2064 RAM Search Results

Mini RJ21 connector

Abstract: Kester 182 EIA-364-23 EIA-364-65 EIA-364-23 connector rj21 cable connector EIA36423 G580-005 TIA EIA 568-B.1 CTLG580-011
Contextual Info: 501-587 Qualification Test Report 06Feb07 Rev A MRJ 21 Connector System 1. INTRODUCTION 1.1. Purpose Testing was performed on the Tyco Electronics MRJ 21 Connector System to determine its conformance to the requirements of Product Specification 108-2064 Revision B.

EIA-364-23

Abstract: EIA-364-9 EIA-364-65 EIA-364-23 connector EIA36423 EIA364-1000 EIA-364-17 EIA-364 36423 MRJ-21
Contextual Info: 108-2064 Product Specification 06Feb07 Rev B MRJ 21 Connector System 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the Tyco Electronics MRJ 21 Connector System. This system, comprised of a fully shielded board mounted receptacle and a

Contextual Info: !LattiC6 ispLSr and pLSI 2064 ' ; ; ; ; Semiconductor • ■ ■ ■ Corporation High Density Programmable Logic Features Functional Block Diagram • HIGH DENSITY PROGRAMMABLE LOGIC — — — — — 2000 PLD Gates 64 I/O Pins, Four Dedicated Inputs 64 Registers

ispLSI 2064-80LT

Contextual Info: Lattice ispLSI and pLSI 2064 ; " Semiconductor •■■Corporation High Density Programmable Logic Features Functional Block Diagram • HIGH DENSITY PROGRAMMABLE LOGIC — — — — — 2000 PLD Gates 64 I/O Pins, Four Dedicated Inputs 64 Registers High Speed Global Interconnect

DS2064

Abstract: DS2064S
Contextual Info: DS 2064 DALLAS DS2064 8K x 8 Static RAM SEMICONDUCTOR PIN ASSIGNMENT FEATURES • Low pow er C M OS design • S tandby current 50 nA max at tA = 25°C 100 nA max at tA = 25°C 1 nA max at tA = 60°C V Cc = 3.0V V Cc = 5.5V V q c = 5.5V □ V cc 27 □ WE

lsi2064

Abstract: 2064 ram ispLSI 2064-80LT
Contextual Info: Lattice ispLSI and pLSI 2064 ; " Semiconductor •■■Corporation High Density Programmable Logic Features Functional Block Diagram • HIGH DENSITY PROGRAMMABLE LOGIC — — — — — 2000 PLD Gates 64 I/O Pins, Four Dedicated Inputs 64 Registers High Speed Global Interconnect

LCA-MEK01

Abstract: 2064 ram
Contextual Info: Military CMOS Programmable Gate Array Logic Cell Array M 2064/M 2018 Conforms to MIL-STD-883, Class B* Ordering Information Benefits Features CM OS • Low power • T T L or CM OS input threshold levels PROGRAM ABLE • Programmable Logic functions • Programmable I/O blocks

XC 2064-33

Abstract: XC-2064-50 709-2000-06-84-11 M2064-33 XC2064-33 XC2064 709-2000-068 MDS21 XC-2064-1 XC-2064-33
Contextual Info: Logic C ell Array M 2064 Features/ Benefits Ordering Inform ation • CMOS programmable Logic Cell Array LCA’“ for replace­ ment of standard logic M2064-20 CNL • Completely reconfigurable by the user In the final system • High performance —20 MHz flip'flop toggle rate (-20 speed grade)

Static RAM 2064

Abstract: 2064 eprom
Contextual Info: D S 2064 DALLAS SEMICONDUCTOR DS2064 8K x 8 Static RAM FEATURES PIN ASSIGNMENT • Low power CM OS design • Standby current 50 nA m ax at 100 nA max at 1 nA m ax at tA = 25°C tA = 25°C tA = 60°C V Cc = 3.0V V Cc = 5.5V V c c = 5.5V Vcc □ WE 3 26 □

Contextual Info: DS 2064, DS2064S DALLAS SEMICONDUCTOR DS2064, DS2064S 8K x 8 3V Operation Static RAM FEATURES PIN ASSIGNMENT • Low power CMOS design • Standby current 50 nA max at t* = 25°C V cc = 3.0V 100 nA max at tA = 25°C V cc = 5.5V 1 pA max at t^ = 60°C V cc = 5.5V

2064 ram

Abstract: Static RAM 2064 HM3-2064U-5 HM 2064 9 STATIC RAM 16x8 ram 2064 A12C HM3-2064U5 hm3 2064 5
Contextual Info: MHS HM 2064 U AIATRA-HARRIS SEMICONDUCTOR 8K x 8 CMOS STATIC RAM M ilit i liUls? s?lL • ^ n n n n .n n ■ H E U M M M W Features • i DECEMBER 1985 ASYNCHRONOUS • OPERATING SUPPLY CURRENT : 60 mA max • ACCESS TIM E : 120 ns max • DATA RETENTION MODE : 2V, 50 /»A max

Contextual Info: DS 2064 DALLAS DS2064 8K x 8 Static RAM SEMICONDUCTOR PIN ASSIGNMENT FEATURES • Low pow er C M OS design • S tandby current 50 nA max at tA = 25°C 100 nA max at tA = 25°C 1 nA max at tA = 60°C V Cc = 3.0V V Cc = 5.5V V q c = 5.5V □ V cc 27 □ WE

