32 PIN Search Results

80 pin simm flash 32mb

Contextual Info: ADVANCE 2MB-32MB FLASH SIMM |V|IC=RON 80-PIN FLASH SIMM FLASH MODULE • JEDEC- and industry-standard pinout in an 80-pin single in-line memory module SIMM • 2MB (512K x 32), 4MB (1 Meg x 32), 8MB (2 Meg x 32), 16MB (4 Meg x 32), 32MB (8 Meg x 32) • Address access times:

PM7364

Abstract: PM7366 E1 frame
Contextual Info: PM7366/64 FREEDM-8/32 PRELIMINARY INFORMATION APPLICATIONS NOTE PMC-970957 ISSUE 1 FREEDM-32, FREEDM-8 PIN DIFFERENCES PM7364 & PM7366 PIN DIFFERENCES BETWEEN FREEDM-32 AND FREEDM-8 PRELIMINARY INFORMATION ISSUE 1: SEPTEMBER 1997 PMC-SIERRA 1-1 PM7366/64 FREEDM-8/32

4SP560M

Abstract: LQFP-32 NCP5314 NCP5314FTR2 NCP5314MNR2 NCP5355 VR10
Contextual Info: NCP5314 Two/Three/Four−Phase Buck CPU Controller MARKING DIAGRAMS 32 1 NCP5314 AWLYYWW 32 PIN QFN, 7 x 7 mm MN SUFFIX CASE 485J Bottom View NCP5314 AWLYYWW LQFP-32 FTB SUFFIX CASE 873A 32 1 A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week

2m x 32 SRAM SIMM

Abstract: CYM1821 CYM1831 CYM1836 CYM1841 CYM1861V33
Contextual Info: fax id: 2053 3 CYM1861V33 PRELIMINARY 2,048K x 32 3.3V Static RAM Module Features • High-density 3.3V 64-megabit SRAM module • 32-bit Standard Footprint supports densities from 16K x 32 through 2M x 32 • High-speed SRAMs — Access time of 20 ns • 72 pins

Contextual Info: fax id: 2048 ^C YPR ESS PRELIMINARY CYM1861 2,048K x 32 Static RAM Module Features • High-density 64-m egabit SRAM module • 32-bit Standard Footprint supports densities from 16K x 32 through 2M x 32 • High-speed SRAMs — Access tim e of 35 ns • 72 pins

ZL45

Abstract: CYM1821 CYM1831 CYM1836 CYM1841 CYM1861
Contextual Info: fax id: 2 0 4 8 ^C YPR ESS PRELIMINARY CYM1861 2,048K x 32 Static RAM Module Features • High-density 64-m egabit SRAM module • 32-bit Standard Footprint supports densities from 16K x 32 through 2M x 32 • High-speed SRAMs — Access tim e of 35 ns • 72 pins

Contextual Info: . 'w ir C YM 1836 128K x 32 Static RAM Module Features • High-density 4-megabit SRAM module • 32-bit standard footprint supports densities from 16K x 32 through 1M x 32 • High-speed CMOS SRAMs constructed from four 128K x 8 SRAMs in SOJ packages mounted_on_an epoxy laminate board with pins. Four chip se­

09 06 148 6901

Abstract: 09 06 148 2925 2901 09 06 132 6931 7901-09
Contextual Info: Data downloaded from http://www.angliac.com - the website of Anglia - tel: 01945 474747 DIN 41 612 • Type F Number of contacts 48, 32 Male connectors Male connector with angled solder pins 1 leading contact position z 32 2 leading contacts (positions b 2 + b 32)

30 pin simm memory

Abstract: 72 pin simm pinout simm 72 pin CYM1821 CYM1831 CYM1836 CYM1841 CYM1851 CYM1851V33 simm 72 pin flash
Contextual Info: fax id: 2052 CYPRESS PRELIMINARY CYM1851V33 1,024K x 32 3.3V Static RAM Module Features • High-density 3.3V 32-m egabit SRAM module • 32-bit Standard Footprint supports densities from 1 6 K x 32 through 1M x 32 • High-speed SRAMs — Access tim e of 12 ns

CYM1821

Abstract: CYM1831 CYM1836 CYM1841 CYM1851 CYM1851V33 simm 72 pin flash
Contextual Info: fax id: 2052 33 PRELIMINARY CYM1851V33 1,024K x 32 3.3V Static RAM Module Features • High-density 3.3V 32-megabit SRAM module • 32-bit Standard Footprint supports densities from 16K x 32 through 1M x 32 • High-speed SRAMs — Access time of 12 ns • Low active power

27C2000PC

Contextual Info: MX27C2000 2M-BIT [256K x8] CMOS EPROM FEATURES • 256Kx 8 organization • Operating current:30mA • Single +5V power supply • Standby current: 100uA • +12.5V programming voltage • Package type: - 32 pin ceramic DIP, plastic DIP - 32 pin SOP - 32 pin PLCC

