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TPN12008QM
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Toshiba Electronic Devices & Storage Corporation
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MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance |
Datasheet
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20083EB0BD
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Amphenol Communications Solutions
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Elite Backplane connectors, DO 8pair, 12position, NiS |
PDF
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54242-105220950LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 22 Positions, 2.54mm (0.100in) Pitch. |
PDF
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10127819-10522LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Black Color, 10 Positions, LCP, Non GW Compatible, Tray Packing. |
PDF
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54122-105220850LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 22 position, 2.54mm (0.100in) pitch |
PDF
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