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    35 MICRO-X CERAMIC PACKAGE Search Results

    35 MICRO-X CERAMIC PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MD80C287-10/B
    Rochester Electronics LLC 80C287 - Microcontroller, CMOS PDF Buy
    MD80C31BH/B
    Rochester Electronics LLC 80C31BH - Microcontroller, 8-Bit PDF Buy
    LP87C51FC-1
    Rochester Electronics LLC 87C51FC - Microcontroller, 8-Bit PDF Buy
    LD87C51FC-1
    Rochester Electronics LLC 87C51 - 8-Bit CHMOS Microcontroller PDF Buy
    AP87C51FC20F8
    Rochester Electronics LLC 87C51FC - Microcontroller, 8-Bit PDF Buy

    35 MICRO-X CERAMIC PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Features 35 micro-X Package1 Cascadable 50 LI Gain Block • Low Operating Voltage 3.5 V typical Vd • 3 dB Bandwidth: DC to 0.9 GHz • High Gain: 19.0 dB typical at 0.5 GHz • Low Noise Figure: 2.8 dB typical at 0.5 GHz • Cost Effective Ceramic Microstrip Package


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    MSA-0635, H447564 MSA-0635 PDF

    A08 monolithic amplifier MMIC MAR-8

    Contextual Info: O MG A-64135 2-6 GHz Cascadable GaAs MMIC Amplifier avkntek Avantek 35 Micro-X Package Features • • • • Cascadable 50 Cl Gain Block Broadband Performance: 2-6 GHz 12.0 dB typical Gain ± 0.8 dB Gain Flatness 12.0 dBm Pi dB Single Supply Bias Cost Effective Ceramic M icrostrip Package


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    MGA-64135 310-37t-8717or31 0-37l-8478 A08 monolithic amplifier MMIC MAR-8 PDF

    SME2470-021

    Abstract: SMD2420 SMD2440-001 SME2470-001 SMD2420-001 SMD2440-011 lens photodiode phototransistor micro wave oven
    Contextual Info: Infrared Components Ceramic Discrete Surface Mount Emitters and Detectors FEATURES • Small package size • Glass lensed optics for efficient optical coupling • Upright or inverted mounting capability • Low profile, small size for flexible layout of multiple


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    006445-2-EN SME2470-021 SMD2420 SMD2440-001 SME2470-001 SMD2420-001 SMD2440-011 lens photodiode phototransistor micro wave oven PDF

    AME5170

    Contextual Info: AME Low Cost Micro Power Boost DC/DC Converter AME5170 n General Description The AME5170 is a fixed off-time step-up DC/DC converter in a small SOT-25/TSOT-25A package.The AME5170 is ideal for LCD panels requiring low current and high efficiency as well as LED application for cellular


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    AME5170 AME5170 OT-25/TSOT-25A 400ns 100Hz 50KHz 1231-DS5170-A PDF

    AME5170

    Abstract: AME5170AEEV AME5170AEEVADJY AME5170AEEVADJZ
    Contextual Info: AME Low Cost Micro Power Boost DC/DC Converter AME5170 n General Description The AME5170 is a fixed off-time step-up DC/DC converter in a small SOT-25 package. The AME5170 is ideal for LCD panels requiring low current and high efficiency as well as LED application for cellular phone backlighting,


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    AME5170 AME5170 OT-25 400ns 100Hz 50KHz 0374BSC 35BSC AME5170AEEV AME5170AEEVADJY AME5170AEEVADJZ PDF

    AME5170AAEEVADJZ

    Abstract: marking code l sot-25 step-up AME5170 AME5170A AME5170AAEEV 015BL
    Contextual Info: AME Low Cost Micro Power Boost DC/DC Converter AME5170A n General Description The AME5170A is a fixed off-time step-up DC/DC converter in a small SOT-25 package. The AME5170A is ideal for LCD panels requiring low current and high efficiency as well as LED application for cellular phone backlighting, PDAs, and other hand-held devices. The low


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    AME5170A AME5170A OT-25 400ns 100Hz 50KHz 0374BSC 35BSC AME5170AAEEVADJZ marking code l sot-25 step-up AME5170 AME5170AAEEV 015BL PDF

    Contextual Info: MICRO POWER SYSTEMS INC LIE D • bGT74M4 0G04b32 b47 ■ MPS MP7686 m CMOS 6-Bit High Speed Analog-to-Digital Converter Micro Power Systems • ESD Protection: 4000 Volts Minimum • Latch-Up Free • CDIP, PDIP & SOIC Packages Available FEATURES • •


