357 AS 11 Search Results

2n3637

Contextual Info: 2N3634, 2N3634L, 2N3635, 2N3635L, 2N3636, 2N3636L, 2N3637, 2N3637L Low Power Transistors PNP Silicon http://onsemi.com Features COLLECTOR 3 • MIL−PRF−19500/357 Qualified • Available as JAN, JANTX, JANTXV and JANHC 2 BASE MAXIMUM RATINGS TA = 25°C unless otherwise noted

Contextual Info: HN58V256A Series HN58V257A Series 32768-word x 8-bit Electrically Erasable and Programmable CMOS ROM HITACHI ADE-203-357 A Z Rev. 1.0 Apr. 12, 1996 Description The Hitachi HN58V256A and HN58V257A are a electrically erasable and programmable EEPROM’s organized as 32768-word X 8-bit. Employing advanced MNOS memory technology and CMOS

Contextual Info: HN58V256A Series HN58V257A Series 32768-word x 8-bit Electrically Erasable and Programmable CMOS ROM HITACHI ADE-203-357 A Z Rev. 1.0 Apr. 12, 1996 Description The Hitachi HN58V256A and HN58V257A are a electrically erasable and programmable EEPROM 's organized as 32768-w ord x 8-bit, Em ploying advanced MNOS memory technology and CMOS

Contextual Info: TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Tiva TM4C1237D5PZ Microcontroller identical to LM4F132C4QC D ATA SHE E T D S -T M 4C 1237 D5 P Z - 1 4 6 0 2 . 2 6 4 8 S P M S 357 C o p yri g h t 2 0 07-2013 Te xa s In stru me n ts In co rporated Copyright

Contextual Info: Rugged Infrared Thermocouple 11° 5:1 Field of View Integral Air Cool/ Purge Head ߜ High Quality Infrared Thermocouple ߜ All Stainless Steel Construction ߜ 5:1 Field of View ߜ Built-in Air Purge ߜ J, K, E or T Thermocouple Output Signal ߜ Use With Standard Thermocouple

Contextual Info: V V V V The AHS series of connectors is intended for use as an indoor connector. Available in 59, 6, 7 and 11 series. • B rass c o n stru ctio n ca d m iu m plated w ith ch ro m a te coating • O n e piece co n stru ctio n • C o n n e c to r to cable retention m inim um o f 4 0 lbs.

bc 357 transistor pin diagram

Abstract: GS8150V36AB-300 GS8150V18AB-250 GS8150V18AB-300 GS8150V18AB-333 GS8150V18AB-357
Contextual Info: Product Preview GS8150V18/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: GS8150V18/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

S 357

Abstract: GS815018AB-250 GS815018AB-300 GS815018AB-333 GS815018AB-357
Contextual Info: Product Preview GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 2.5 V VDD HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: Product Preview GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

X24C04DMB

Abstract: X24C16DMB 5962-8751403 Xicor 5962-8852506 X24C16DM 5962-8852506 smd code marking yx 60395 xicor 5962-8959001PX X24C16D
Contextual Info: Military Program Overview Xicor Military Program Overview cost to the customer and to assure full compliance with the requirements of MIL-STD-883, Xicor will, on occasion, respond with waiver requests. Xicor must review and accept a customer source control drawing prior to

Contextual Info: Product Preview GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: Product Preview GS8150V18/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: Product Preview GS8150V18/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: Product Preview GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: Product Preview GS815018/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM Features 250 MHz – 357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O GS815018/36A support pipelined reads utilizing a rising-edgetriggered output register. They also utilize a Dual Cycle

Contextual Info: Product Preview GS8150V18/36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 1M x 18, 512K x 36 18Mb Register-Register Late Write SRAM Features 250 MHz – 357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O GS8150V18/36A support pipelined reads utilizing a risingedge-triggered output register. They also utilize a Dual Cycle

GS8150V36AB-300I

Abstract: GS8150V36AB-250I GS8150V36AGB-357 8150VXXA
Contextual Info: GS8150V36AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 1.8 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

Contextual Info: Spezifikation für Freigabe / specification for release Kunde / customer : Artikelnummer / part number : Bezeichnung : description : LF 7488910570 RoHS compliant SMD Antenne WE-MCA Chip-Antenna WE-MCA DATUM / DATE : 2004-10-11 A Mechanische Abmessungen / dimensions:

GS815036AB-300I

Abstract: GS815036AB-250I GS815036AGB-357 8150XXA
Contextual Info: GS815036AB-357/333/300/250 119-Bump BGA Commercial Temp Industrial Temp 512K x 36 18Mb Register-Register Late Write SRAM 250 MHz–357 MHz 2.5 V VDD 1.5 V or 1.8 V HSTL I/O Features Functional Description • Register-Register Late Write mode, Pipelined Read mode

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Abstract: 0 261 230 303
Contextual Info: Spezifikation für Freigabe / specification for release Kunde / customer : Artikelnummer / part number : Bezeichnung : description : LF 7488910520 RoHS compliant SMD Antenne WE-MCA Chip-Antenna WE-MCA DATUM / DATE : 2004-10-11 A Mechanische Abmessungen / dimensions:

Contextual Info: Product Number: 582-11-357-09-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 357-09-005 19 X 19

fr-4 laminate properties

Contextual Info: Product Number: 582-11-357-09-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 357-09-005