA-40 Frequency Multiplier 50Ω Output 5400 to 9600 MHz Maximum Ratings Features Operating Temperature -40°C to 85 °C Storage Temperature -55°C to 100°C RF Input Power 200mW Pin Connections INPUT 10 OUTPUT 6 SAMPLE* 1 GROUND 2,3,4,5,7,8,9

OL3204N-40

Abstract: PF40 OL3201N-40
Contextual Info: E2V0015-37-X1 ¡ electronic components OL3201N-40, OL3204N-40 LASER DIODES OL3201N-40, OL3204N-40 1.3 mm High-Power Laser-Diode DIP Module GENERAL DESCRIPTION The OL3201N-40 and OL3204N-40 are extremely high power, 1.3 mm laser-diode DIP modules with single-mode fiber pigtails. The OKI laser chips achieve single-mode fiber output of over

Contextual Info: Product Number: 852-40-016-20-001000 Description: Interconnect Header .050 Grid; Right Angle Pin Header Double Row Through Hole Plating Code: 40 Shell Plating: 200 " Tin matte finish over 100 μ" Nickel # Of Pins Mill-Max Part Number 16 852-40-016-20-001000

Contextual Info: Product Number: 800-40-003-20-001000 Description: Interconnect Header .100 Grid; Right Angle Pin Header .030 dia leads Single Row Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part Number 3 800-40-003-20-001000

Contextual Info: Product Number: 800-40-001-20-001000 Description: Interconnect Header .100 Grid; Right Angle Pin Header .030 dia leads Single Row Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part Number 1 800-40-001-20-001000

Contextual Info: Product Number: 800-40-002-20-001000 Description: Interconnect Header .100 Grid; Right Angle Pin Header .030 dia leads Single Row Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part Number 2 800-40-002-20-001000

Contextual Info: Product Number: 800-40-008-20-001000 Description: Interconnect Header .100 Grid; Right Angle Pin Header .030 dia leads Single Row Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part Number 8 800-40-008-20-001000

44S DIODE

Abstract: Q62702-A1066 marking 45s marking C1 MARKING 44s Q62702-A1065 Q62702-A1067 cu marking code diode DIODE BAS JS v Marking on semiconductor 720
Contextual Info: BAS 40W Silicon Schottky Diode ● ● ● ● General-purpose diodes for high-speed switching Circuit protection Voltage clamping High-level detecting and mixing Type Ordering Code tape and reel Pin Configuration 1 2 3 BAS 40-04W BAS 40-05W BAS 40-06W Q62702-A1065

Shrink Zig-Zag In-line Package

Abstract: 3569
Contextual Info: SHRINK ZIG-ZAG IN-LINE PACKAGE 40 PIN PLASTIC ZIP-40P-M02 EIAJ code : SZIP040-P-0470-1 40-pin plastic SZIP Lead pitch 35mil Row spacing 70mil Sealing method Plastic mold Mounting height 470mil MAX ZIP-40P-M02 40-pin plastic SZIP (ZIP-40P-M02) +0.50 +.020

brass properties

Contextual Info: Product Number: 802-40-002-20-001000 Description: Interconnect Header .100 Grid; Right Angle Pin Header .030 dia leads Double Row Through Hole Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part Number 2 802-40-002-20-001000

PC 8591

Abstract: HI-8591PST-40 AN-300 HI-8591 HI-8591PSI HI-8591PSI-40 HI-8591PSM HI-8591PSM-40 HI-8591PST HI-8591-40
Contextual Info: HI-8591 ARINC 429 LINE RECEIVER August 2006 DESCRIPTION PIN CONFIGURATIONS VCC - 1 TESTA - 2 7 - ROUTB RINB - 3 6 - ROUTA RINA - 4 5 - GND HI-8591PSI, HI-8591PST & HI-8591PSM HI-8591PSI-40, HI-8591PST-40 & HI-8591PSM-40 NC VCC TESTB NC 8 - PIN PLASTIC NARROW BODY SOIC

48-PIN

Abstract: A10C A12C A15C LH532000B
Contextual Info: LH532000B FEATURES CMOS 2M 256K x 8/128K x 16 M ask-Program m able ROM PIN CONNECTIONS • 262,144 words x 8 bit organization (Byte mode) 131,072 words x 16 bit organization (Word mode) 40-PIN DIP 40-PIN SOP TOP VI EW f 1• \ 40 ZI Ag a 7C 2 39 U Ag AgiZ

V40110

Abstract: v4050 Q1910 clk12
Contextual Info: FQV40110 • FQV40100 · FQV4090 · FQV4080 · FQV4080 · FQV4070 · FQV4060 · FQV4050 · FQV4040 FlexQTMIII Plus 3.3 Volt Synchronous x40 First-In/First-Out Queue Memory Organization Device Memory Organization Device 131,072 x 40 65,536 x 40 32,768 x 40 16,384 x 40

ESQ-2-70

Contextual Info: E-Series 2-Way 90° Power Divider 40 - 70 MHz ESQ-2-70 V3.00 Features ● ● R-2 2 Way 90° Specifications @ 25°C Frequency Range 40 - 70 MHz Insertion Loss 40 - 70 MHz Typical 0.3 dB Maximum 0.7 dB Isolation 40 - 70 MHz Typical 30 dB Minimum 20 dB Amplitude Unbalance

BYV255V200

Abstract: 1n5819 MINIMELF PACKAGE BYV255V-200 BAS70WFILM 1N5819 SOD-323 STPS40H100CW 1N5819 SOD-123 1n5817 SOD-123 stth30r03cg STPS1545CR
Contextual Info: Rectifiers High Power Efficiency Quick Reference Guide 20V, 30V and 40V SIGNAL SCHOTTKY DIODES Voltage max V Current (mA) P/N VF max @ IF (V) (mA) 10 20 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 40 40 40 40 3000 350 100 100 100 100 100 200 200

Contextual Info: ELECTRICAL CHARACTERISTICS at I At = 25°C V BR CBO VIBRJCEO V(BR)EBO Max. Device Type Marking (V ) TMPT2907A 2F 60 60 TMPT3906 2A 40 40 TMPT4403 2T 40 40 5.0 TMPT5087 2Q 50 50 _ TMPT5401 2L 160 150 5.0 TMPTA56 2G 80 80 4.0 100 NOTES: (V) v CB h FE 'c @ V CE Max. @ lc

ADSP-21xxx

Abstract: 21020F ADSP-2100 ADSP-21000 ADSP-21020 TSC21020F
Contextual Info: TSC21020F Radiation Tolerant 32/40–Bit IEEE Floating–Point DSP Microprocessor Introduction TEMIC Semiconductors is manufacturing a radiation tolerant version of the Analog Devices ADSP–21020 32/40–Bit Floating–Point DSP. The product is pin and code compatible with ADI

PD40-10

Abstract: PD40-12 PD40-13 PD40-14
Contextual Info: 40 W DC/DC OPEN FRAME/ CASE 21 40 Watt DC-Smart Power PD 40 Wide-Ranging Compact-Serie Besondere Merkmale Features Mehrfachausgänge Weiter Eingang Hoher Wirkungsgrad 100% Burn-in Kompakter Aufbau Überlast- und kurzschlußfest Gehäuseversion Multiple output

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 40 PIN PLASTIC To Top / Package Lineup / Package Index FPT-40P-M06 40-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold

Contextual Info: Product Number: 810-22-003-40-001101 Description: Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Surface Mount Plating Code: 22 Shell Plating: 20 " Gold over 100 μ" Nickel # Of Pins Mill-Max Part Number 3 810-22-003-40-001101