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    Others 33TS3022S-288B

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    Chip 1 Exchange 33TS3022S-288B 23
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    Conec Corporation 33TS3022-588B

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    CDM Electronics 33TS3022-588B
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    Conec Corporation 33TS3022-688B

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    CDM Electronics 33TS3022-688B
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    Conec Corporation 33TS3022S-01883F

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    CDM Electronics 33TS3022S-01883F
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    33TS3022 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Multi-Port PCB Jack Stacked, Low Profile,Shielded Materials Housing: Glass filled polyester UL94V-0 Black Contacts: 0.35mm thickness phosphor bronze, gold plating over nickel in contact area Tin plating over nickel in solder area Order S - 2


    Original     		UL94V-0 ---------------------------------33TS3022 33TS3022 PDF

    Contextual Info: Multi-Port PCB Jack Stacked, Shielded Materials Housing: Glass filled polyester UL94V-0 Black Contacts: 0.35mm thickness, gold plating over nickel in contact area Tin plating over nickel in solder area Order - 5


    Original     		UL94V-0 ---------------------------------33TS3022 TS3022 PDF

    Contextual Info: Multi-Port PCB Jack Stacked, Unshielded Materials Housing: Glass filled polyester UL94V-0 Black Contacts: 0.35mm thickness phosphor bronze, gold plating over nickel in contact area Tin plating over nickel in solder area Order - 3


    Original     		UL94V-0 ---------------------------------33TS3022 TS3022 PDF

    8713B

    Contextual Info: Multi-Port PCB Jack Stacked, Shielded Materials Housing: Glass filled polyester UL94V-0 Black Contacts: 0.35mm thickness, gold plating over nickel in contact area Tin plating over nickel in solder area Pin 8 12 A 59.19 87.13 B 58.92 86.86 C 57.59 85.53 D


    Original     		UL94V-0 ---------------------------------33TS3022 33TS3022 8713B PDF