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    21627B Search Results

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    Panduit Corp

    Panduit Corp CA21627B01

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    21627B Datasheets Context Search

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    Contextual Info: TECHNOLOGY BACKGROUND &KLS6FDOH 3DFNDJLQJ IRU $0' ODVK 0HPRU\ 3URGXFWV 2 Chip-Scale Packaging Technology Background The AMD Fine-pitch Ball Grid Array FBGA) The FBGA package offers system designers a chip-scale package for Flash memories that provides a significant reduction in board real estate over TSOP packages and provides many


    Original     		Am29SL800 XXX-00-06/98 21627B PDF