256 BALL BGA Search Results

MACH4A

Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size

256-pin BGA

Abstract: 24 pin MATRIX led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)

led matrix circuits

Abstract: 256-pin Plastic BGA BGA-256P-M02
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)

256-pin BGA

Abstract: led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o V256.17x17 A A1 CORNER D 256 BALL PLASTIC BALL GRID ARRAY PACKAGE A1 CORNER I.D. INCHES SYMBOL E B TOP VIEW 0.15 MC A B 0.006 0.08 C 0.003 M b A1 CORNER D1 A1 CORNER I.D. 16 15 14 13 121110 9 8 7 6 5 4 3 2 1

BGA-256P-M02

Abstract: C1995 256-PIN
Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M02 Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004) Note: The actual shape of corners may differ from the dimension.

LQFP256

Abstract: ZL50017 ZL50017GAC ZL50017GAG2 ZL50017QCC
Contextual Info: ZL50017 1 K Digital Switch Data Sheet Features • November 2006 1024 channel x 1024 channel non-blocking digital Time Division Multiplex TDM switch at 4.096, 8.192 or 16.384 Mbps Ordering Information ZL50017GAC ZL50017QCC ZL50017QCG1 256 Ball PBGA 256 Lead LQFP

492-Ball

Abstract: BGA 328 PACKING TRAYS
Contextual Info: u Chapter 7 Trays Plastic Ball Grid Array: 256-Ball 19 mm x 19 mm BGT Notes: (See next page for detailed views) 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 140°C. Packages and Packing Publication

BGG256

Abstract: PK018 BG256
Contextual Info: R Plastic BGA BG256/BGG256 Package PK018 (v1.3) March 19, 2007 256-BALL PLASTIC BGA (BG256/BGG256) 2001, 2006, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

BGA256

Abstract: MS-034 BGA256 17 X 17 BGA-256 BGA256 17
Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L

D 2395

Abstract: BGA256 17 X 17 BGA256 MS-034
Contextual Info: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L

BGA256 17 X 17

Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17
Contextual Info: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape

FG256

Abstract: FGG256
Contextual Info: R PK033 v1.2.1 April 12, 2005 Fine-Pitch BGA (FG256/FGG256) Package 256-BALL FINE-PITCH BGA, 1.00MM PITCH (FG256/FGG256) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

FT256

Abstract: FTG256 PK053
Contextual Info: R Fine-Pitch Thin BGA FT256/FTG256 Package PK053 (v1.3) October 5, 2007 256-BALL FINE-PITCH THIN BGA, 1.00MM PITCH (FT256/FTG256) 2004, 2005, 2007 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

Contextual Info: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x

Contextual Info: Rev 1; 5/06 3.3V Single-Piece 256kb Nonvolatile SRAM with Clock The DS3030W consists of a static RAM, a nonvolatile NV controller, a year 2000-compliant real-time clock (RTC), and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

AM2 Processor Functional Data Sheet

Abstract: AM3 Processor Functional Data Sheet fire alarm transistor t18 FET DS1265W DS3065W DS3065W-100 TCO100
Contextual Info: Rev 2; 10/06 3.3V Single-Piece 8Mb Nonvolatile SRAM with Clock The DS3065W consists of a static RAM, a nonvolatile NV controller, a year 2000-compliant real-time clock (RTC), and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

DS1270W

Abstract: DS3070W DS3070W-100 automatica
Contextual Info: Rev 1; 10/06 3.3V Single-Piece 16Mb Nonvolatile SRAM with Clock The DS3070W consists of a static RAM, a nonvolatile NV controller, a year 2000-compliant real-time clock (RTC), and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

DS3070W

Contextual Info: Rev 0; 6/06 3.3V Single-Piece 16Mb Nonvolatile SRAM with Clock The DS3070W consists of a static RAM, a nonvolatile NV controller, a year 2000-compliant real-time clock (RTC), and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

Contextual Info: Rev 0; 4/05 3.3V Single-Piece 8Mb Nonvolatile SRAM with Clock The DS3065W consists of a static RAM, a nonvolatile NV controller, a year 2000-compliant real-time clock (RTC), and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

DS2045AB

Abstract: DS2045AB-100 DS2045AB-70 DS2045Y DS2045Y-100 DS2045Y-70 rechargeable battery
Contextual Info: Rev 2; 1/05 DS2045Y/AB Single-Piece 1Mb Nonvolatile SRAM Features The DS2045 is a 1Mb reflowable nonvolatile NV SRAM, which consists of a static RAM (SRAM), an NV controller, and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

DS2045AB

Abstract: DS2045AB-100 DS2045AB-70 DS2045Y DS2045Y-100 DS2045Y-70
Contextual Info: Rev 4; 10/06 DS2045Y/AB Single-Piece 1Mb Nonvolatile SRAM Features The DS2045 is a 1Mb reflowable nonvolatile NV SRAM, which consists of a static RAM (SRAM), an NV controller, and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

Contextual Info: Rev 1; 5/06 3.3V Single-Piece 8Mb Nonvolatile SRAM with Clock The DS3065W consists of a static RAM, a nonvolatile NV controller, a year 2000-compliant real-time clock (RTC), and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.

Contextual Info: Rev 1; 5/06 3.3V Single-Piece 1Mb Nonvolatile SRAM with Clock The DS3045W consists of a static RAM, a nonvolatile NV controller, a year 2000-compliant real-time clock (RTC), and an internal rechargeable manganese lithium (ML) battery. These components are encased in a surface-mount module with a 256-ball BGA footprint.