2142 RAM MEMORY CHIP Search Results

C1B4

Abstract: C1B4 20 7c16615 CY7C164-15LC CY7C164-20DC CY7C164-20LC CY7C164 CY7C166 7c164-15 7C164
Contextual Info: CY7C164 CY7C166 CYPRESS SEMICONDUCTOR 16,384 x 4 Static R/W RAM on the four input/output pins I/Oo through I/O3 is written into the memory location specified on the address pins (Ao through A 13). Reading the device is accomplished by taking chip enable (CE) LOW (and OE LOW for

Contextual Info: FUJITSU MICROELECTRONICS DATA SHEET DS07-12615-3E 8-bit Microcontroller CMOS F2MC-8FX MB95110B Series MB95116B/F118BS/F118BW/FV100D-101 • DESCRIPTION The MB95110B series is general-purpose, single-chip microcontrollers. In addition to a compact instruction set,

Contextual Info: in tp l. 8XC51GB CHMOS SINGLE-CHIP 8-BIT MICROCONTROLLER Commercial/Express 87C51GB—8 Kbytes OTP/8 Kbytes Internal Program Memory 83C51GB—8 Kbytes Factory Programmable ROM 80C51GB—CPU with RAM and I/O 8XC51GB—3.5 MHz to 12 MHz +20% VCc 8XC51GB-1—3.5 MHz to 16 MHz ± 20% Vcc

A23 851 diode

Abstract: tcl 2127 CSTCE20M0V53-R0 voltage doubler using 555 timer voltage doubler using 555 timer circuit for ndr 550 voltage doubler using 555 timer circuit SP 1191 zf gear JTMP92CH21
Contextual Info: TOSHIBA Original CMOS 32-Bit Microcontroller TLCS-900/H1 Series TMP92CH21 Semiconductor Company TMP92CH21 CMOS 32-bit Microcontroller TMP92CH21FG/JTMP92CH21 1. Outline and Device Characteristics TMP92CH21 is high-speed advanced 32-bit Microcontroller developed for controlling equipment

1553 SUmmit

Abstract: 1553 VHDL 1553b VHDL horizon sensor RAM 2114 UT69R000 T 2109 200B 8008 registers 200E
Contextual Info: UTMC APPLICATION NOTE STEP-by-STEP Guide to 1553 Design Dave Stevenson, Field Applications Engineer, UTMC 719 -594-8238 September 3, 1996 1 Preface The purpose of this publication is to take a new 1553 designer through the basic steps required to complete a 1553

Contextual Info: FUJITSU SEMICONDUCTOR CONTROLLER MANUAL CM26-10113-2E F2MC-8FX 8-BIT MICROCONTROLLER MB95130/M Series HARDWARE MANUAL F2MC-8FX 8-BIT MICROCONTROLLER MB95130/M Series HARDWARE MANUAL Be sure to refer to the “Check Sheet” for the latest cautions on development.

free SMD Codebook

Abstract: SMD Codebook RWS 434 RF receiver TDA 1035 a I80386 RDD 17-33 LINEAR INTEGRATE circuit tda 1025 TDA 555 8259A simulator sad1 smd
Contextual Info: ICs for Communications DSP Oriented PBX Controller DOC PEB 20560 Version 2.1 Preliminary Data Sheet 11.97 / e .d s n / e r m o t e si duc . w n w o c w i / / : em p t ht S PEB 20560 Revision History: Current Version: Preliminary Data Sheet 11.97 Previous Version:

32176 Group PWM CODE

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Core8051

Abstract: U1AFS600-FG256 FlashPro3 flashpro3 schematic AES-128 FG256 PQ208 gaa 716 kt 501 PUSH PULL MOSFET DRIVER dip
Contextual Info: Preliminary v0.4 Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Features and Benefits • Targeted to Advanced Mezzanine Card AdvancedMC Designs • Designed in Partnership with MicroBlade • 8051-Based Module Management Controller (MMC)

transistor 1012

Abstract: inv06 2716 eprom manual programming by switch Hitachi FP-22
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

flashpro3 schematic

Abstract: TTL XOR2 LVCMOS15 kt 501
Contextual Info: 2 – Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and very low levels of abstraction. Fusion peripherals include hard analog IP

Contextual Info: IMPORTANT NOTICE Dear customer, As from June 1st, 2007 NXP Semiconductors has acquired the LH7xxx ARM Microcontrollers from Sharp Microelectronics. The following changes are applicable to the attached data sheet. In data sheets where the previous Sharp or Sharp Corporation references remain, please use the new

A3PE600L

Abstract: PAC10 A3P1000 A3PE3000L PQ208
Contextual Info: 2 – Military ProASIC3/EL DC and Switching Characteristics General Specifications Operating Conditions Stresses beyond those listed in Table 2-1 may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Datasheet AGLN020

