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L77HDB44SOL2C309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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L77HDBH44SOL2RM8G
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, High Profile H=10.1mm, 44 Socket, Flash Gold, 4-40 Fixed Front Screwlock, Standoff 12.7mm (0.500\\), With Boardlock 3.2mm (0.126\\) |
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L77HDBH44SOL2RM5C309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Socket, 0.76m (30 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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L177HDB44SOL2
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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L77HDBG44SOL2RM5C309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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