40 LEAD CERAMIC FLATPACK Search Results

68-PIN

Contextual Info: 4.10 Package Diagrams 64-Pin Thin Quad Flat Pack A64 4-40 Package Diagrams 68-Pin Grid Array Cavity Up G68 4-41 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 4-42 Package Diagrams 64-Lead Ceramic Quad Flatpack (Cavity Up) U65 4-43

Contextual Info: HS-80C85RH HARRIS S E M I C O N D U C T O R Radiation Hardened 8-Bit CMOS Microprocessor September 1995 Features Pinouts 40 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T40 TOP VIEW U xi [T m VD D • Radiation Hardened EPI-CMOS

5962-96902

Contextual Info: WMS256K16-XXX HI-RELIABILITY PRODUCT 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging •44 pin Ceramic SOJ Package 102 • 44 lead Ceramic Flatpack (Package 225)

WMS256K16L-XXX

Abstract: WMS256K16-XXX
Contextual Info: WMS256K16-XXX HI-RELIABILITY PRODUCT 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging •44 pin Ceramic SOJ Package 102 • 44 lead Ceramic Flatpack (Package 225)

TBA 129-5

Abstract: WMS256K16L-XXX WMS256K16-XXX
Contextual Info: White Electronic Designs WMS256K16-XXX 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ PIN CONFIGURATION FOR WMS256K16-XXX 44 CSOJ Packaging 44 FlatpacK • 44 pin Ceramic SOJ Package 102

Contextual Info: WMS256K16-XXX 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 PIN CONFIGURATION FOR WMS256K16-XXX FEATURES  Access Times 17, 20, 25, 35ns  MIL-STD-883 Compliant Devices Available 44 CSOJ  Packaging • 44 pin Ceramic SOJ Package 102 44 FlatpacK

5962-89598

Abstract: EDI88128CS
Contextual Info: White Electronic Designs EDI88128CS 128Kx8 Monolithic SRAM, SMD 5962-89598 FEATURES Access Times of 15*, 17, 20, 25, 35, 45, 55ns • 32 pad Ceramic LCC Package 141 CS# and OE# Functions for Bus Control • 32 lead Ceramic Flatpack (Package 142) 2V Data Retention (EDI88128LPS)

Z84C0010PEC

Abstract: MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead
Contextual Info: PACKAGE INFORMATION CPS95CO0125 CUSTOMER P ROCUREMENT S PECIFICA TION PACKAGE INFORMATION ORDERING CODES IC PACKAGE CODES TEMPERATURE A = VQFP Very Small QFP C = Ceramic Sidebrazed D = Cerdip E = Ceramic Window F = Plastic Quad Flatpack G = Ceramic PGA (Pin Grid Array)

Contextual Info: WMS256K16-XXX 256Kx16 MONOLITHIC SRAM, SMD 5962-96902 PIN CONFIGURATION FOR WMS256K16-XXX FEATURES  Access Times 17, 20, 25, 35ns  MIL-STD-883 Compliant Devices Available 44 CSOJ  Packaging • 44 pin Ceramic SOJ Package 102 44 FlatpacK

Contextual Info: yjj S u p er t e x inc. Preliminary 32 + 22 Channel Matrix Printhead Driver Ordering Information Package Options Device 68 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack Die 68 J - Lead Ceramic Quad Flatpack MIL-STD-883 Processed* HV33

Contextual Info: b lE SUPERTEX INC T> m 07732*15 0 0 0 3 3 4 7 Û13 * S T X HV33 Preliminary 32 + 22 Channel Matrix Printhead Driver Ordering Information_ _ Package Options Device 66 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack

Contextual Info: SUPERTEX 3SE D INC • 07732=15 Q D G 2 5 G 0 1 B I S T X Preliminary ~T-5f~/5 32 + 22 Channel Matrix Printhead Driver Ordering Information Package Options * Device 68 J - Lead Ceramic Quad Flatpack 68 J - Lead Plastic Quad Flatpack Die 68 J - Lead Ceramic Quad Flatpack

WS512K16-XXX

Abstract: TBA 129-5
Contextual Info: WS512K16-XXX 512Kx16 SRAM MODULE ADVANCED* FEATURES • Access Times 17, 20, 25, 35ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging •44 pin Ceramic SOJ Package 102 • 44 lead Ceramic Flatpack (Package 209) ■ Organized as two banks of 256Kx16

CERAMIC QUAD FLATPACK CQFP

Abstract: CQFP 240
Contextual Info: CQFP.FRM Page 1 Tuesday, February 9, 1999 4:20 PM CQFP Packaging Capabilities Surface Mount Description The Ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher lead count and smaller lead pitch than most

