304 QFP Search Results

Contextual Info: QUAD L-LEADED PACKAGE 304 PIN CERAMIC FPT-304C-C01 304-pin ceramic QFP Lead pitch 0.50mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Base ceramic material Alumina FPT-304C-C01 304-pin ceramic QFP (FPT-304C-C01) 3.80(.150) MAX

Contextual Info: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN CERAMIC FPT-304C-C01 304-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Alumina FPT-304C-C01 304-pin ceramic QFP

Contextual Info: QUAD L-LEADED PACKAGE 304 PIN CERAMIC FPT-304C-C02 Lead pitch 0.50mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50mm Base ceramic material Aluminum nitride 304-pin ceramic QFP FPT-304C-C02 304-pin ceramic QFP (FPT-304C-C02)

Contextual Info: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN CERAMIC To Top / Package Lineup / Package Index FPT-304C-C01 304-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

304 QFP

Abstract: a 304
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN PLASTIC FPT-304P-M02 304-pin plastic QFP Lead pitch 0.50 mm Package width x package length 40 × 40 mm Lead shape Gullwing Sealing method Plastic mold Thermal resistance Low thermal resistance type

7048A

Contextual Info: Pomona Model 7048A 304 Lead QFP Test Clip with PGA, 0.50mm Lead Pitch These new test clips provide the user with an easy means to connect instrumentation to the SMT leads of 304 pin plastic Quad Flatpack chips. This clip attaches to a surface mounted chip.

304-pin dimensions

Abstract: 304 QFP 304 pin ceramic
Contextual Info: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN CERAMIC To Top / Package Lineup / Package Index FPT-304C-C02 304-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic

Aluminum nitride QFP

Contextual Info: QUAD L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 304 PIN CERAMIC FPT-304C-C02 304-pin ceramic QFP Lead pitch 0.50 mm Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.50 mm Base ceramic material Aluminum nitride FPT-304C-C02

Q3-04

Contextual Info: 304 PIN PLASTIC QFP FINE PITCH (40x40) A B 228 229 153 152 detail of lead end S C D R Q 304 1 77 76 F G H I J M P K M N S NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. L S ITEM MILLIMETERS

QFP40

Abstract: P304GL-50-NMU JEDEC TRAY mQFP
Contextual Info: Mounting Pad Packing Name NEC Tray LA-A41A JEDEC Tray MQFP 40x40 3.7mm 304 pin QFP 40 × 40 Terminal Spacing Linear = 0.5 A B 228 229 153 152 detail of lead end S C D R Q 77 76 304 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of

Contextual Info: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite

Contextual Info: QFP Lead Straightener Use the Leader Tool to straighten bent fine pitch leads on Quad Flat Packs. Convenient and easy to straighten leads by hand with patented lead templates. Handles fine pitch components from 0.4mm to 1.0mm, up to 304 leads. Each set includes a laboratory grade AA granite

QFP JEDEC tray

Abstract: JEDEC TRAY QFP
Contextual Info: UNIT : mm HEAT PROOF 7 PPE 29.22 44.5 MQFP 40x40 3.7mm 135.9 77.46 A A' 50.56 31.1 44.5 252.8 315 322.6 SECTION A – A' 3.32 6.35 7.62 44.5 39.2 Applied Package Quantity pcs 304-pin Plastic QFP (Fine Pitch)(3.7mm thick) MAX. 12 Tray Material Heat Proof Temp.

XC5200

Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC2064

Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
Contextual Info: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP

A2 diode

Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
Contextual Info: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5

SOP48

Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
Contextual Info: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7

a04a

Contextual Info: UNIT : mm 335±1.0 304±0.5 16±0.1 18±0.5 15.5±0.5 16±0.1 A' 144±0.5 180±1.0 A 9.55 NEC LA - A04A - 1 HEAT PROOF 9.55 SECTION A–A' 9.55 5.8 6.4 8.8 6.7 Applied Package Quantity pcs 48-pin • Plastic QFP (Fine Pitch)(2.2mm thick) MAX. 200 Tray LA-A04A-1

304 MQFP

Abstract: MQ240 XC3030A
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC9572 VQ44

Abstract: XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A
Contextual Info: 44 64 68 84 100 120 132 144 156 160 164 175 24 176 191 196 208 223 225 228 240 256 299 304 352 411 432 475 559 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC VQFP PLASTIC LCC CERAMIC LCC PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC PQFP PLASTIC TQFP

XC2064

Abstract: XC2018 PC84 XC3030A XC3064 XC2018 XC3020 XC3020A XC3030 XC3042 XC3090
Contextual Info: 44 10 ◆ = New since last issue of XCELL 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

nd455

Abstract: NKK DATE code K 176 LE, K 561 LN LT 8521
Contextual Info: Little Dipper jm ^ N K K gffgKSiSSK N D 4 6 5 °- P S C Chapter 1. Overview ND4650-PSC Little Dipper is a one chip controller LSI designed for use with 64-bit RISC CPU R4600/R4650/ R4700. One single 304-pin QFP package contains most of function required for embedded system.

XC3042A PQ100

Abstract: WC68 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L wc84 XC3064L
Contextual Info: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC3030A

Abstract: XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA