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    TAIYO YUDEN EMJ325KB7226KMHP

    Multilayer Ceramic Capacitors MLCC - SMD/SMT 963-MCJCE32MLB7226KP RPLCMT PN 16V 22uF X7R 1210 AEC-Q200
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EMJ325KB7226KMHP 7,673
    • 1 $1.10
    • 10 $0.72
    • 100 $0.52
    • 1000 $0.39
    • 10000 $0.34
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    TAIYO YUDEN EMJ325KB7226MMHP

    Multilayer Ceramic Capacitors MLCC - SMD/SMT 963-MCJCE32MLB7226MP RPLCMT PN 16V 22uF X7R 1210 AEC-Q200
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics EMJ325KB7226MMHP
    • 1 $1.12
    • 10 $0.57
    • 100 $0.52
    • 1000 $0.41
    • 10000 $0.31
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    Seiko Epson Corporation SG3225VAN 322.265625M-KJGA3

    Standard Clock Oscillators SG3225VAN 322.265625M-KJGA3: XTAL OSC 2.5~3.3V 50PPM -40~85C 250 TR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics SG3225VAN 322.265625M-KJGA3
    • 1 -
    • 10 -
    • 100 -
    • 1000 $4.85
    • 10000 $4.85
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    Seiko Epson Corporation SG3225VAN 322.265625M-KJGA0

    Standard Clock Oscillators SG3225VAN 322.265625M-KJGA0: XTAL OSC 2.5~3.3V 50PPM -40~85C 1K TR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics SG3225VAN 322.265625M-KJGA0
    • 1 -
    • 10 -
    • 100 -
    • 1000 $2.01
    • 10000 $2.01
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    Seiko Epson Corporation SG3225VAN 322.265625M-KJGA6

    Standard Clock Oscillators SG3225VAN 322.265625M-KJGA6: XTAL OSC 2.5~3.3V 50PPM -40~85C 2K TR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics SG3225VAN 322.265625M-KJGA6
    • 1 -
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    • 10000 $1.95
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    226 25K Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: TA/TB/TG221-226 Series Triggered Spark Gaps Features • Tight main static breakdown voltage tolerance +10% - TA & TB series • Adjustable main static breakdown voltage (TG221 to TG226) • Rugged ceramic-metal construction • Refractory metal electrodes


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    TA/TB/TG221-226 TG221 TG226) PDF

    bluetooth advantages and disadvantages

    Abstract: japanese transistor manual substitution verilog code for speech recognition japanese transistor substitution 29LV160 29lv200 transister 117 29lv400 apex20k400 K52 Package
    Contextual Info: PF1084-05 S1C33 Family Data Sheets • S1C33 Family • S1C33000 Core • S1C33209 S1C33T01 S1C33L01 S1C33S01 S1C33221/222 S1C33240 S1C33210 S1C33205/225/226/245 S1C33L03 S1C33 Family Development Environment • S1C33 Family Middleware and Firmware


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    PF1084-05 S1C33 S1C33000 S1C33209 S1C33T01 S1C33L01 S1C33S01 S1C33221/222 S1C33240 bluetooth advantages and disadvantages japanese transistor manual substitution verilog code for speech recognition japanese transistor substitution 29LV160 29lv200 transister 117 29lv400 apex20k400 K52 Package PDF

    rohde Schwarz UPA3

    Abstract: rohde UPA3 c2570 transistor Symbol of c2570 transistor rohde UPA3 audio analyzer C5359 8902A SCR DE POTENCIA Digital Panel Meter PM 129 SOLARTRON 7150
    Contextual Info: VXI SIGNAL GENERATOR 3002 Operating Manual Document part no. 46892/226 Issue 8 8 July 2004 VXI SIGNAL GENERATOR 3002 9 kHz - 2.4 GHz This manual applies to instruments with software issues of 2.00 and higher.  Aeroflex International Ltd. 2004 No part of this document may be reproduced or transmitted in any form


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    exp04455 rohde Schwarz UPA3 rohde UPA3 c2570 transistor Symbol of c2570 transistor rohde UPA3 audio analyzer C5359 8902A SCR DE POTENCIA Digital Panel Meter PM 129 SOLARTRON 7150 PDF

    475 50K 536

    Abstract: E-96 Multiplier Code TR0603 226 25K 226 20K 340
    Contextual Info: Thin Film Chip Resistor—TR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (NiCr) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Epoxy) 4 Barrier Layer (Ni) 8 Marking ■ Application — Medical equipments, Military equipments


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    10ppm, 25ppm, 50ppm 475 50K 536 E-96 Multiplier Code TR0603 226 25K 226 20K 340 PDF

    CR0603

    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    CR0603

    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    CR0603

    Abstract: E-96 Multiplier Code
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    475 50K 030

    Abstract: CR0603 R010 R015 R020 R030 R040 R050 R065 E-96 Multiplier Code
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    fcr1206

    Abstract: E-96 Multiplier Code FCR2512 FCR0603
    Contextual Info: Fusible Thick Film Chip Resistor — FCR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy)


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    marking code E96

    Abstract: CR2030 E192
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    CR2010

    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    Chip Resistors EverOhms

    Abstract: sony tuners CR2512 106 25K 810 resistor
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    CR2030

    Abstract: E192 475 50K 536 226 25K
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    Reliabili25 CR2030 E192 475 50K 536 226 25K PDF

    CR1206

    Abstract: 226 20K 107
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    E192

    Abstract: CR1210
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    475 50K 536

    Abstract: marking code E96 sony tuners CR2030 E192
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    Reliabili25 475 50K 536 marking code E96 sony tuners CR2030 E192 PDF

    106 25K 810 resistor

    Abstract: CR2512 226 25K
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    E192

    Abstract: TR1210 25PPM nicr 8020
    Contextual Info: Thin Film Chip Resistor—TR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (NiCr) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Epoxy) 4 Barrier Layer (Ni) 8 Marking ■ Application — Medical equipments, Military equipments


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    10ppm, 25ppm, 50ppm E192 TR1210 25PPM nicr 8020 PDF

    25PPM

    Abstract: TR1218
    Contextual Info: Thin Film Chip Resistor—TR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (NiCr) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Epoxy) 4 Barrier Layer (Ni) 8 Marking ■ Application — Medical equipments, Military equipments


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    10ppm, 25ppm, 50ppm 25PPM TR1218 PDF

    rh 024c

    Abstract: 475 50K 249 024C
    Contextual Info: Thick Film Array Chip Resistor—CRA Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy)


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    CR2010

    Abstract: 475 50K 249
    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    CR1218

    Contextual Info: Thick Film Chip Resistor—CR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (RuO2) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Glass) 4 Barrier Layer (Ni) 8 Secondary Overcoat (Epoxy) ■ Application


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    TR0805

    Abstract: nicr 8020
    Contextual Info: Thin Film Chip Resistor—TR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (NiCr) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Epoxy) 4 Barrier Layer (Ni) 8 Marking ■ Application — Medical equipments, Military equipments


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    10ppm, 25ppm, 50ppm TR0805 nicr 8020 PDF