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    bGT74M4 0G04b32 MP7686 MP7682) blIH7444 PDF

    amd athlon 64 socket 939

    Abstract: AM2 Processor Functional Data Sheet socket 939 DDR2 SDRAM sstl_18 socket 940 am2 pin 31117 Socket AM2 Processor Functional AM2 31117 AM2 processor socket AM2
    Contextual Info: AMD Athlon 64 FX Processor Product Data Sheet • Compatible with Existing 32-Bit Code Base Including support for SSE, SSE2, SSE3*, MMX™, 940-Pin Package Specific Features 3DNow!™ technology and legacy x86 instructions * • Refer to the AMD Functional Data Sheet,


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    32-Bit 940-Pin 940-pin AMD64 64-bit 48-bit 27-mm amd athlon 64 socket 939 AM2 Processor Functional Data Sheet socket 939 DDR2 SDRAM sstl_18 socket 940 am2 pin 31117 Socket AM2 Processor Functional AM2 31117 AM2 processor socket AM2 PDF

    Contextual Info: MP7686 CM OS 6-Bit High Speed Analog-to-Digital Converter m . Micro Power Systems • ESD Protection: 4000 Volts Minimum • Latch-Up Free • CDIP, PDIP & SOIC Packages Available FEATURES • • • • • • • • • Sampling Rates from 0.001 to 25 MHz MSPS


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    MP7686 MP7682) PDF

    ABM7

    Contextual Info: CERAMIC SMD MICRO MINIATURE MICROPROCESSOR CRYSTAL ABM7 Pb in Glass exempt per RoHS 2002/95/EC Annex (5 FEATURES: • Low in height (1.3 mm max.) • Ceramic package assures high reliability • Small size SMD, suitable for high density applications • Superior heat-resistant glass sealing


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    2002/95/EC 000pcs/reel ABM7 PDF

    ABM7

    Contextual Info: CERAMIC SMD MICRO MINIATURE MICROPROCESSOR CRYSTAL ABM7 Pb in Glass exempt per RoHS 2002/95/EC Annex (5 FEATURES: • Low in height (1.4 mm max.) • Ceramic package assures high reliability • Small size SMD, suitable for high density applications RoHS


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    2002/95/EC 1000pcs/reel 2000pcs/reel) ISO9001 ABM7 PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


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    PDF

    M512S32

    Contextual Info: M512S32 512K x 32 Fast SRAM Issue 3.1 December 2007 General Description Features The M512S32 is a hi-rel grade16Mbit fast Static RAM multichip module, that is normally organised as 512Kx32 bits wide , but can also be user configured as 1Mx16 or 2Mx8. Access times are available as 20,


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    M512S32 M512S32 grade16Mbit 512Kx32 1Mx16 16MBit 20/25/35ns. M512S32G-xxx M512S32GI-xxx M512S32GM-xxx PDF

    Contextual Info: PNP-1622-P22-G PNP-1622P22-GPlug-nplay Synthesizer module PLUG-N-PLAY WIDEBAND SYNTHESIZER Package: P22, 15.24mm x 15.24mm x 5.58mm Features     Internal Microcontroller Programmable START/STOP/Step Size SPI BUS Compatible Frequency: 2525MHz to


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    PNP-1622-P22-G PNP-1622P22-GPlug-nplay 2525MHz 2735MHz 10MHz. DS121109 PDF

    pid u 13t

    Contextual Info: AD V MICRO {MEMORY]- 0 e! 0257528 ADV MICRO A m DEj D2S7S2Ö DOESbHM MEMORY 89D 9 9 C 1 6 4 /A m 7 j~ 25634 D r T -4 6 -2 3 -1 0 9 9 C L 1 6 4 A m 9 @ C 1 6 5 /A m 9 9 C L 1 6 5 1 6 ,3 8 4 x 4 Static R /W Randoiïi-Access Memory PRELIMINARY > > 33 D ISTINCTIVE CHARACTERISTICS


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    Am99C165 22-pin 300-lnch Am99C164 AIS-WCP-10M-7/87-0 pid u 13t PDF

    Contextual Info: LP3983 www.ti.com SNVS213 – MAY 2004 LP3983 Micropower, Low Quiescent Current, CMOS Voltage Regulator in micro SMD Package Check for Samples: LP3983 FEATURES APPLICATIONS • • • • • • • • • • 1 2 Miniature 5 pin package Logic Controlled Enable


