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    325X325 Search Results

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    325X325 Price and Stock

    LeaderTech

    LeaderTech 53-CBSA-3.25X3.25X0.5

    RF SHIELD 3.25" X 3.25" T/H
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 53-CBSA-3.25X3.25X0.5 Bulk 20
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    • 100 $18.37
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    LeaderTech 55-CBSA-3.25X3.25X0.5

    RF SHIELD 3.25" X 3.25" T/H
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 55-CBSA-3.25X3.25X0.5 Bulk 20
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    LeaderTech 57-CBSA-3.25X3.25X0.5

    RF SHIELD 3.25" X 3.25" T/H
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    LeaderTech 29-CBSA-3.25X3.25X0.2

    RF SHIELD 3.25" X 3.25" SMD T/H
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    DigiKey 29-CBSA-3.25X3.25X0.2 Bulk 20
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    • 100 $17.61
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    LeaderTech 86-CBSA-3.25X3.25X0.8

    RF SHIELD 3.25" X 3.25" T/H
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    DigiKey 86-CBSA-3.25X3.25X0.8 Bulk
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    325X325 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ELC-690-25

    Abstract: led chip
    Contextual Info: v 1.0 12.06.2013 ELC-690-25 Description ELC-690-25 is a AlGaAs based 325x325 µm bare LED chip die of double hetero structure in dual combination DDH with gold plated electrodes. It has a typical emission wavelength of 690 nm. . It is delivered on adhesive film with the wire bond side up.


    Original
    ELC-690-25 ELC-690-25 325x325 led chip PDF

    ELC-770-25

    Abstract: led chip
    Contextual Info: v 1.0 12.06.2013 ELC-770-25 Description ELC-770-25 is a GaAlAs based 325x325 µm bare LED chip die. It is of double hetero structure in dual combination DDH , and has a typical emission wavelength of 770 nm. It is delivered on adhesive film with the wire bond side up


    Original
    ELC-770-25 ELC-770-25 325x325 led chip PDF

    ELC-800-25

    Abstract: led chip
    Contextual Info: v 1.0 12.06.2013 ELC-800-25 Description ELC-800-25 is a GaAlAs based 325x325 µm bare LED chip die. It is of double hetero structure in dual combination DDH , and has a typical emission wavelength of 800 nm. It is delivered on adhesive film with the wire bond side up


    Original
    ELC-800-25 ELC-800-25 325x325 led chip PDF

    TB478

    Abstract: IPC-A610A
    Contextual Info: PCB Assembly Guidelines for Shell-Op 3D Package Technical Brief Introduction The Shell-Op 3D package is a cavity package that utilizes a glass lid and is attached to the board via a solder ball array. The glass lid allows the detector on the die surface to sense blue


    Original
    TB478 IPC-A610A PDF

    M/TNC-75

    Contextual Info: Cobham Antenna Systems Microwave Antennas Specialist Antenna Design and Manufacture CATALOGUE 2012 The most important thing we build is trust DEFENCE SECURITY ANTENNAS ANTENNAS SATELLITE COMMUNICATION ANTENNAS COMMERCIAL ANTENNAS Cobham Antenna Systems Microwave Antennas - Newmarket


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    Link16 M/TNC-75 PDF