27N INDUCTOR Search Results

K1518

Abstract: K1113 33-4550
Contextual Info: Viking MULTILAYER CHIP INDUCTOR－CL Features －High frequency －High Q －High IDC －Cost effective Applications －High frequency circuits for portable telephones, PHS, Wireless communication, etc. Part Numbering CL 03 J T 27N 1 2 3 4 5  Inductance Tolerance

Contextual Info: AIR CORE INDUCTORS 空芯チップインダクタ（高Q/電流タイプ） Air-Core Chip Inductors High Q/High Current type •構造図 Construction 0402 W W L ② ● ● ● ● ● ● ● ● ● 移動体通信機器等の端末及び基地局の高周波回路及

Contextual Info: AIR CORE INDUCTORS 空芯チップインダクタ（高Q/電流タイプ） Air-Core Chip Inductors High Q/High Current type •構造図 Construction 0402 W W L ② ● ● ● ● ● ● ● ● ● 移動体通信機器等の端末及び基地局の高周波回路及

Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

R22-R27

Contextual Info: RF Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

1N5 diode

Abstract: EIA 01005 diode marking 47n marking code diode R12 L-07C10NJV6T marking L03
Contextual Info: RF Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

L-07C

Abstract: marking 1N3 1N5 diode L07C 2n2 j 100 L-07C10NJV6T
Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

2n2 j 100

Abstract: nh33 marking 68N KL73
Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM CHIP INDUCTOR KL73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Veer hole Direction mark Marking

L-07C

Abstract: marking code 33n 3n3 100
Contextual Info: RF ceRaMic chiP inDUcToRs High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance . These RF chip inductors are compact in size and feature lead-free tin

MARKING H9

Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM CHIP INDUCTOR KL73 STRUCTURE 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Veer hole Direction mark Marking

KQC0603TTE12NJ

Abstract: 27n INDUCTOR
Contextual Info: KQC high current inductor NEW features • • • • Low DC resistance and high allowable DC current Low profile style 0.027 inches 0.7mm typical Suitable for reflow soldering Marking: Black body color with no marking dimensions and construction L W inductors

L-07C68N

Abstract: LQG10A1N2S00
Contextual Info: High Frequency Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size 0402 - 0805 and

Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking

2n2 j 100

Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking

Cl201210-1N5D

Abstract: L-07C27N L-14C68N L-07CR10 L-07C4N7 CL1005 L-07C68N cl100505 L-14CR12 cl2012
Contextual Info: High Frequency Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size 0201 - 0805 and

Contextual Info: RF CERAMIC CHIP INDUCTORS High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin

Contextual Info: KQC high current inductor NEW features • • • • Low DC resistance and high allowable DC current Low profile style 0.027 inches 0.7mm typical Suitable for reflow soldering Marking: Black body color with no marking dimensions and construction L W inductors

07C12

Abstract: CL1005 CL100505 L-14CR10 L-07C3N9 L-07C4N7 L-15C33N L-14CR22 SRF10-10
Contextual Info: High Frequency Ceramic Chip Inductors High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size 0402 - 0805 and

Contextual Info: INDUCTORS TECHNOLOGY OF TOMORROW THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking

marking TB

Abstract: 8 tb 08 Marking code H6 TE 56 -ATC
Contextual Info: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE

Contextual Info: INDUCTORS THIN FILM STRUCTURE CHIP INDUCTOR KL73 1 2 3 4 5 6 7 8 9 10 Ceramic substrate Cross electrode Polymide insulated film Cu thin film coil pattern Epoxy protection film Ni barrier Solder plating Via hole Direction mark Marking IDENTIFICATION PRODUCT CODE

Contextual Info: HIGH FREQUENCY CHIP INDUCTORS New miniature 0603 and 0805 size inductor chips feature monolithic ceramic construction allowing low cost manufacturing methods. The high-Q ceramic material exhibits self resonant frequencies up to 17 GHz. APPLICATIONS • CELL/PCS RF Modules