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10122864-418002LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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10122864-418002CLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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10122864-418002ALF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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SN74SSTUB32864NMJR
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Texas Instruments
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410-MHz, 25-bit configurable registered buffer with SSTL_18 inputs and outputs 96-NFBGA -40 to 85 |
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TPSM82864AA0SRDJR
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Texas Instruments
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2.4-V to 5.5-V Input, 4-A thin step-down power module with integrated inductor in 3.5-mm x 4-mm QFN 23-B0QFN -40 to 125 |
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