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TPN12008QM
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Toshiba Electronic Devices & Storage Corporation
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MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance |
Datasheet
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20083EB0BD
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Amphenol Communications Solutions
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Elite Backplane connectors, DO 8pair, 12position, NiS |
PDF
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86837-458HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 9.65 mm (0.38 in.) Mating, 3.05 mm (0.12 in.) Tail. |
PDF
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86093968813745V1LF
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Amphenol Communications Solutions
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Din Headers and Receptacles, Backplane connectors, Right Angle Receptacle Solder-to-Board Style R 96 ways, Class III, Tail Length: 3mm |
PDF
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86093488613745E1LF
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Amphenol Communications Solutions
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DIN Right Angle Receptacle Solder-to-Board Style R/2 48 ways, Class III, Tail Length: 3mm |
PDF
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