225UT Search Results
225UT Price and Stock
The Bergquist Company HF225UT-0.003-01-10/250Thermal Interface Products Un-Reinforced, Phase Change TIM, 0.003" Thickness, 10"x250' Roll |
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HF225UT-0.003-01-10/250 |
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Phoenix Contact 3044225 (UT)Terminal Block, Din, 35Mm, Grey; No. Of Positions:2Positions; Wire Size Awg Min:-; Wire Size Awg Max:14Awg; Conductor Area Csa:35Mm²; Wire Connection Method:Screw; Rated Current:125A; Rated Voltage:1Kv; No. Of Levels:1 Rohs Compliant: Yes |Phoenix Contact 3044225 |
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3044225 (UT) | Bulk | 1 |
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Phoenix Contact 3044225 (UT 35)MODULAR TERMINAL BLOCK SCREW CONNECTION WIDTH: 16 MM (GRAY) UT SERIES |
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3044225 (UT 35) | Bulk | 1,310 | 4 Weeks | 1 |
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Phoenix Contact 2907130 (ME 22 5 UT GN)ENCLOSURES, ME 22 5 UT GN ME SERIES |
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2907130 (ME 22 5 UT GN) | Bulk | 7 | 3 Weeks | 1 |
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Phoenix Contact 2908755 (ME 22 5 UT/FE BUS/10 GN)ENCLOSURES, ME 22.5 UT/FE BUS/10 GN |
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2908755 (ME 22 5 UT/FE BUS/10 GN) | Bulk | 2 | 3 Weeks | 1 |
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225UT Datasheets Context Search
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Contextual Info: Hi-Flow 225UT Un-Reinforced,Pressure Sensitive Phase Change Thermal Interface Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225U T PROPERTY Color • Thermal impedance: 0.08°C-in 2/W @25 psi • 55°C phase change composite with inherent tack characteristics |
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225UT D3418 | |
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Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE |
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TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
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