32-PIN QFN PACKAGE POWER DISSIPATION FREESCALE Search Results

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

MC9S08SH8/4

Abstract: MC9S08QB8
Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

mc9s08sh

Abstract: MC9S08SH8
Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

98ASA00474D

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

FOOTPRINT MO-229 2X3 SOLDERING

Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
Contextual Info: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance

BD 4914

Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
Contextual Info: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.

MC9S08QB8

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

JESD51-8

Abstract: JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
Contextual Info: Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc. PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts solutions together in single packages to accomodate power and high voltages.

MC9S08SH8/4

Contextual Info: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See

Contextual Info: Freescale Semiconductor Technical Data Document Number: MC33882 Rev.9.0, 6/2012 Six Output Low Side Switch with SPI and Parallel Input Control 33882 The 33882 is a smart 6 output low side switch able to control system loads up to 1.0 A. The six outputs can be controlled via both serial

IPC-D-330

Abstract: JESD51-2
Contextual Info: Freescale Semiconductor Application Note AN3962 Rev. 1.0, 10/2009 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat

IPC-D-330

Abstract: AN3962 QFN PCB Layout guide JESD51-2 32-Pin QFN package power dissipation freescale pcb thermal Design guide pcb trace IEC-664 insulation distances JESD 51-2
Contextual Info: Freescale Semiconductor Application Note AN3962 Rev. 2.0, 8/2010 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08QE32 Rev. 7, 9/2011 An Energy Efficient Solution by Freescale MC9S08QE32 Series Covers: MC9S08QE32 and MC9S08QE16 Features • 8-Bit HCS08 Central Processor Unit CPU – Up to 50.33 MHz HCS08 CPU at 3.6 V to 2.4 V, 40 MHz CPU at 2.4

32-Pin QFN package power dissipation freescale

Abstract: PC3388
Contextual Info: Freescale Semiconductor Technical Data Document Number: MC33882 Rev. 8.0, 5/2012 Six Output Low Side Switch with SPI and Parallel Input Control 33882 The 33882 is a smart 6 output low side switch able to control system loads up to 1.0 A. The six outputs can be controlled via both serial

M27M6V

Abstract: ARMv6-M Architecture Reference Manual M27M5V
Contextual Info: Freescale Semiconductor, Inc. Data Sheet: Technical Data Document Number: KL27P64M48SF2 Rev. 5, 04/2015 Kinetis KL27 Microcontroller MKL27Z32Vxx4 R MKL27Z64Vxx4(R) 48 MHz ARM Cortex®-M0+ and 32/64 KB Flash The KL27 series is optimized for cost-sensitive and batterypowered applications requiring low-power USB connectivity. The

MC9S08QE16

Abstract: HC08 HCS08 MC9S08QE32 PWM generation using TPM module in HCS08 QE 98ARE10566D
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08QE32 Rev. 7, 9/2011 An Energy Efficient Solution by Freescale MC9S08QE32 Series Covers: MC9S08QE32 and MC9S08QE16 Features • 8-Bit HCS08 Central Processor Unit CPU – Up to 50.33 MHz HCS08 CPU at 3.6 V to 2.4 V, 40 MHz CPU at 2.4

Contextual Info: Freescale Semiconductor, Inc. Data Sheet: Technical Data Document Number: KL03P24M48SF0 Rev 4 08/2014 Kinetis KL03 32 KB Flash MKL03ZxxVFG4 MKL03ZxxVFK4 MKL03Z32CAF4R 48 MHz Cortex-M0+ Based Microcontroller Supports ultra low power 48 MHz devices with up to 32 KB

98ASA00602D1

Contextual Info: Freescale Semiconductor, Inc. Data Sheet: Technical Data Document Number: KL03P24M48SF0 Rev 3.1 07/2014 Kinetis KL03 32 KB Flash MKL03ZxxVFG4 MKL03ZxxVFK4 MKL03Z32CAF4R 48 MHz Cortex-M0+ Based Microcontroller Supports ultra low power 48 MHz devices with up to 32 KB

Contextual Info: Freescale Semiconductor Technical Data Document Number: MC33882 Rev. 10.0, 6/2013 Six Output Low Side Switch with SPI and Parallel Input Control 33882 The 33882 is a smart 6 output low side switch able to control system loads up to 1.0 A. The six outputs can be controlled via both serial

32-Pin QFN package power dissipation freescale

Abstract: 30-PIN 32-PIN MC33882 00XXX000
Contextual Info: Freescale Semiconductor Technical Data Document Number: MC33882 Rev. 7.0, 3/2011 Six Output Low Side Switch with SPI and Parallel Input Control 33882 The 33882 is a smart six output low side switch able to control system loads up to 1.0 A. The six outputs can be controlled via both