24 LEAD Search Results

Contextual Info: M37O Axial Leaded Oval Lead Diameter: 400VDC T H .14/3.5 .24/6 .14/3.5 .24/6 .14/3.5 .24/6 .14/3.5 .24/6 .14/3.5 .24/6 .14/3.5 .24/6 .14/3.5 .24/6 .14/3.5 .26/6.5 .14/3.5 .26/6.5 .14/3.5 .26/6.5 .16/4 .28/7 .16/4 .30/7.5 .18/4.5 .31/8 .20/5 .35/9 .16/4 .30/7.5

h503

Abstract: NG 35 ASP12
Contextual Info: Page 20 DC fans with electronically commutated external rotor motor. Fully integrated commutation electronics. With electronic protection against reverse polarity, blocking and overloading. 42 24.7 16 16 19 19 28 28 35 38 24 24 24 24 24 24 24 24 24 18.28

radix-8 FFT

Abstract: DBGA KD 472 M mov CMAC A15B2 sc sf 12A H4 17ER CI23 honeywell hx3000 HX3000
Contextual Info: DSP Architectures RHDSP24 Radiation Hardened Scalable DSP Chip Transform Your WorldTM Data Sheet Real 24 PORT A Imag 24 RHDSP24 Imag 24 24 24 X INPU TB US Y INPUT BU S O U TP U TB US 24 48 Imag 24 Scheduler/ Controller X Y Memory A 24 Memory B 24 System Controls

Q64001

Abstract: FA24 TV-20 TV20
Contextual Info: FA 24 Field probe FA 24 The field probe FA 24 is suitable for measuring A C and DC fields semiconductor material InAs . FA 24 Hall voltage leads: blue tubing; control current leads: red tubing Wire length: 120 mm; tubing length: 100 mm. e le ctrical system

Contextual Info: MM37O Axial Leaded Oval Lead Diameter: .033/.8 .032/.8 1.5/38 1.77/45 ➝ ➝ .024/.6 ➝ .024/.6 ➝ d= .75/19 1.04/26.5 1.26/32 ➝ .55/14 ➝ .43/11 ➝ L= .032/.8 .032/8 .032/8 1000VDC H .24/6 .24/6 .24/6 .24/6 .24/6 .26/6.5 .28/7 .30/7.5 .30/7.5 .31/8

Contextual Info: Product Number: 550-90-599-24-125012 Description: PGA Header Solder Tail Pin Header Through Hole Plating Code: 90 Shell Plating: 200 " Tin/Lead 93/7 over 100 μ" Nickel 599-24-125 24 X 24 # Of Pins Mill-Max Part Number 599 550-90-599-24-125012

UT22VP10C-20PCX

Abstract: UT22VP10C-20UCX UT22VP10C-20WCX UT22VP10E-15PCX UT22VP10E-15UCX UT22VP10E-15WCX UT22VP10T-20PCX UT22VP10T-20UCX UT22VP10T-20WCX UT22VP10T-20UPC
Contextual Info: Device Part/SMD Number Optn Pins Pkg Flow Lead Rad 20ns/CMOS 24 DIP Mil-Temp Option None 20ns/CMOS 24 FP Mil-Temp Option None 20ns/CMOS 28 FP Mil-Temp Option None 15.5ns/CMOS 24 DIP Mil-Temp Option None 15.5ns/CMOS 24 FP Mil-Temp Option None 15.5ns/CMOS 28

atc 1117

Abstract: ATC 4400
Contextual Info: ATC 0 4 0 2 WL S ERI ES W I R E W O U N D CHIP I N D U C T O R S Inductor Selection G uide Inductance nH Tolerance C od e Q min. K J K.J 16 16 19 19 19 19 20 20 20 22 22 22 21 24 24 24 24 24 24 24 24 20 25 2.0 €> 250 (MHz) 2.2 4> 250 (MHz) h K. J K.J 3.6 4> 250 (MHz)

CM508

Abstract: CM508B
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS070B – Revised June 2003 The CD4508B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

cd4508be

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS070B – Revised June 2003 The CD4508B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS037B – Revised June 2003 The CD4034B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS070B – Revised June 2003 The CD4508B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

CD4034B

Abstract: MS-011 MTSS001C
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS037B – Revised June 2003 The CD4034B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

CM-508

Abstract: CM508
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS070B – Revised June 2003 The CD4508B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

MC14508

Abstract: CD4508B CD4508BD3 CD4508BE CD4508BF3A CD4508BM CD4508BM96 CD4508BM96E4 CD4508BME4 CD4508BNSR
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS070B – Revised June 2003 The CD4508B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

0624

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS037B – Revised June 2003 The CD4034B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS070B – Revised June 2003 The CD4508B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS037B – Revised June 2003 The CD4034B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

CM508

Abstract: CM-508
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS070B – Revised June 2003 The CD4508B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS037B – Revised June 2003 The CD4034B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

MC14508

Abstract: CD4508B MS-011
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS070B – Revised June 2003 The CD4508B types are supplied in 24-lead hermetic dual-in-line ceramic packages F3A suffix , 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96,

msc 1697

Abstract: el 198 Response AA0482 mz 1540 switching supply pcr 606 r hasp bb a Nippon capacitors TRANSISTOR MOTOROLA MAC 223 WL 431 DSP56300
Contextual Info: MOTOROLA Order this document by: DSP56302/D SEMICONDUCTOR TECHNICAL DATA DSP56302 Advance Information 24-BIT DIGITAL SIGNAL PROCESSOR 3 SCI Interface Program RAM 20480 x 24 or X Data Y Data Program RAM RAM RAM 19456 × 24 and × × 24 7168 24 7168 Instruction

FPT-24C-C04

Contextual Info: SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index FPT-24C-C04 24-pin ceramic SOP Lead pitch 30 mil Lead shape Straight Sealing method Cerdip FPT-24C-C04 24-pin ceramic SOP (FPT-24C-C04) 9.04±0.10

FPT-24P-M03

Contextual Info: SHRINK SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M03 24-pin plastic SSOP Lead pitch 0.65mm Lead shape Gullwing Sealing method Plastic mold FPT-24P-M03 * : These dimensions do not include resin protrusion. 24-pin plastic SSOP (FPT-24P-M03) +0.20