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TPN12008QM
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Toshiba Electronic Devices & Storage Corporation
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MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance |
Datasheet
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20083EB0BD
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Amphenol Communications Solutions
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Elite Backplane connectors, DO 8pair, 12position, NiS |
PDF
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67998-142HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail |
PDF
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67998-146HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail |
PDF
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67998-144HLF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail |
PDF
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