MO-143

Abstract: 172-CQFP 256-CQFP DIMENSIONS PQFP 132 CPGA132 CERAMIC QUAD FLATPACK CQFP
Contextual Info: Package Characteristics and Mechanical Drawings Package Thermal Characteristics Package Type Plastic Leaded Chip Carrier PLCC Plastic Quad Flatpack (PQFP) Pin Count θjc θja θja Still Air 300 ft/min Unit 44 16 43 31 °C/W 68 13 36 25 °C/W 84 12 32 22

2 010 073 007

Abstract: cqfp package outline CERAMIC QUAD FLATPACK CQFP CQFP 172 PIN
Contextual Info: AMI A M I S E M IC O N D U C T O R %s CQFP Packaging Capabilities Description Surface Mount The ceramic Quad Flatpack CQFP is a high-density package for high lead count surface mount applications. It has a higher leaad count and smaller lead pitch than most other ceramic packages. It has been provided in a

1010-1018

Abstract: MO-078AA OM8500SC OM8500SCH OM8500SCP OM8500SF OM8500SFH OM8500SFP
Contextual Info: PD-94465A Low Dropout Linear Regulator Hermetic Package OM8500SC OM8500SF +3.3Vin to +1.8Vout at 3.0A Product Summary Part Number OM8500SC OM8500SF IO 3.0A 3.0A Vin 3.3V 3.3V Vout 1.8V 1.8V Package MO-078AA 8-lead Flatpack MO-078AA Features: The OM8500 is a low dropout linear regulator designed

1010-1018

Abstract: MO-078AA OM8503SC OM8503SCH OM8503SCP OM8503SF OM8503SFH OM8503SFP
Contextual Info: PD-94468A Ultra Low Dropout Linear Regulator Hermetic Package OM8503SC OM8503SF +7.4Vin to +6.8Vout at 3.0A Product Summary Part Number OM8503SC OM8503SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin 7.4V 7.4V Vout 6.8V 6.8V Package MO-078AA 8-lead Flatpack MO-078AA

MO-078AA

Abstract: OM8501SC OM8501SCH OM8501SCP OM8501SF OM8501SFH OM8501SFP
Contextual Info: PD-94466A Ultra Low Dropout Linear Regulator Hermetic Package OM8501SC OM8501SF +3.3Vin to +2.5Vout at 3.0A Product Summary Part Number OM8501SC OM8501SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin 3.3V 3.3V Vout 2.5V 2.5V Package MO-078AA 8-lead Flatpack MO-078AA

MO-078AA

Abstract: OM8504SFP 1010-1018 OM8504SC OM8504SCH OM8504SCP OM8504SF OM8504SFH
Contextual Info: PD-94469A Ultra Low Dropout Positive Adjustable Linear Regulator Hermetic Package OM8504SC OM8504SF + 3.3Vin at 3.0A Product Summary Part Number OM8504SC OM8504SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin Package 3.3V MO-078AA 3.3V 8-lead Flatpack MO-078AA Features:

MO-078AA

Abstract: OM8506SC OM8506SCH OM8506SCP OM8506SF OM8506SFH
Contextual Info: PD-94471A Ultra Low Dropout Adjustable Linear Regulator Hermetic Package OM8506SC OM8506SF +7.5Vin / +6.1 to +7.0Vout at 3.0A Product Summary Part Number OM8506SC OM8506SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin Package 7.5V MO-078AA 7.5V 8-lead Flatpack MO-078AA

MO-078AA

Abstract: OM8502SC OM8502SCH OM8502SCP OM8502SF OM8502SFH OM8502SFP 1010-1018
Contextual Info: PD-94467A Ultra Low Dropout Linear Regulator Hermetic Package OM8502SC OM8502SF +5.6Vin to +5.0Vout at 3.0A Product Summary Part Number OM8502SC OM8502SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin 5.6V 5.6V Vout 5.0V 5.0V Package MO-078AA 8-lead Flatpack MO-078AA

MO-078AA

Abstract: OM8507SC OM8507SF
Contextual Info: PD-94472A Ultra Low Dropout Linear Regulator Hermetic Package OM8507SC OM8507SF +5.0Vin to +2.5Vout at 3.0A Product Summary Part Number OM8507SC OM8507SF Vin 5.0 V 5.0 V Vout 2.5V 2.5V IO Package 3.0A MO-078AA 3.0A 8-lead Flatpack MO-078AA Features: The OM8507 is an ultra low dropout linear regulator designed specifically for hi-rel applications. Housed in

MO-078AA

Abstract: OMR9801SC OMR9801SCH OMR9801SCK OMR9801SCP OMR9801SF OMR9801SFH OMR9801SFP
Contextual Info: PD-94484A 200 Krad Si Ultra Low Dropout Linear Regulator Hermetic Package OMR9801SC OMR9801SF + 3.3Vin to +2.5Vout at 3.0A Product Summary Part Number OMR9801SC OMR9801SF Dropout 0.4 V 0.4 V IO 3.0A 3.0A Vin 3.3V 3.3V Vout 2.5V 2.5V Package MO-078AA 8-pin Flatpack