3N3 J 100 Search Results

CCFH0805

Contextual Info: Tol Q Min. nH % (*MHz) Min. SRF CCFH0805-3N3 3.3 @250MHz J,K 50 (MHz) ( ) (mA) >3000 0.07 600 CCFH0805-3N9 3.9 @250MHz J,K 50 >3000 0.08 600 CCFH0805-4N7 4.7 @250MHz J,K 50 >3000 0.09 600 CCFH0805-5N6 5.6 @250MHz J,K 50 >3000 0.11 600 CCFH0805-6N8 6.8 @250MHz

Copper wire inductors

Contextual Info: WIREWOUND CHIP INDUCTORS SCI1008LP SERIES 1. PART NO. EXPRESSION : SCI1008LP-3N3KF a (b) (c) (d) (e)(f) (a) Series code (d) Inductance code : 3N3 = 3.3nH (b) Dimension code (e) Tolerance code : G = ±2%, J = ±5%, K = ±10% (c) Type code : LP ( Low Profile )

HP8720D

Abstract: 0805C HP8753E
Contextual Info: SMD WIRE WOUND CERAMIC CHIP INDUCTORS 0805C Series 10 Part Number L nH Tolerance Q (Min) SRF(min.) (MHz) DCR Ω (Max) I rms. (mA) 0805C-2N8 2.8@250MHz M, K, J 80@1500MHz 7900 0.06 800 0805C-3N0 3.0@250MHz M, K, J 65@1500MHz 7900 0.06 800 0805C-3N3 3.3@250MHz

Contextual Info: WIREWOUND CHIP INDUCTORS SCI1008LP SERIES 1. PART NO. EXPRESSION : SCI1008LP-3N3KF a (b) (c) (d) (e)(f) (a) Series code (d) Inductance code : 3N3 = 3.3nH (b) Dimension code (e) Tolerance code : G = ±2%, J = ±5%, K = ±10% (c) Type code : LP ( Low Profile )

Contextual Info: 1. Part Description 1.1 Part Numbering Example 0402 ( Ex. ) H C- 3N3 E J T S SIZE. 0402 1.0 * 0.5 mm 0603 1.6 * 0.8 mm 0805 2.0 * 1.2 mm 1008 2.5 * 2.0 mm 1206 3.2 * 1.6 mm 1210 3.2 * 2.5 mm SHAPE. PACK. C : C SHAPE H : H SHAPE M : MOLDING S=EIA RS481 CLEAR TAPE & REEL

47n J 1000V

Contextual Info: Standard Grade Validity: Q1-CY2014 X5R – roadmap 0101 to 0603 Case Size 0101 = EIA 01005 0201 Voltage Mass Production 2014 2015 Capacitance Value / Capacitance Code 100 150 220 330 470 680 1n 1n5 2n2 3n3 4n7 6n8 10n 15n 22n 33n 47n 68n 100n 220n 470n 1u

AML1005H

Abstract: 56N10 AML1005H10NJTS AML1005H56NJTS AML1005H1N0STS AML1005H1N5STS AML1005H18NJTS AML1005H2N2STS AML1005H82NJTS FDK 004
Contextual Info: MD-MDJ001-0709 AML1005H タイプ電気特性一覧 Q Min Part number L[nH] Toler 100MHz -ance DC Q Typ S.R.F. Rated Resistance 100 100 800 1000 2000 [MHz] [MHz] [MHz] [MHz] [MHz] [MHz] current [ohm] Typ [mA] Typ AML1005H1N0STS 1.0 S 8 10 30 35 46 >10000 0.04

FDK 004

Abstract: AML1005H1N5STS
Contextual Info: MD-MDE001-0709 AML1005H ELECTRICAL CHARACTERISTICS Q Min Part number L[nH] Toler 100MHz -ance DC Q Typ S.R.F. Rated Resistance 100 100 800 1000 2000 [MHz] [MHz] [MHz] [MHz] [MHz] [MHz] current [ohm] Typ [mA] Typ AML1005H1N0STS 1.0 S 8 10 30 35 46 >10000 0.04

HK0603

Abstract: HK1005 HK1608 HK2125
Contextual Info: 高周波積層チップインダクタ MULTILAYER CHIP INDUCTOR FOR HIGH FREQUENCY HK SERIES 0603：−55~125℃ ＊HK0603, HK1005を除く ＊Except for HK0603, HK1005 1005：−55∼125℃＊＊ OPERATING TEMP. −55∼85℃＊＊ 1608：−40∼85℃

HK0603

Abstract: HK0603 22NJ
Contextual Info: 高周波積層チップインダクタ MULTILAYER CHIP INDUCTOR FOR HIGH FREQUENCY HK SERIES 0603：−55~125℃ ＊HK0603, HK1005を除く ＊Except for HK0603, HK1005 1005：−55∼125℃＊＊ OPERATING TEMP. −55∼85℃＊＊ 1608：−40∼85℃

HKQ0603

Abstract: HK0603
Contextual Info: 高周波積層チップインダクタ MULTILAYER CHIP INDUCTOR FOR HIGH FREQUENCY HK SERIES 0603D｜55V125C ＊HK0603, HK1005を除く ＊Except for HK0603, HK1005 1005D｜55V125C＊＊ OPERATING TEMP. ｜55V85C＊＊ 1608D｜40V85C ＊＊保証定格により変わります。

Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

Contextual Info: SURFACE MOUNT WIREWOUND CHIP INDUCTOR Dimensions in inches mm Inductance Tolerance Coded Dash Numbers B ±0.15nH S ±0.30nH G ±2% J ±5% K ±10% M ±20% How to order code Packaging 555-0402 555-0603/0805 555-1008 Basic Part No. -1N-0 -2N-0 -2N-2 -2N-7 -3N-3

Contextual Info: 1. Part Description 1.1 Part Numbering Example 0805 ( Ex. ) C S - 120 E J T S SIZE. 0402 1.0 * 0.5 mm 0603 1.6 * 0.8 mm 0805 2.0 * 1.2 mm 1008 2.5 * 2.0 mm 1206 3.2 * 1.6 mm 1210 3.2 * 2.5 mm SHAPE. PACK. C : C SHAPE H : H SHAPE M : MOLDING S=EIA RS481 CLEAR TAPE & REEL

AML0603Q10NJT

Abstract: AML0603Q8N2JT
Contextual Info: MD-MDE004-201212 Multilayer Chip Inductor AML0603Q Series Q Ｌ[nH] Toler Parts number 100 -ance [MHz] DC Rated Resistance Current [ohm] [mA] Typ. Max. S.R.F. Q [MHz] Typ. [MHz] Min. [MHz] Typ. 100 100 800 1000 2000 AML0603Q0N6*T 0.6 B,C,S - 5 18 21 32 >10000

R22-R27

Contextual Info: RF Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

MARKING H9

Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM CHIP INDUCTOR KL73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Veer hole Direction mark Marking

Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking

marking TB

Abstract: 8 tb 08 Marking code H6 TE 56 -ATC
Contextual Info: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE

AML0603Q82N

Abstract: AML0603Q2N7 AML0603Q1N1 AML0603Q0N6 AML0603Q1N0 AML0603Q4N7ST
Contextual Info: AML0603Q CHARACTERISTICS Ｌ[nH] 100 [MHz] Toler -ance AML0603Q0N6*T 0.6 AML0603Q0N7*T Parts number Q [MHz] Min. Q [MHz] Typ. Ver.Enｇ/10 S.R.F. [MHz] Typ. DC Resistance [ohm] Typ. Rated Current [mA] Max. 100 100 800 1000 2000 B,C,S - 5 18 21 32 >10000 0.05

Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

0805CS Series

Abstract: 0805CS 0805CS-2N8E 0805CS-3N0E 0805CS-3N3E 0805CS-5N6E 0805CS-6N8E 0805CS-7N5E 0805CS-151E 0805cs-122
Contextual Info: WIRE-WOUND CHIP INDUCTOR – CERAMIC / 0805 2012 0805CS Series (2.7 ~ 4700nH) Part Number 0805CS-2N7E TS 0805CS-2N8E_TS 0805CS-3N0E_TS 0805CS-3N3E_TS 0805CS-5N6E_TS 0805CS-6N2E_TS 0805CS-6N8E_TS 0805CS-7N5E_TS 0805CS-8N2E_TS 0805CS-8N7E_TS 0805CS-100E_TS

L-07C

Abstract: marking 1N3 1N5 diode L07C 2n2 j 100 L-07C10NJV6T
Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin