240 PIN QFP ALTERA DIMENSION Search Results

Kostat tray

Abstract: Kostat PEAK TRAY QFP Shipping Trays KS-8201 Shipping Trays KS-8205 KS-8202 ks 870163 8201
Contextual Info: CUSTOMER ADVISORY ALTERNATE QFP SHIPPING TRAYS Altera is adding KOSTAT as an alternate supplier for existing PEAK QFP shipping trays. The new KOSTAT tray dimensions are comparable to the existing PEAK trays. Altera has evaluated and approved the new KOSTAT trays for mechanical integrity by

ND-1420-2

Abstract: QFP JEDEC tray 304-Pin 304 QFP
Contextual Info: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

QFP Shipping Trays

Abstract: ND-1420-2 QFP 100 pin QFP PACKAGE mass 64 leads qfp QFP JEDEC tray
Contextual Info: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

TO-220 JEDEC

Abstract: ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays
Contextual Info: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

QFP JEDEC tray

Abstract: ND-3232-3 ND-2828-3 304-pin dimensions
Contextual Info: QFP Carrier & Development Socket January 1998, ver. 12 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

QFP JEDEC tray

Contextual Info: QFP Carrier & Development Socket June 1996, ver. 10 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

removal tool from EPLD socket

Contextual Info: QFP Carrier & Development Socket M a rc h 1995, ver. 7 Features D ata S h ee t • ■ ■ ■ General Description Q uad flat pack QFP carriers protect fragile leads on Altera QFP devices during shipping and device handling. Development sockets allow on-board electrical and mechanical

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

MIL-I-8835A

Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
Contextual Info: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from

ASE QFP

Contextual Info: QFP Carrier & Development Socket Features • ■ ■ ■ ■ General Description Q u ad flat pack QFP carriers protect fragile leads on QFP devices d u rin g shipping and device handling. QFP developm ent sockets allow on-board electrical and m echanical

Yamaichi IC51-0804-808

Abstract: BGA and QFP Altera Package mounting QILE84P-410T IC51-2084-1052-11 Enplas fpq LCS-68 force fit standoffs BGA and QFP Package mounting IC51-0804-808 AUGAT SOCKET
Contextual Info: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board

LCS-68

Abstract: IC51-2084-1052-11 FPQ-240-0 821575-1 IC51-1004-809 44 pin TQFP Test Clip plcc socket 84 PLCC 3m bga169
Contextual Info: Selecting Sockets for Altera Devices June 1996, ver. 1 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board

PLCC 84 PINS

Abstract: camtex trays MIL-I-8835A
Contextual Info: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP

LCS-68

Abstract: 821575-1 LCS-84 1-382320-7 821574-1
Contextual Info: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board

d431000agw

Abstract: D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 5252 F 1002
Contextual Info: P o m o n a Electronics IC Test Clips Logic Scope Probe JEDEC PQFP Test Clips PomonaÕs JEDEC QFP test clips are designed to fit on surfacemounted plastic and ceramic JEDEC chips. Choose from four clip types specifically designed to give you optimum functionality and ease of use for testing, troubleshooting and

Contextual Info: QFP Carrier & Development Socket Ju n e 1996, ver. 10 Features D ata S h e e t • ■ ■ ■ ■ General Description Q u a d flat p ac k Q FP c a rrie rs p ro te c t frag ile le a d s o n Q F P d ev ice s d u rin g sh ip p in g a n d d ev ic e h a n d lin g .

100 PIN "PGA" ALTERA DIMENSION

Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

altera ep610

Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
Contextual Info: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.

TD 265 N 600 KOC

Abstract: core i5 520 Scans-049 camtex trays sii Product Catalog EPM9560 film hot BT 342 project TIL Display 7160S
Contextual Info: 1996 Data Book Data Book June 1996 A-DB-0696-01 Altera, MAX, M A X+PLUS, FLEX, FLEX 10K, FLEX 8000, FLEX 8000A, MAX 9000, MAX 7000, MAX 7000E, MAX 7000S, FLASHlogic, MAX 5000, Classic, M AX+PLUS II, PL-ASAP2, PLDshell Plus, FastTrack, AHDL, MPLD, Turbo Bit, BitBlaster, PENGN, RIPP 10, PLS-ES, ClockLock, ClockBoost,

Date Code Formats Altera EPF10K

Abstract: ep22v10 5962-9061102XA 5962-8854901xa 8686401LA 5962-8686401LA lift controller in vhdl ALTERA PART MARKING EPM7160 EPX780 transistor b2020
Contextual Info: Introduction Contents March 1995 Introduction The PLD Advantages of Altera

4572 IC 8PIN

Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
Contextual Info: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines

BC 1098

Abstract: EPM7384 ALTERA 68 PLCC t187
Contextual Info: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

EPM7256

Contextual Info: EPM7256 EPLD High-Performance 256-Macrocell Device Data Sheet September 1992, ver. 2 □ Features. High-density, erasable CMOS EPLD based on second-generation Multiple Array Matrix MAX architecture 5,000 usable gates Combinatorial speeds with tPD = 20 ns