300-PIN SR Search Results

1519B

Abstract: P4C1256 P4C1256L
Contextual Info: P4C1256 HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 300 mil Ceramic DIP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK

Contextual Info: P4C1256 HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 300 mil Ceramic DIP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK

P4C1256L

Contextual Info: P4C1256L LOW POWER 32K x 8 STATIC CMOS RAM FEATURES Common Data I/O Three-State Outputs Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Automatic Power Down Packages —28-Pin 600 mil DIP —28-Pin 300 mil CERDIP —28-Pin 300 mil Narrow Body SOP

GS8640V18

Abstract: GS8640V18T-200 GS8640V18T-250 GS8640V18T-300 GS8640V32 GS8640V36
Contextual Info: Product Preview GS8640V18/32/36T-300/250/200/167 300 MHz–167 MHz 1.8 V VDD 1.8 V I/O 4M x 18, 2M x 32, 2M x 36 72Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation

Contextual Info: Preliminary GS8640E18/32/36T-300/250/200/167 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 4M x 18, 2M x 32, 2M x 36 72Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

GS864036T-250

Abstract: GS864036 GS864018 GS864018T-167 GS864018T-200 GS864018T-250 GS864018T-300 GS864032
Contextual Info: Product Preview GS864018/32/36T-300/250/200/167 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 4M x 18, 2M x 32, 2M x 36 72Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

GS864032T

Abstract: GS864036GT-250 GS864036GT-167 PQ-32/MTS870
Contextual Info: Preliminary GS864018/32/36T-300/250/200/167 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 4M x 18, 2M x 32, 2M x 36 72Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline

GS8160Z18CT

Abstract: GS8160Z18CT-250 GS8160Z18CT-300 GS8160Z18CT-333 GS8160Z18c
Contextual Info: Preliminary GS8160Z18/36CT-333/300/250 100-Pin TQFP Commercial Temp Industrial Temp 18Mb Pipelined and Flow Through Synchronous NBT SRAM Features • NBT No Bus Turn Around functionality allows zero wait read-write-read bus utilization; Fully pin-compatible with

GS8160ZV18CT

Abstract: GS8160ZV18CT-250 GS8160ZV18CT-300 GS8160ZV18CT-333
Contextual Info: Preliminary GS8160ZV18/36CT-333/300/250 100-Pin TQFP Commercial Temp Industrial Temp 18Mb Pipelined and Flow Through Synchronous NBT SRAM Features • NBT No Bus Turn Around functionality allows zero wait read-write-read bus utilization; Fully pin-compatible with

Contextual Info: Preliminary GS8640Z18/36T-300/250/200/167 100-Pin TQFP Commercial Temp Industrial Temp 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 72Mb Pipelined and Flow Through Synchronous NBT SRAM Features Because it is a synchronous device, address, data inputs, and

Contextual Info: Product Preview GS8640Z18/36T-300/250/200/167 100-Pin TQFP Commercial Temp Industrial Temp 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 72Mb Pipelined and Flow Through Synchronous NBT SRAM Features Because it is a synchronous device, address, data inputs, and

GS8640Z36GT

Abstract: GS8640Z18T-250 GS8640Z18T-300 GS8640Z18T GS8640Z18T-167 GS8640Z18T-200
Contextual Info: Product Preview GS8640Z18/36T-300/250/200/167 100-Pin TQFP Commercial Temp Industrial Temp 300 MHz–167 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 72Mb Pipelined and Flow Through Synchronous NBT SRAM Features Because it is a synchronous device, address, data inputs, and

Contextual Info: GS880Z18/32/36CT-333/300/250/200/150 9Mb Pipelined and Flow Through Synchronous NBT SRAM 100-Pin TQFP Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait read-write-read bus utilization; Fully pin-compatible with

gs880z36bgt-200

Abstract: GS880Z36BGT
Contextual Info: GS880Z18/32/36BT-333/300/250/200/150 9Mb Pipelined and Flow Through Synchronous NBT SRAM 100-Pin TQFP Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait read-write-read bus utilization; Fully pin-compatible with

