35X35 BGA Search Results

CU1100

Abstract: MBA35002
Contextual Info: Model : MBA35002 Series For 35x35 Chip set BGA Heat Sink MBA35002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic UL94-V0 2.Heat sink dimension : Foot print : 35x35mm Part no. Height Fin shape Base MBA35002MBA35002MBA35002MBA35002- 12

P-BGA769-35x35-1

Abstract: PRBG0769FB-A P-BGA769
Contextual Info: JEITA Package Code P-BGA769-35x35-1.00 RENESAS Code PRBG0769FB-A Previous Code 769F7T D MASS[Typ.] 4.0g A D1 b A e y S 1pin corner S ZE AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B S AB ZD A1 1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930313233

35x35 bga

Contextual Info: 396-PIN PLASTIC BGA 35x35 A S B C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P NM L K J HG F E D C B A P Index mark J I H R S K L φM S F E G M NOTE Each lead centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.

PBGA516

Abstract: PRBG0516DD-A
Contextual Info: JEITA Package Code P-BGA516-35x35-1.27 RENESAS Code PRBG0516DD-A D MASS[Typ.] 4.3g A A D1 B Previous Code 516F7X-E ZD b S AB e ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

PRBG0352DA-A

Contextual Info: JEITA Package Code P-BGA352-35x35-1.27 RENESAS Code PRBG0352DA-A D MASS[Typ.] 3.6g A A D1 ZD A1 b S AB e ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 352F7X-A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

35x35 bga

Contextual Info: 396-PIN PLASTIC BGA 35x35 A S B C Index mark 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P NM L K J HG F E D C B A P J I H R S K L φ M S F E G M NOTE Each lead centerline is located within φ 0.3 mm of its true position (T.P.) at maximum material condition.

313-PIN

Contextual Info: 313-PIN PLASTIC BGA 35x35 A B S C Index mark 24 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D AE AC AA W U R N L J G E C A AD AB Y V Y P M K H F D B P J R I H L K S φM M T E S G F NOTE Each ball centerline is located within φ 0.3 mm of

P609

Abstract: 609-PIN
Contextual Info: 609-PIN PLASTIC BGA 35x35 w S B D D1 ZE ZD B 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A E1 E φ 2.5 w S A INDEX MARK AN AL AJ AG AE AC AA W U R N L J G E C A AM AK AH AF AD AB Y V T P M K H F D B (UNIT:mm)

Contextual Info: 1155-PIN PLASTIC BGA FLIP CHIP TYPE (35x35) A ZE w S A D ZD SD 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 B E1 E SE 4xC0.5 AN AL AJ AG AE AC AA W U R N L J G E C A AP AM AK AH AF AD AB Y V T P M K H F D B

PRBG0953FC-A

Abstract: P-BGA953-35x35-1
Contextual Info: JEITA Package Code P-BGA953-35x35-1.00 RENESAS Code PRBG0953FC-A B D Previous Code 953F7X-C A D1 MASS[Typ.] 4.2g A ZD b S AB e y S AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A ZE E E1 e A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33

35x35 bga

Contextual Info: 352-PIN PLASTIC BGA 35x35 A S B C Index mark 25 23 21 19 17 15 13 11 9 7 5 3 1 D 26 24 22 20 18 16 14 12 10 8 6 4 2 AE AC AA W U R N L J G E C A AF AD AB Y V Y P M K H F D B P J I R H L K S φM M F E S G NOTE Each ball centerline is located within φ 0.30 mm of

P-BGA-456

Abstract: PBGA456 PRBG0456DD-A PBGA-456 bga456
Contextual Info: JEITA Package Code P-BGA456-35x35-1.27 RENESAS Code PRBG0456DD-A D A D1 B Previous Code 456F7A MASS[Typ.] 4.1g A b ZD S AB e y S Index mark S ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

PBGA516

Abstract: PRBG0516DE-A
Contextual Info: JEITA Package Code P-BGA516-35x35-1.27 RENESAS Code PRBG0516DE-A Previous Code 516F7X-F B D A MASS[Typ.] 4.3g A A1 ZD b S AB e y S 1pin corner S ZE AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e D1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

PRBG0681FA-A

Contextual Info: JEITA Package Code P-BGA681-35x35-1.00 RENESAS Code PRBG0681FA-A MASS[Typ.] 3.9g Previous Code 681F7T D A D1 φb A AB e y S 1pin corner S ZE AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B φx M S ZD A1 1 2 3 4 5 6 7 8 9 1011121314151617181920212223242526 27 28 29 30 31 32 33

tray datasheet bga

Abstract: jedec tray BGA tray bga JEDEC TRAY DIMENSIONS JEDEC tray standard
Contextual Info: TRAY CONTAINER NEC A' 35.18 135°C MAX. 7 BGA 35x35A 38.00 76.0 A 29.95 35.18 38.00 266.0 24.50 315.0 322.6 SECTION A-A' (3.91) 35.18 7.62 (6.35) 135.9 PPE 3×8=24 UNIT : mm Applied Package Quantity (pcs) 1155-pin Plastic BGA (35×35) (FLIP CHIP TYPE) 24 MAX.

GAL20V8B-15LD

Abstract: pDS4102-DL2 5962-8983903RA 5962-8983904RA lb388 ispPAC-power1208 GAL20V8B-15LD/883 CPLD military SMD TQFP microcontroller HW7265-dl2
Contextual Info: Bringing the Best Together Product Selector Guide Bringing the Best Together Lattice Solutions Introduction Lattice Semiconductor, the company that pioneered In-System Programmability ISP , offers the industry’s broadest and most diverse portfolio of programmable system solutions.

HLQFP 176 Package

Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
Contextual Info: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)

PES16H16

Abstract: 89HPES16H16
Contextual Info: 89HPES16H16 Data Sheet 16-Lane 16-Port PCI Express Switch Preliminary Information* ® Device Overview ◆ The 89HPES16H16 is a member of the IDT PRECISE family of PCI Express® switching solutions. The PES16H16 is a 16-lane, 16-port peripheral chip that performs PCI Express packet switching with a

TI 35X35 BGA 368 BGA

Abstract: 547 B34 kl 668 sem 304
Contextual Info: •SSSS D a t a S h e e t _ O K I A S I C P R O D U MG73Q000/74Q000 and MSM98Q000/99Q000 0.35iim Customer Structured Arrays April 1999 Oki Semiconductor CONTENTS D

ra1613

Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27
Contextual Info: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations

oki cross

Contextual Info: D ATA SHEET O K I A S I C P R O D U C T S MG87P3/87P4/87P5 0.25µm Standard Cell July 2001 • ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––

NP276-11904-3

Abstract: 7400 IC series information OF ic 7400 specifications of IC 7400 U 2250 B1 NP276-11904 0735X 29X29 for ic 7400 NP276-37206-AC03327
Contextual Info: NP276 Series Open Top Ball Grid Array (BGA) Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: 1,000MΩ min. at 100V DC 100V AC for 1 minute 30m Ω max. at 10mA/20mV max.

zru 2

Abstract: BGA456 300541 8214-0-15-15-05-14-40-0
Contextual Info: 7 3 THE DRAWINGS AND INFORM ATION CONTAINED H E R E IN ARE TH E EXCLUSIVE P R O P E R T Y O F ACTEL. THE INFORM ATION, DRAW INGS AND D ESIG N CO N C E PT S CONTAINED H ER EIN ARE C O N FID E N TIA L/PR O PR IE TA R Y , SHALL BE MAINTAINED IN STRICT CO N FID EN CE, AND SHALL NOT BE RELEA SED TO ANY THIRD P A R T t WITHOUT THE E X P R E SS

Contextual Info: DATA SHEET O K I A S I C P R O D U C T S MG113P/114P/115P/73P/74P/75P 0.25µm Sea of Gates and Customer Structured Arrays March 1998 MG113P/114P/115P/73P/74P/75P 0.25µm Sea of Gates and Customer Structured Arrays DESCRIPTION Oki’s 0.25µm Application-Specific Integrated Circuit ASIC products are available in both Sea Of Gates