250PPMTCR Search Results

Contextual Info: Chip size 20 x 20 ±3 mil 0.5 x 0.5 ±0.768 mm Chip thickness 10+2 mil (0.25 +0.05 mm) Chip substrate material 99.6% alumina, 2-4p inch finish Resistor material Tantalum nitride, self-passivating Bonding pad size 4 x 6 mil (0.10 x 0.15 mm) min. Number of pads

Contextual Info: bcp semes T H IN -F IL M I The BCP series, single value, back contact resistor chips require only one wire bond save hybrid space and shorten hybrid assembly time. They are manufactured in the smallest chip size available. These chips are manufactured using state-of-the-art thin-film techniques, are 100%