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    LP3983 SNVS213 LP3983 PDF

    PAL16L8 programming specifications

    Abstract: PAL16L8 PAL16R4 PAL16L8A PAL LOGIC READER pal16l8 25 PAL16R8A PAL16R4A-2
    Contextual Info: PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 D2705, FEBRUARY 1984 – REVISED MARCH 1992 • • • PAL16L8’ J OR W PACKAGE Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min


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    PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M SRPS016 D2705, PAL16L8 programming specifications PAL16L8 PAL16R4 PAL16L8A PAL LOGIC READER pal16l8 25 PAL16R8A PAL16R4A-2 PDF

    PAL16R4

    Abstract: Fuses PAL16L8 PAL16R8AMJB PAL16R8A PAL16L8A
    Contextual Info: PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 D2705, FEBRUARY 1984 – REVISED MARCH 1992 • • • PAL16L8’ J OR W PACKAGE Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min


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    PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M SRPS016 D2705, PAL16R4 Fuses PAL16L8 PAL16R8AMJB PAL16R8A PAL16L8A PDF

    smd transistor t1A

    Abstract: t1A transistor smd smd transistor t1A 55 smd diode t1a diode smd t1a transistor t1A CH-2540 250MHz
    Contextual Info: CC6F-T1A Inverted Mesa AT Crystal 30 MHz – 250 MHz DIMENSIONS Package: Recommended Solder Pad: 1,2 3,5 1,2 0,8 max. 0,70 2,5 2,2 0,8 1,5 100% leadfree, RoHS - compliant Miniature SMT ceramic package Package height 0.70 mm max. Fundamental mode frequencies


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    CH-2540 smd transistor t1A t1A transistor smd smd transistor t1A 55 smd diode t1a diode smd t1a transistor t1A 250MHz PDF

    Contextual Info: SDA-5000 SDA-5000 GaAs Distributed Amplifier Package: Die, 2.2mm x 1.45mm x 0.102mm RFMD’s SDA-5000 is a directly coupled DC GaAs microwave monolithic integrated circuit (MMIC) distributed driver amplifier designed to support a wide array of high frequency commercial, military, and space applications. They


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    SDA-5000 102mm SDA-5000 35GHz 17dBm 100mA DS140210 PDF

    t1A transistor smd

    Abstract: CH-2540
    Contextual Info: CC6F-T1A Inverted Mesa AT Crystal 30 MHz – 250 MHz DIMENSIONS Package: Recommended Solder Pad: 1,2 3,5 1,2 0,8 max. 0,70 2,5 2,2 0,8 1,5 100% leadfree, RoHS - compliant Miniature SMT ceramic package Package height 0.70 mm max. Fundamental mode frequencies


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    CH-2540 t1A transistor smd PDF

    t1A transistor smd

    Abstract: CH-2540
    Contextual Info: CC1F-T1A Inverted Mesa AT Crystal 30 MHz – 250 MHz DIMENSIONS Package: Recommended Solder Pad: 8,0 1,2 2,7 4,0 2,3 2,3 4,2 max.1,75 3,7 1,2 All dimensions in mm typical 100% leadfree, RoHS - compliant Small SMT ceramic package Package height 1.75 mm Fundamental mode frequencies


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    CH-2540 t1A transistor smd PDF

    303A16

    Abstract: INTEL 8049 IC 303A20 203a14
    Contextual Info: *C ICIS006* \^1 circuit Components inc. M i c r o 1000 Decoupling Capacitors Micro/Q 1000 ceramic capacitors are designed to fit under digital or analog dual in-line packages DIPs . They are ideal for use in computers/peripherals, work stations and office products, as well as in


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    ICIS006* 303A16 INTEL 8049 IC 303A20 203a14 PDF

    APTH012A0X

    Abstract: tdk c series APXH012 J-STD-033A APTH012A0X43-SRZ APTH012A0X3-SRZ
    Contextual Info: Data Sheet May 20, 2009 Micro TLynxTM: Non-Isolated DC-DC Power Modules: 2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current Features EZ-SEQUENCETM RoHS Compliant Applications ƒ Compliant to RoHS EU Directive 2002/95/EC Z versions ƒ Compatible in a Pb-free or SnPb reflow


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    63Vdc 2002/95/EC DS07-007 APTH012A0X tdk c series APXH012 J-STD-033A APTH012A0X43-SRZ APTH012A0X3-SRZ PDF