3N3 M Search Results

Contextual Info: AEC-Q200 Updated: February 7, 2014 Validity: Q1-CY2014 X7R + FLEXITERM - AECQ-200 0603 to 0805 Mass Production 2014 2015 Capacitance Value / Capacitance Code Case Size Voltage 1n 1n5 2n2 3n3 4n7 6n8 10n 15n 22n 33n 47n 68n 100n 102 152 222 332 472 682 103

HP8720D

Abstract: 0805C HP8753E
Contextual Info: SMD WIRE WOUND CERAMIC CHIP INDUCTORS 0805C Series 10 Part Number L nH Tolerance Q (Min) SRF(min.) (MHz) DCR Ω (Max) I rms. (mA) 0805C-2N8 2.8@250MHz M, K, J 80@1500MHz 7900 0.06 800 0805C-3N0 3.0@250MHz M, K, J 65@1500MHz 7900 0.06 800 0805C-3N3 3.3@250MHz

4n7j 100

Abstract: 4n7j R10J R015J R010J 6N8J 5n6j
Contextual Info: MODEL IMC 0603 Inductors Coated Case -% e l 4 ‘“ b Inductance 1.5nH 1.8nH 2.2nH 2.7nH 3.3nH 3.9nH 4.7nH 5.6nH 6.8nH 8.2nH 10nH 12nH 15nH Bas 250 pcs. IMC0603 1N5 RE4 IMC0603 1N8 RE4 IMC0603 2N2 RE4 IMC0603 2N7 RE4 IMC0603 3N3 RE4 IMC0603 3N9J RE4

47n J 1000V

Contextual Info: Standard Grade Validity: Q1-CY2014 X5R – roadmap 0101 to 0603 Case Size 0101 = EIA 01005 0201 Voltage Mass Production 2014 2015 Capacitance Value / Capacitance Code 100 150 220 330 470 680 1n 1n5 2n2 3n3 4n7 6n8 10n 15n 22n 33n 47n 68n 100n 220n 470n 1u

Contextual Info: !! % ! " # $ " " ! # # $ % !&' * ! +& ,-. ) / 0 % +&12 ) * & & & & & & 3 0 4 53 0 4 6 # 6 7 3 8 ! : # # # ; 7 3 ;# 3 = > $5 < #7 & &? 3 @ A 3 @ A 3 # !&'EFG &D 3 # > H 3 & IJ -K ) / L5 & & !&'EFG & & & & & & 3 6 3 3 ;# 3 M 3N3 &0 5 C 4 3 #7 5 +O & = 3"

LCN1206T-10N

Abstract: smd color coding
Contextual Info: SMD Wire Wound Ceramic Chip Inductors – LCN1206 Series Electrical Characteristics LCN1206T-3N3…-S LCN1206T-6N8…-S 3.3 6.8 Test Frequency MHz 100 100 LCN1206T-10N…-S 10 100 10 / 5 / 2 40 LCN1206T-12N…-S 12 100 10 / 5 / 2 40 Part Number Inductance (nH)

AS0B

Abstract: diode+t25+4+L5
Contextual Info: !! $ " # $ % ! " # " & "' * " +' ,-. * / 0 & +'12 * % % % % % % 3 0 4 53 0 4 6 $ 6 7 3 8 " : $ $ $ ; 7 3 ;$ 3 = > %5 < $7 % %? 3 @ A 3 @ A 3 $ 3 %D $ "'(EFG %D 3 $ > H 3 % % IJ -K * / L5 % "'(EFG % % % % % % 3 6 3 3 ;$ 3 M 3N3 %0 5 C 4 3 $7 5 +O % = 3# +?6

CCFH0805

Contextual Info: Tol Q Min. nH % (*MHz) Min. SRF CCFH0805-3N3 3.3 @250MHz J,K 50 (MHz) ( ) (mA) >3000 0.07 600 CCFH0805-3N9 3.9 @250MHz J,K 50 >3000 0.08 600 CCFH0805-4N7 4.7 @250MHz J,K 50 >3000 0.09 600 CCFH0805-5N6 5.6 @250MHz J,K 50 >3000 0.11 600 CCFH0805-6N8 6.8 @250MHz

