32P3Y- H Search Results

32P3Y- H

Contextual Info: JEITA Package Code P-TSOP 2 32-10.16x20.95-1.27 RENESAS Code PTSB0032DA-A Previous Code 32P3Y-H MASS[Typ.] 0.5g c F 1 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 16 A *2 D L HE 17 *1 E 32 Reference

PTSB0032DA-B

Contextual Info: JEITA Package Code P-TSOP 2 32-10.16x20.95-1.27 RENESAS Code PTSB0032DA-B Previous Code 32P3Y-J MASS[Typ.] 0.5g c Index mark F E 16 *1 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. 32 17 A L HE

Contextual Info: 32P3Y-J Plastic 32pin 400mil TSOP EIAJ Package Code TSOPII 32-P-400-1.27 Weight(g) 0.53 JEDEC Code – Lead Material Alloy 42 e ME 16 Recommended Mount Pad E Symbol 32 17 A c L D L1 HE 1 I2 F b2 e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1 y ME I2 b2

Contextual Info: 32P3Y-H Plastic 32pin 400mil TSOP EIAJ Package Code TSOPII 32-P-400-1.27 Weight(g) 0.53 JEDEC Code – Lead Material Alloy 42 e b2 ME 17 Recommended Mount Pad E Symbol 1 16 A c L D L1 HE 32 I2 F e y b A2 A1 A A1 A2 b c D E e HE L L1 y Detail F ME I2 b2

Contextual Info: E HE 1 32 e EIAJ Package Code TSOPII 32-P-400-1.27 D JEDEC Code – y Weight g 0.53 b 16 17 F Lead Material Alloy 42 L1 32P3Y-H c A1 Detail F A2 A L ME b2 ME I2 b2 A A1 A2 b c D E e HE L L1 y Symbol Mar.’98 Dimension in Millimeters Min Nom Max – – 1.2

sram card 60 pin mitsubishi

Abstract: m5m51008c M5M5408
Contextual Info: L-41001-0E MITSUBISHI ELECTRIC Mitsubishi Low Power SRAM Technical Direction 256K 512K 1M 2M 4M 8M 16M Large Capacity Low Power SRAM High Speed Power down current 5.0V±0.5V : 55ns 256K : XL ver. 2µA max. 2.7V~3.6V : 85ns 70ns/55ns 1M : XL ver. 4µA max.

L24002

Abstract: NAND "read disturb" 1GB Toshiba 512 NAND MLC FLASH BGA PC133 registered reference design CMOS 0.8mm process cross Lithium battery CR2025 sony M2V28S30AVP M5M51008CFP
Contextual Info: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 MITSUBISHI ELECTRIC L-11002-01 CONTENTS General Business Operation Network and Production Facilities

sandisk micro sd card pin

Abstract: MCP 1Gb nand 512mb dram 130 256K x 16 DRAM FPM cross reference Toshiba NAND MLC FLASH BGA TSOP 48 Package nand memory toshiba MCP 1Gb 512Mb 130 PC133 registered reference design L7103 02bjxx ulsi
Contextual Info: Future On Chips MITSUBISHI SEMICONDUCTORS MITSUBISHI ELECTRIC CORPORATION ULSI Memory Memory Series Series ULSI RAM/MCP/FLASH New Data Package http://www.mitsubishichips.com Jul. 2000 L-11002-01 MITSUBISHI ELECTRIC CONTENTS 1. General 1 2. DRAM 9 3. Low Power SRAM