3M MP2 Search Results

MP2F

Abstract: 40af 91631 MP2-S1206-51M1-TFB0 h17a tba 2218 TGS0 til 701 HB125 til 31a
Contextual Info: 3M 3M Backplane and CompactFlash w Connectors MetPak™ 2 HM Sockets and Headers E 4 « q u i» * u | ^ 1 ü F l|.2 iH t t o ix u n U r . F l|. 3 ^R g .S F I ,. 4 & “ R g .6 1119: : » ir m u m h rru r n r» r a n ; U O iW X Female Sockel. Right Angle. PCB Press Fit Term inals. Shielded Ground

Contextual Info: 3M MetPak™ 2-FB Inverse Socket 2 mm 5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • Guiding alignment feature eliminates bent pins on backplane • Footprint compatible with standard Futurebus+ • Ideal for hot swapping • End-to-end stackable

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • Three levels of early mate, late break EMLB sequencing or selective loading options • Footprint compatible with standard Futurebus+ • Solder tail with true-position wafer

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • Three levels of early mate, late break EMLB sequencing or selective loading options • Footprint compatible with standard Futurebus+ • Solder tail with true-position wafer

Contextual Info: 3M MetPak™ 2-FB Inverse Socket 2 mm 5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • Guiding alignment feature eliminates bent pins on backplane • Footprint compatible with standard Futurebus+ • Ideal for hot swapping • End-to-end stackable

TG30

Abstract: TR30 TS-1121-B
Contextual Info: 3M MetPak™ 2-FB Inverse Socket 2 mm 5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • Guiding alignment feature eliminates bent pins on backplane • Footprint compatible with standard Futurebus+ • Ideal for hot swapping • End-to-end stackable

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Elevated, Solder Tail MP2 Series • Elevated connector for offset coplanar/end-to-end stacking • Ideal for low profile IU boxes • Ideal for “pizza box” applications • Ideal for hot swapping applications

1117 B

Abstract: 1117b TG30 TR30 3M MP2
Contextual Info: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force Molded guide fingers provide integrated alignment Alignment wafer for true position

TS-1117-06

Abstract: TG30 TR30
Contextual Info: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • Molded guide fingers provide integrated alignment • Alignment wafer for true position

Contextual Info: 3M MetPak™ 2-FB Stacking Socket 2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • High-profile/high pin count • Ideal for parallel stacking applications • Vertical receptacle

Contextual Info: 3M MetPak™ 2-FB Stacking Socket 2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • High-profile/high pin count • Ideal for parallel stacking applications • Vertical receptacle

Contextual Info: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • Molded guide fingers provide integrated alignment • Alignment wafer for true position

Contextual Info: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force Molded guide fingers provide integrated alignment Alignment wafer for true position

MP2-SXXXG-51XX-XXXX

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Elevated, Solder Tail MP2 Series • Elevated connector for offset coplanar/end-to-end stacking • Ideal for low profile IU boxes • Ideal for "pizza box" applications • Ideal for hot swapping applications

Contextual Info: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible RoHS* compliant platings available

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • • • • • • • • Three levels of early mate, late break EMLB sequencing or selective loading options Footprint compatible with standard Futurebus+ Solder tail with true-position wafer

Contextual Info: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See the Regulatory Information Appendix (RIA)

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Stacking, Solder or Press-Fit Tail MP2 Series • • • • • • 16 mm to 18.5 mm high-profile stacking Pin counts up to 300 Footprint compatible with standard Futurebus+ Ideal for hot swapping applications

Contextual Info: 3M MetPak™ 2-FB Stacking Socket 2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • • • • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force High-profile/high pin count Ideal for parallel stacking applications

TG30

Abstract: TR30 TS-1122
Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • • • • • • • • Three levels of early mate, late break EMLB sequencing or selective loading options Footprint compatible with standard Futurebus+ Solder tail with true-position wafer

Contextual Info: 3M MetPak™ 2-FB Socket 2 mm 4/5-Row, Solder Tail or Press-Fit With Tail Cover, Right Angle • • • • • • • • • MP2 Series End-to-end stackable Offset dual-beam contact minimizes insertion force Expanded pin counts Protective Push-Cap Monoblockable

Contextual Info: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See Regulatory Information Appendix (RIA)

Contextual Info: 3M MetPak™ 2-FB Socket 2 mm 4/5-Row, Solder Tail or Press-Fit With Tail Cover, Right Angle MP2 Series • • • • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force Expanded pin counts Protective Push-Cap Monoblockable

TG30

Abstract: TR30 ria 15 3M MP2
Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Stacking, Solder or Press-Fit Tail MP2 Series • • • • • • 16 mm to 18.5 mm high-profile stacking Pin counts up to 300 Footprint compatible with standard Futurebus+ Ideal for hot swapping applications