Contextual Info: UNSHIELDED CHIP INDUCTORS PM06 Dimensions PM06 SERIES Miller Number PM06-1N5 PM06-1N8 PM06-2N2 PM06-2N7 PM06-3N3 0.80 4+/-.15 Test Typ. Q Fo R,dc I,dc L+0.3 Freq. @ 800 Min. Max. Max. nH Q MHz MHz MHz Ohms mA 1.5 1.8 2.2 2.7 3.3 L±5% nH 3.9 4.7 5.6 6.8 8.2

Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

R22-R27

Contextual Info: RF Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

L-07C

Abstract: marking 1N3 1N5 diode L07C 2n2 j 100 L-07C10NJV6T
Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

n68 j 250

Abstract: TE56N OF 22 nH INDUCTOR TP-2N2 Inductor 0.5 nH TE10N
Contextual Info: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE

SWI1210

Contextual Info: WIRE WOUND CHIP INDUCTORS SPI/SWI/SCI SERIES Introductions The SFI/SWI/SCI series are chip inductors widely used in the communication applications such as cellular phones, pagers ,and other electronic devices. The wire wound features advance in higher self resonate frequency, better Q factor, and much more stable performance.

FBMH3225HM601N

Abstract: HM601H BK1608 bk2125 LK2125 BK1005 LK-1608 LK3216 TS601 LM152
Contextual Info: Cross Reference to Taiyo Yuden Parts Taiyo Yuden Part Number Taiyo Yuden Part Number BK1005 HW121 BK1005 HW241 BK1005 HW431 BK1005 HW601 BK1005 HS121 BK1005 HW241 BK1005 HS601 BK1005 HM241 BK1005 HM471 BK1005 HM601 MAX ECHO P/NO. N/A N/A N/A N/A EBM100505A121

Contextual Info: SPECIFICATION FOR APPROVAL REF. : MH1005□□□□L□-□□□ ABC'S DWG NO. PROD. Multilayer Chip Inductor NAME 20130819-B REV. PAGE 1 Ⅰ﹒Configuration and dimensions： A D C D B Unit：m/m A B C D 1.00 ± 0.10 0.50 ± 0.10 0.50 ± 0.10 0.20 ± 0.10

LL1608FSL56NJ

Abstract: LL1608-FSL2N7S LL1608-FSL15NJ LL1608FSL LL1608-FSL1N2S LL1608-FSL1N5S LL1608-FSL1N8S LL1608-FSL2N2S LL1608-FSL3N3S LL1608-FSL3N9S
Contextual Info: 14 TYPE Multilayer Chip Inductors LL1608FSL Meeting Your Needs The LL1608-FSL Series is a multilayer ceramic chip inductor with an EIA standard 0603 footprint, lead-free terminations, and expanded electrical specifications with respect to inductance, Q, and self-resonant frequency.

630 3n3 k

Contextual Info: CHIP INDUCTORS SURFACE MOUNT CHIP INDUCTORS LQN21A SERIES muRaln /n/iorató/ 1 in f/cct/v/urs APPLICATIONS The L Q N 2 1 A Series consists o f air-core ch ip coils using a subm iniature alum ina core as a b o b b in . The high Q value at high frequencies and high self-resonant

Contextual Info: SURFACE MOUNT WIREWOUND CHIP INDUCTOR Dimensions in inches mm Inductance Tolerance Coded Dash Numbers B ±0.15nH S ±0.30nH G ±2% J ±5% K ±10% M ±20% How to order code Packaging 555-0402 555-0603/0805 555-1008 Basic Part No. -1N-0 -2N-0 -2N-2 -2N-7 -3N-3

SMD marking 1N3

Abstract: 4033n HP 4504 multilayer GHz
Contextual Info: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications

Contextual Info: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications

Contextual Info: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications

Contextual Info: I N D U C T O R S July 2013 Inductors for High Frequency Multilayer Ceramic MLK series MLK0603 MLK1005 0603 [0201 inch]* 1005 [0402 inch] * Dimensions Code JIS[EIA] 2/15 I N D U C T O R S REMINDERS FOR USING THESE PRODUCTS Before using these products, be sure to request the delivery specifications.

SMD marking 1N3

Abstract: SMD MARKING CODE 201 LCMC0201
Contextual Info: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications