22MRQ08 Search Results

Contextual Info: 9_ I_ID I la 11 i 13 15 I 16 17 I 18 R ecom m ended P.C.B Layout 12.80 8-gQ .92±Q . 1 2.00 |T] NOTE: 0201 22MRQ08 □ □ 1BZA 1 1. Selective plating ’S1.—0 5 u ” Min. gold in c o n ta c t a r e a / 100 u" Min. Tin in solder area. ’S 2,—Gold flash in c o n ta ct a r e a /

Contextual Info: Recommended P.C.B Layout 12.80 8 —0O.92±O.1 2.00 m : Q2D1 22MRQ08 □ D 197LJ 1 2 1. No. of pins. 2. Selective plating ’S1,—05u" Min. gold in contact area/ 100u" Min. Tin in solder area. ’S2,—Gold flash in contact area/ 100u'’ Min. Tin in solder area.