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TPN12008QM
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Toshiba Electronic Devices & Storage Corporation
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MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance |
Datasheet
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20083EB0BD
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Amphenol Communications Solutions
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Elite Backplane connectors, DO 8pair, 12position, NiS |
PDF
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77317-103-30LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 30 Positions ,2.54mm (0.100in) Pitch, |
PDF
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76745-103-30LF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch. |
PDF
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54111-103300800LF
|
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch. |
PDF
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