272-PIN BGA DRAWING Search Results

of BGA Staggered pins

Abstract: of BGA Staggered Pins package C10943X
Contextual Info: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up

SF-BGA272B-B-11

Contextual Info: D Package Code: BGA272B C 25.4mm [1.000"] 1.27mm [0.050"] See BGA pattern code to the right for actual pattern layout Y X 25.4mm [1.000"] Top View reference only 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 1.27mm [0.050"]

nec 44 pin LQFP

Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
Contextual Info: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

Contextual Info: Top View 17.15mm [0.675"] J1-2 J3-37 J3-1 J3-38 J3-2 58.42mm [2.300"] 17.15mm [0.675"] 80.65mm [3.175"] J1-38 J1-1 J1-37 17.27mm [0.680"] Side View 3 2 1 1.321mm [0.052"] 5.959mm [0.235"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm

Contextual Info: 4 1 1 ECN NO. THE DRAWINGS AND INFORMATION CONTAINED HEREIN ARE THE EXCLUSIVE PROPERTY OF ACTEL. THE INFORMATION, DRAWINGS AND DESIGN CONCEPTS CONTAINED HEREIN ARE CONFIDENTIAL/PROPRIETARY, SHALL BE MAINTAINED IN STRICT CONFIDENCE, AND SHALL NOT BE RELEASED TO ANY THIRD PARTY WITHOUT THE EXPRESS

SF-BGA272A-B-32

Contextual Info: 1.44mm [0.056"] Top View Patent Pending Ordering Information: 1.44mm [0.056"] Solder Ball Alloy Part Number Suffix Sn63Pb37 Sn96.5Ag3.0Cu0.5 27.00mm [1.063"] -32 -32F* 1.27mm [0.050"] *RoHS Compliant 1.33mm [0.052"] 2.37mm [0.093"] 27.00mm [1.063"] Side View

pcb warpage in ipc standard

Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Contextual Info: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)

W-CSP footprint

Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
Contextual Info: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board

AIC23B

Abstract: TLV320AIC23B TLV320AIC23BIPW TLV320AIC23BIRHD TLV320AIC23BPW TLV320AIC23BRHD
Contextual Info: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,

AIC23B

Abstract: TLV320AIC23B TLV320AIC23BIPW TLV320AIC23BIRHD TLV320AIC23BPW TLV320AIC23BRHD
Contextual Info: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,

headphone-amplifier

Contextual Info: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8

116-Pin

Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
Contextual Info: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size

verilog code for UART with BIST capability

Abstract: VHDL CODE FOR HDLC controller ARM dual port SRAM compiler DesignWare SPI vhdl code for watchdog timer of ATM vhdl coding for analog to digital converter Sun Enterprise 250 static SRAM single-port verilog code for 16 bit risc processor verilog code arm processor
Contextual Info: GS30 0.15-µm CMOS Standard Cell/Gate Array Version 0.2 May 16, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the

verilog code for 32 bit risc processor

Abstract: vhdl code for usart 35x35 bga Sun Enterprise 250 Sun Ultra 30 DesignWare SPI 0.18 um CMOS free vhdl code download for usart NEC-V850 PZT driver design
Contextual Info: GS30TR 0.15-µm CMOS Standard Cell/Gate Array Version 1.0 September 23, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the

Contextual Info: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H Contents Section 1 2 3 Title Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

WM8311

Abstract: h11f9 121ball
Contextual Info: w WM8311 Processor Power Management Subsystem DESCRIPTION FEATURES WM8311 is an integrated power-management subsystem which provides a cost-effective, flexible, single-chip solution for power management, specifically targeted at the requirements of a range of low-power portable applications.

WM831x

Contextual Info: w WM8320 Processor Power Management Subsystem DESCRIPTION FEATURES WM8320 is an integrated power-management subsystem which provides a cost-effective, flexible, single-chip solution for power management, specifically targeted at the requirements of a range of low-power portable applications.

144 QFP body size

Abstract: 35x35 bga BGA and QFP Package vhdl code for usart DesignWare SPI 0.18-um CMOS technology characteristics ARM7 verilog code NEC-V850 PZT driver design vhdl coding for analog to digital converter
Contextual Info: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.0 April 6, 1999 Copyright  Texas Instruments Incorporated, 1999 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the

SLWS106H

Abstract: electret-microphone-capsule true bypass AIC23B TLV320AIC23B TLV320AIC23BIPW TLV320AIC23BIRHD TLV320AIC23BPW TLV320AIC23BRHD TI DSP 250 fs Mode Operation
Contextual Info: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H Contents Section 1 2 3 Title Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contextual Info: TLV320DAC23 Stereo Audio D/A Converter, 8Ć to 96ĆkHz With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLES001C IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,

Contextual Info: TLV320AIC23B Stereo Audio CODEC, 8Ć to 96ĆkHz, With Integrated Headphone Amplifier Data Manual February 2004 Digital Audio Products SLWS106H Contents Section 1 2 3 Title Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

synopsys Platform Architect

Abstract: clock tree balancing DesignWare SPI vhdl code for watchdog timer of ATM 0.18-um CMOS technology characteristics vhdl coding for analog to digital converter CML Vterm 27x27
Contextual Info: GS20 0.18-µm CMOS Standard Cell/Gate Array Version 1.1 May 19, 2000 Copyright  Texas Instruments Incorporated, 2000 The information and/or drawings set forth in this document and all rights in and to inventions disclosed herein and patents which might be granted thereon disclosing or employing the