2N2 J 1600 Search Results
2N2 J 1600 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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D1U74T-W-1600-12-HB4AC | Murata Manufacturing Co Ltd | AC/DC 1600W, Titanium Efficiency, 74 MM , 12V, 12VSB, Inlet C20, Airflow Back to Front, RoHs | |||
10121510-160020ELF |
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HPCE R/A Receptacle 16P20S | |||
CE1600000110111 |
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Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole, 6 power pins, Zero signal pin, Vertical | |||
51742-10801600AALF |
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PwrBlade®, Power Supply Connectors, 8P 16S Vertical Receptacle. | |||
10129381-916004BLF |
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EconoStik™, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch. |
2N2 J 1600 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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mhl 3.0Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC INDUCTORS MHL MHI 1 2 3 4 5 Solder plating Diffusion barrier Silver metallisation Ceramic Electrodes IDENTIFICATION TYPE COATING COLOR MARKING MHL xx C Black MHL 1E K White None Polarity mark |
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Contextual Info: HIGH FREQUENCY CHIP INDUCTORS New miniature 0603 and 0805 size inductor chips feature monolithic ceramic construction allowing low cost manufacturing methods. The high-Q ceramic material exhibits self resonant frequencies up to 17 GHz. APPLICATIONS • CELL/PCS RF Modules |
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CTPR10
Abstract: 2n2 j 1600 1n5 j 1600
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D-25578 CTPR10 2n2 j 1600 1n5 j 1600 | |
3NH3430
Abstract: 1n8 0603 td 0402
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D-25578 3NH3430 1n8 0603 td 0402 | |
Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC INDUCTORS MHL MHI 1 2 3 4 5 Solder plating Diffusion barrier Silver metallisation Ceramic Electrodes IDENTIFICATION BODY COLOR INDUCTORS MHL 1E MHL 1J MHL 2A MARKING Brown White with one black stripe |
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D-25578 | |
Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC INDUCTORS MHL MHI 1 2 3 4 5 Solder plating Diffusion barrier Silver metallisation Ceramic Electrodes IDENTIFICATION BODY COLOR INDUCTORS MARKING Brown White with one black stripe White Products with Pb-free terminations |
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D-25578 | |
meggitt sigma inductor
Abstract: SMD INDUCTOR 47 smd code 33n smd marking code 12N SMD CODE MARKING 1E
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marking CODE 56
Abstract: meggitt sigma inductor SMD MARKING CODE 2A smd code 33n MARKING CODE nh
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CIH10T6N8
Abstract: CIH10T marking cih 2n2 j 1600 CIH05T
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100MHz 100MHz. 4291B 6192A 500MHz, 50MHz, CIH10T6N8 CIH10T marking cih 2n2 j 1600 CIH05T | |
Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC INDUCTORS MHL MHI 1 2 3 4 5 Solder plating Diffusion barrier Silver metallisation Ceramic Electrodes IDENTIFICATION TYPE COATING COLOR MARKING MHL Black None Old Part No. MHI 0805 C New Part No. |
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D-25578 | |
Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW MULTILAYER STRUCTURE CERAMIC INDUCTORS MHL MHI 1 2 3 4 5 Solder plating Diffusion barrier Silver metallisation Ceramic Electrodes IDENTIFICATION BODY COLOR INDUCTORS MARKING Brown White with one black stripe White Products with Pb-free terminations |
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D-25578 | |
Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin |
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10lectrodes | |
07C12
Abstract: CL1005 CL100505 L-14CR10 L-07C3N9 L-07C4N7 L-15C33N L-14CR22 SRF10-10
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TEMP00 MLI00-revB. 07C12 CL1005 CL100505 L-14CR10 L-07C3N9 L-07C4N7 L-15C33N L-14CR22 SRF10-10 | |
L-07C68N
Abstract: LQG10A1N2S00
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MLI00-revB. L-07C68N LQG10A1N2S00 | |
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Contextual Info: High Frequency Ceramic Chip Inductors Type 3680 Series Type 3680 Series Characteristics - Electrical 0402 Package The 3680 Series chip inductors are Tyco Electronics’ range of high frequency ceramic chip inductors. These have been developed as highly reliable and versatile chip inductors |
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L-14C33NContextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin |
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cih smd
Abstract: smd code cih 2N060 16089A
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100MHz 100MHz. 800MHz E4991A 6092A 500MHz, 50MHz, cih smd smd code cih 2N060 16089A | |
68njContextual Info: Inductors MULTILAYER CERAMIC INDUCTORS MHL STRUCTURE 1 2 3 4 5 Solder plating Diffusion barrier Silver metallisation Ceramic Electrodes IDENTIFICATION BODY COLOR MARKING MHL 1E Brown MHL 1J White with one black stripe None Products with Pb-free terminations |
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D-25578 68nj | |
Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature tin plated |
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Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature tin plated |
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L-05C10N
Abstract: L15C1 05C15 L-07C2N2ST L-05C3N3
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L-05C10NContextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin |
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0201age L-05C10N | |
L-14C6N8Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin |
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Contextual Info: Multi-Layer Ceramic Chip Inductors LCMC Series APPLICATIONS • High Frequency Applications: – Mobile Communications – WLAN – PHS – EMI Counter measure in High Frequency Circuits – Computer Communication FEATURES • For high frequency applications |
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