Contextual Info: Preliminary GS8160Z18/36AT-300/275/250/225/200 100-Pin TQFP Commercial Temp Industrial Temp 18Mb Pipelined and Flow Through Synchronous NBT SRAM 300 MHz–200 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O Features Functional Description • NBT No Bus Turn Around functionality allows zero wait

Contextual Info: GS880ZV18/36BT-333/300/250/200/150 9Mb Pipelined and Flow Through Synchronous NBT SRAM 100-Pin TQFP Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait read-write-read bus utilization; Fully pin-compatible with

Contextual Info: GS880Z18/36BT-333/300/250/200/150 9Mb Pipelined and Flow Through Synchronous NBT SRAM 100-Pin TQFP Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait read-write-read bus utilization; Fully pin-compatible with

GS880Z32C

Contextual Info: GS880Z18/32/36CT-333/300/250/200/150 9Mb Pipelined and Flow Through Synchronous NBT SRAM 100-Pin TQFP Commercial Temp Industrial Temp Features • NBT No Bus Turn Around functionality allows zero wait read-write-read bus utilization; Fully pin-compatible with

Memory

Abstract: FT61024
Contextual Info: FT61024 HIGH SPEED 128K x 8 DUAL CHIP ENABLE CMOS STATIC RAM FEATURES Advanced CMOS Technology Fast tOE Automatic Power Down Packages —32-Pin 300 mil DIP and SOJ —32-Pin 400 mil SOJ —32-Pin 600 mil Ceramic DIP —32-Pin 400 mil Ceramic DIP —32-Pin Solder Seal Flatpack

smd a17

Contextual Info: SRAM MT5C2561 Austin Semiconductor, Inc. 256K x 1 SRAM PIN ASSIGNMENT Top View AVAILABLE AS MILITARY SPECIFICATIONS • SMD 5962-88725 • SMD 5962-88544 • MIL-STD-883 24-Pin DIP (C) (300 MIL) 28-Pin LCC (EC) A8 A7 A6 Vcc A17 SRAM MEMORY ARRAY 3 2 1 28 27

Contextual Info: SRAM MT5C2561 Austin Semiconductor, Inc. 256K x 1 SRAM PIN ASSIGNMENT Top View AVAILABLE AS MILITARY SPECIFICATIONS • SMD 5962-88725 • SMD 5962-88544 • MIL-STD-883 24-Pin DIP (C) (300 MIL) 28-Pin LCC (EC) A8 A7 A6 Vcc A17 SRAM MEMORY ARRAY 3 2 1 28 27

AK62464

Abstract: AK62464Z
Contextual Info: Accutek Microcircuit Corporation AK62464Z 65,536 x 24 Bit CMOS/BiCMOS Static Random Access Memory DESCRIPTION 64-Pin ZIP The Accutek AK62464 SRAM Module consists of fast high performance SRAMs mounted on a low profile, 64 pin ZIP Board. The module utilizes six 28 pin 64K x 4 SRAMs in 300 mil SOJ packages

64K X 4 SRAM

Contextual Info: SRAM MT5C2564 Austin Semiconductor, Inc. 64K x 4 SRAM SRAM MEMORY ARRAY PIN ASSIGNMENT Top View AVAILABLE AS MILITARY SPECIFICATIONS • SMD 5962-88681 • SMD 5962-88545 • MIL-STD-883 24-Pin DIP (C) (300 MIL) A1 A0 NC Vcc NC 28-Pin LCC (EC) 3 2 1 28 27

Contextual Info: P4C1256 HIGH SPEED 32K x 8 STATIC CMOS RAM FEATURES Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages —28-Pin 300 mil DIP, SOJ, TSOP —28-Pin 600 mil Ceramic DIP —28-Pin CERPACK —28-Pin SOP —28-Pin LCC 350 mil x 550 mil