Abstract: FG144 QN132 VQ100 IO45PDB1 AGL015
Contextual Info: v2.0 IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits • 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation • Bank-Selectable I/O Voltages—up to 4 Banks per Chip • Single-Ended I/O Standards: LVTTL, LVCMOS

A3PE600L

Abstract: A3PE3000L A3P1000 AES-128 FG144 FG484 PQ208 Bourns W 104
Contextual Info: v1.0 Military ProASIC3/EL Low-Power Flash FPGAs with Flash*Freeze Technology Advanced and Pro Professional I/Os†† Features and Benefits Military Temperature Tested and Qualified • Each Device Tested from –55°C to 125°C Firm-Error Immune •

RT3PE3000L

Abstract: LG484 RT3PE600L fpga radiation AES-128 CQ256 PAC10
Contextual Info: Advance v0.2 Radiation-Tolerant ProASIC3 Low-Power SpaceFlight Flash FPGAs with Flash*Freeze Technology Features and Benefits • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization MIL-STD-883 Class B Qualified Packaging

S12G48

Abstract: regulator 17-33 MC9S12G128 S12G64 S12GA96 S12GA128 9S12G128 S12GN48 S12GN16 0N51A
Contextual Info: MC9S12G Family Reference Manual S12 Microcontrollers MC9S12GRMV1 Rev.1.12 May 7, 2012 freescale.com To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information

RFC-5087

Abstract: TXC-06010AIBG TXC-06010-MB K4S283232E 0X0076 cesopsn TXC-06010
Contextual Info: PacketTrunk-4 Plus Device TDM-over-Packet Gateway Device TXC-06010 DATA SHEET PRELIMINARY TXC-06010- MB, Ed. 6 December 2009 FEATURES APPLICATIONS • Four T1/E1/Serial or one T3/E3 TDM interfaces • One 10/100 Ethernet IEEE 802.3 MAC interface via MII/RMII/SMII/SSMII;HDX or

semi catalog

Abstract: AGL015
Contextual Info: Revision 22 IGLOO Low Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • • • • • 1.2 V to 1.5 V Core Voltage Support for Low Power Supports Single-Voltage System Operation 5 µW Power Consumption in Flash*Freeze Mode

TAG 8446

Abstract: tag 8438 TAG 8426 TAG 8430 TXC-06920-MB TAG 8434 GMII VLAN Tag TSX 07 31 2428 error code cdb 400E structure of GMII packet with VLAN Tag
Contextual Info: TM Envoy-XE Device Metro Ethernet Switch TXC-06920 DATA SHEET PRELIMINARY TXC-06920-MB, Ed. 2 March 2006 FEATURES APPLICATIONS • IEEE 802.1Q compliant Ethernet switch supporting up to 8K Ethernet MAC addresses, 2K Active Network Tags VLANs, QTAG, MPLS or Martini and up to 2K

Contextual Info: TE X AS INS TRUM E NTS - ADVANCE INFO R MAT ION Tiva TM4C129XKCZAD Microcontroller D ATA SHE E T D S -T M 4C 129XK CZ A D- 1 5 6 3 8 . 2 7 11 S P M S 448 C o p yri g h t 2 0 07-2013 Te xa s In stru me n ts In co rporated Copyright Copyright © 2007-2013 Texas Instruments Incorporated. Tiva and TivaWare are trademarks of Texas Instruments Incorporated. ARM and Thumb are

cortex a15

Abstract: cortex a15 core ARM PROCESSOR CORTEX M-3 PQ208 A3PE3000L FG324 FG484 TDP 246
Contextual Info: v1.1 ProASIC3L Low-Power Flash FPGAs with Flash*Freeze Technology Features and Benefits Low Power • Dramatic Reduction in Dynamic and Static Power Savings • 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power • Low Power Consumption in Flash*Freeze Mode Allows for

schematic diagram UPS inverter three phase

Abstract: Quadrature Decoder Suits Rotary Encoders 3-Phase BLDC Motor Driver 150 rpm 30F6011A sensorless bldc c source code dspic sensorless bldc c source code PIC three phase bldc motor drive schematic hex code pwm based bidirectional dc motor speed control schematic diagram UPS inverter phase DS70046E
Contextual Info: dsPIC30F Family Reference Manual High-Performance Digital Signal Controllers 2006 Microchip Technology Inc. DS70046E Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet.

DM024

Abstract: oti 2168 CM17B transistor bf 175
Contextual Info: 5304804 LSI LOGIC □□mb7A LCA300K G ate Array 5 V olt Series P roducts D atabook Oct ober 1993 f 55b 5304604 0014b7T 4^2 * L L C Preface The LCA300K Gate Array Product Series Databook is written for logic and system designers who wish to use LSI Logic’s 0.6-micron gate