|
TPN12008QM
|
|
Toshiba Electronic Devices & Storage Corporation
|
MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance |
Datasheet
|
|
|
20083EB0BD
|
|
Amphenol Communications Solutions
|
Elite Backplane connectors, DO 8pair, 12position, NiS |
PDF
|
|
|
67997-168HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in) Pitch |
PDF
|
|
|
68697-168HLF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 68 Positions, 2.54mm (0.100in)Pitch. |
PDF
|
|
|
67997-162HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch |
PDF
|
|