Contextual Info: This document was generated on 04/30/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 87568-2064 Active Milli-Grid 2.00mm Pitch Milli-Grid™ Cable-to-Board Receptacle, Dual Row, IDT, Lead-Free, 20 Circuits, 0.76µm Gold Au Selective Plating, without Center Polarization Key and

2064 ram

Abstract: DS1259 DS1264
Contextual Info: DALLAS SEM IC ON DU CTOR CORP CHE D | S t m i 3 D 0002313 T | T-¥Z-90 fm Dallas Sem iconductor LCA S m a rtS o c k e t FEATURES D S 1264 DS1264 PIN DESCRIPTION • SmartSocket keeps logic defined in Xilinx/MMI LCA’s in the absence of power GND 9 • Accepts Xilinx/MMI 2064

AU2064

Abstract: AU1564 AU1564A AU2064A 92348 33708 1209-9
Contextual Info: AU1564/2064 DATA SHEET 6F-3 NO.7, LANE 75, TA-AN ROAD, SEC.1, TAIPEI, TAIWAN, R.O.C. 台北市大安路一段75巷7號6F-3 TEL:886-2-27818277 FAX:886-2-27815779 HTTP://WWW.APLUSINC.COM.TW AU Series ㆒般規格: AU1564, AU1564A, AU2064, AU2064A 乃㆒具有4-bit微處理器之單晶片語音合成

Contextual Info: Light Emitting Diodes 8 X 8 matrix displays LM-2064 Series T he LM -2 06 4 se rie s are 8 X 8 m a trix d isp la ys w h ich can be used in a w ide v a rie ty o f a p p lic a tio n s , in c lu d in g a l­ ►External dim ensions Unit: mm Single color type

Contextual Info: Lattice ispLSI and pLSI' 2064 Semiconductor •■■■ Corporation High Density Programmable Logic Features Functional Block Diagram • H IG H D E N S IT Y P R O G R A M M A B L E L O G IC — 2 0 0 0 P L D G a te s — 6 4 I/O P in s , F o u r D e d ic a te d In p u ts

ram 2064

Abstract: Static RAM 2064
Contextual Info: DS2064 DALLAS SEMICONDUCTOR FEATURES DS2064 8K x 8 Static RAM PIN ASSIGNMENT • Low power CM OS design • Standby current 50 nA max at tA = 25°C 100 nA max at tA = 25°C 1 max at tA = 60°C Vc c = 3.0V V qq = 5.5V Vc c = 5.5V • Full operation for V c c = 4.5V to 5.5V

srm2064

Abstract: CMOS128-03 74SC138
Contextual Info: In te g ra te d C irc u its In c o rp o ra te d 10301 W illo w s Road R edm ond, W A 98052 206 882-3100 TW X 910-443-2302 o I ¿ 0 -0 3 h o o V /M U b CMOS 128-03M ' . .J r X X . . . 128K CMOS STATIC RAM 16,384 WORD X 8 BIT Integrated Circuits incorporated

2064 ram

Contextual Info: DS2064 DALLAS s e m ic o n d u c to r FEATURES DS2064 8K x 8 Static RAM PIN ASSIGNMENT • Low power CM OS design • Standby current 50 nA max at tA = 25°C 100 nA max at tA = 25°C 1 max at tA = 60°C Vc c = 3.0V V qq = 5.5V Vc c = 5.5V • Full operation for V c c = 4.5V to 5.5V

Samsung S6B2086

Abstract: S6B2086 s6b20 2029 transistors S6B0086 S6B0755 SC47 SC50 SC38 S161 COG LCD
Contextual Info: S6B0086 65COM / 128 SEG DRIVER & CONTROLLER FOR STN LCD July 2001 Ver. 0.0 Contents in this document are subject to change without notice. No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, without the express written permission

SRM2064

Abstract: Static RAM 2064
Contextual Info: IK s l I In te gra te d C irc u its In co rp o ra te d 10301 W illo w s Road Redm ond, WA 98052 206 882-3100 TW X 910-443-2302 CMOS 8KX8-01 CMOS 8KX8-03 •/■ a ^ * i a ■ ■ 64K CMOS STATIC RAM g -JQ2 VVORD X 8 BIT a m FEATURES: □ Monolithic Design

TC5564

Abstract: 8KX8-01 srm2064 8KX8-03
Contextual Info: Iksi i CMOS 8KX8-01 CMOS 8KX8-03 ^ n a •■ 64K CMOS STATIC RAM g -J 02 VVORD X 8 BIT In tegrated C irc u its In co rp o ra te d 10301 W i I lo w s R o a d m R edm ond, WA 98052 206 882-3100 TW X 910-443-2302 - f c . - FEATURES: □ □ □ □ □ □

TC5564

Abstract: 2064 ram Static RAM 2064 8KX8-01 8KX8-03
Contextual Info: CMOS 8KX8-01 CMOS 8KX8-03 64K CMOS STATIC RAM 8,192 WORD X 8 BIT In tegrated C irc u its In c o rp o ra te d S c rs s 206 882-3100 TWX 910-443-2302 integrated circuits incorporated FEATURES: □ □ □ □ □ □ □ □ The CMOS 8KX8-0X series of CMOS S ta tic RAMs