MACH110

Abstract: MACH210 MACH215 PAL20RA10
Contextual Info: FINAL COM’L: -12/15/20 IND: -14/18/24 Lattice Semiconductor MACH215-12/15/20 High-Density EE CMOS Programmable Logic DISTINCTIVE CHARACTERISTICS • 44 Pins ■ 38 Inputs with pull-up resistors ■ 32 Output Macrocells ■ 32 Outputs ■ 32 Input Macrocells

Contextual Info: CY7C371i UltraLogic 32-Macrocell Flash CPLD Features signed to bring the ease of use and high performance of the 22V10, as well as PCI Local Bus Specification support, to high-density CPLDs. • • • • 32 macrocells in two logic blocks 32 I/O pins

FPT-32P-M24

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M24 Lead pitch 0.50mm Package width 8.0mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 32-pin plastic TSOP I (FPT-32P-M24) 32-pin plastic TSOP (I) (FPT-32P-M24)

microprocessor 80286 flag register

Abstract: 80286 microprocessor addressing modes 231630 8086 8086 microprocessor APPLICATIONS
Contextual Info: irrte1’ 386DX MICROPROCESSOR HIGH PERFORMANCE 32-BIT CHMOS MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT Flexible 32-Bit Microprocessor — 8, 16, 32-Bit Data Types — 8 General Purpose 32-Bit Registers Very Large Address Space — 4 Gigabyte Physical

A80960HD50

Abstract: 80960HA 80960HD 80960HT FC80960HD66 FC80960HD80 FC80960HT60 FC80960HT75 272495 FC80960HA25
Contextual Info: 80960HA/HD/HT 32-Bit High-Performance Superscalar Processor Data Sheet Advance Information Product Features • ■ ■ ■ ■ 32-Bit Parallel Architecture —Load/Store Architecture —Sixteen 32-Bit Global Registers —Sixteen 32-Bit Local Registers —1.28 Gbyte Internal Bandwidth

we 510

Contextual Info: UG216E3261GJG T 64M Bytes (16M x 32 ) DRAM 72Pin SIMM based on 16M X 1 General Description Features The UG216E3261GJG(T) is a 16,777,216 bits by 32 SIMM module.The UG216E3261GJG(T) is assembled using 32 pcs of 16Mx1 4K refresh DRAMs in SOJ Packages mounted on 72 Pin

"Piezo Buzzer" sbt

Abstract: IS22C040 IS22C040P IS22C040PI IS22C040X IS22C040XI issi 703
Contextual Info: ISSI IS22C040 32 to 40 SEC INSTANT VOICE ROM FEBRUARY 2000 FEATURES GENERAL DESCRIPTION • Voice length at – 8 KHz sampling is 32 seconds – 6 KHz sampling is 40 seconds • Silence compression to save memory • Eight trigger pins, S1 to S8 for 32 sections

Contextual Info: 256K, 512K x 32 DRAM SIMMs MICRON • IbCHNULUÜY. INC MT2D25632 X MT4D51232(X) DRAM MODULE FEATURES PIN ASSIGNMENT (Front View) • JEDEC- and industry-standard pinout in a 72-pin single in-line memory module (SIMM) • 1MB (256K x 32) and 2MB (512K x 32)

AS5C4008CW

Contextual Info: SRAM AS5C4008 Austin Semiconductor, Inc. 512K x 8 SRAM PIN ASSIGNMENT Top View SRAM MEMORY ARRAY AVAILABLE AS MILITARY SPECIFICATION 32-Pin DIP (CW), 32-Pin LCC (EC) 32-Pin SOJ (ECJ) • SMD 5962-95600 • SMD 5962-95613 • MIL STD-883 A18 A16 A14 A12 A7

Flash

Abstract: AS29F040
Contextual Info: FLASH AS29F040 512K x 8 FLASH PIN ASSIGNMENT Top View UNIFORM SECTOR 5.0V FLASH MEMORY 32-PIN Ceramic DIP (CW) 32-pin Flatpack (F) 32-pin Lead Formed Flatpack (DCG) AVAILABLE AS MILITARY SPECIFICATIONS A18 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2

Contextual Info: STI3216100-60T 72-PIN SIMMS 16M X 32 Bit DRAM SIMM with Fast Page Mode FEATURES GENERAL DESCRIPTION • The Simple Technology STI3216100-60T is a 16M x 32 bit Dynamic RAM high density memory module. The Simple Technology STI3216100-60T consists of 32 CMOS 16M x 1 bit

PAL22V16

Abstract: MACH110 MACH210 MACH215 PAL22V10
Contextual Info: FINAL COM’L: -12/15/20 IND: -14/18/24 MACH110-12/15/20 Lattice/Vantis High-Density EE CMOS Programmable Logic DISTINCTIVE CHARACTERISTICS • 44 Pins ■ 32 Outputs ■ 32 Macrocells ■ 32 Flip-flops; 2 clock choices ■ 12 ns tPD Commercial 14 ns tPD Industrial

Contextual Info: In te l MILITARY Intel386 HIGH PERFORMANCE 32-BIT MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT • Flexible 32-Bit Microprocessor — 8, 16, 32-Bit Data Types — 8 General Purpose 32-Bit Registers ■ Very Large Address Space — 4 Gigabyte Physical