2FB 2 Search Results

2fa smd

Abstract: TO221 package AL203 PWR221T-30 series TO221 PWR220-2FB
Contextual Info: PL IA NT CO M *R oH S Features Models PWR220-2FB, PWR221-2FB, and PWR220-2FA are available but not recommended for new designs. • TO220 or TO221 housing ■ Low inductance Models PWR220T-35, PWR221T-30, and PWR263S-35 are suggested alternatives. ■ SMD and through hole versions

PWR221T-30

Abstract: TO221 package
Contextual Info: PL IA NT CO M *R oH S Features Models PWR220-2FB, PWR221-2FB, and PWR220-2FA are not available and not recommended for new designs. • TO220 or TO221 housing ■ Low inductance ■ SMD and through hole versions Models PWR220T-35, PWR221T-30, and PWR263S-35 are suggested alternatives.

Contextual Info: 6 Rev APPROVED: DATE:_ .614 [15.60] £ .079 [2 .00 ] .236 .437 [ 11 .10 ] Max .630 [16.00] .470 [11.95] Max 1 .020 X .020 [0.50 X 0.50] r HTTE .236 [6 .0 0 ].472 [1 2 .0 0 ]- .065 [1.65] \ .059 ;1.50] .098 [2.50] SPECIFICATIONS: Material: .059 [1.50] Insulator: Hi Temp Plactic, rated UL 94V— 0

Contextual Info: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See the Regulatory Information Appendix (RIA)

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Elevated, Solder Tail MP2 Series • Elevated connector for offset coplanar/end-to-end stacking • Ideal for low profile IU boxes • Ideal for “pizza box” applications • Ideal for hot swapping applications

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Stacking, Solder or Press-Fit Tail MP2 Series • • • • • • 16 mm to 18.5 mm high-profile stacking Pin counts up to 300 Footprint compatible with standard Futurebus+ Ideal for hot swapping applications

Contextual Info: 3M MetPak™ 2-FB Inverse Socket 2 mm 5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • Guiding alignment feature eliminates bent pins on backplane • Footprint compatible with standard Futurebus+ • Ideal for hot swapping • End-to-end stackable

1117 B

Abstract: 1117b TG30 TR30 3M MP2
Contextual Info: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force Molded guide fingers provide integrated alignment Alignment wafer for true position

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • • • • • • • • Three levels of early mate, late break EMLB sequencing or selective loading options Footprint compatible with standard Futurebus+ Solder tail with true-position wafer

Futurebus

Contextual Info: 3M MetPak™ 2-FB Power Header 2 mm 4/5 Row, Vertical, Press-Fit Tail MP2 Series • 6.50 Amps per contact • Early mate late break EMLB for hot swap or selective loading options • End-to-end stackable • Optional feed-through tail (Press-Fit) • Futurebus+ compatible

Contextual Info: 3M MetPak™ 2-FB Stacking Socket 2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail • • • • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force High-profile/high pin count Ideal for parallel stacking applications

Contextual Info: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force Molded guide fingers provide integrated alignment Alignment wafer for true position

Contextual Info: 3M MetPak™ 2-FB Power Header 2 mm 4/5 Row, Vertical, Press-Fit Tail MP2 Series • 6.50 Amps per contact • Early mate late break EMLB for hot swap or selective loading options • End-to-end stackable • Optional feed-through tail (Press-Fit) • Futurebus+ compatible

Contextual Info: 3M MetPak™ 2-FB Power Header 2 mm 4/5-Row, Vertical, Press-Fit Tail MP2 Series • 6.50 Amps per contact • Early mate late break EMLB for hot swap or selective loading options • End-to-end stackable • Optional feed-through tail (Press-Fit) • Futurebus+ compatible

Contextual Info: 3M MetPak™ 2-FB Header 2 mm 4/5 Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin MP2 Series Solder Tail • End-to-end stackable • Select load capability • Monoblockable • Shoulder Pin Press Fit • End-to-end stackable • Early mate late break for hot swapping press-fit

Contextual Info: 3M MetPak™ 2-FB Header 2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail, Shouldered Pin MP2 Series Solder Tail • End-to-end stackable • Select load capability • Monoblockable • Shoulder Pin Press Fit • End-to-end stackable • Early mate late break for hot swapping press-fit EMLB

Contextual Info: I M etal O x id e Fixed R es isto rs RSMFB Products marked 1/2 are L-linished type. D im e n s io n s m m M o rta l L I D im e n s io n s ( m m ) P a c k a g in g Type W W ±1 26 or 52 TR (reel type) TB (binding type) D im e n s io n s (m m ) D r t ± 0 .0 2

LTC1274

Abstract: LTC1274CS LTC1277 LT1220
Contextual Info: LTC1274/LTC1277 12-Bit, 10mW, 100ksps ADCs with 1µA Shutdown U DESCRIPTIO FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ ■ The LTC 1274/LTC1277 are 8µs sampling 12-bit A/D converters which draw only 2mA typ from single 5V or ±5V supplies. These easy-to-use devices come complete

12v stereo amplifiers

Abstract: transistor 1Bs AV2025 application of stereo amplifier
Contextual Info: @vic AV2025 STEREO AUDIO AMPLIFIER DESCRIPTION The AV2025 is a monolithic integrated circuit consisting of a 2 channel power amplifier. It is suitable for stereo and bridge amplifier application of radio cassette tape recorders. FEATURES Bridge or stereo configuration.

Contextual Info: 3M MetPak™ 2-FB Inverse Socket 2 mm 5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • Guiding alignment feature eliminates bent pins on backplane • Footprint compatible with standard Futurebus+ • Ideal for hot swapping • End-to-end stackable

Contextual Info: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See Regulatory Information Appendix (RIA)

MP2-SXXXG-51XX-XXXX

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Elevated, Solder Tail MP2 Series • Elevated connector for offset coplanar/end-to-end stacking • Ideal for low profile IU boxes • Ideal for "pizza box" applications • Ideal for hot swapping applications

Contextual Info: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Stacking, Solder or Press-Fit Tail MP2 Series • 16 mm to 18.5 mm high-profile stacking • Pin counts up to 300 • Footprint compatible with standard Futurebus+ • Ideal for hot swapping applications • End-to-end stackable

TS-1117-06

Abstract: TG30 TR30
Contextual Info: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • Molded guide fingers provide integrated alignment • Alignment wafer for true position