20-LEAD PLASTIC SOL Search Results

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS286A October 2003 The CD74AC623 is supplied in 20-lead dual-in-line plastic packages E suffix and in 20-lead small-outline packages (M, M96, and NSR suffixes). The CD74ACT623 is supplied in 20-lead small-outline

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS286A − October 2003 The CD74AC623 is supplied in 20-lead dual-in-line plastic packages E suffix and in 20-lead small-outline packages (M, M96, and NSR suffixes). The CD74ACT623 is supplied in 20-lead small-outline

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS286A − October 2003 The CD74AC623 is supplied in 20-lead dual-in-line plastic packages E suffix and in 20-lead small-outline packages (M, M96, and NSR suffixes). The CD74ACT623 is supplied in 20-lead small-outline

CD54AC623

Abstract: CD74AC623 CD74ACT623
Contextual Info: Data sheet acquired from Harris Semiconductor SCHS286A − October 2003 The CD74AC623 is supplied in 20-lead dual-in-line plastic packages E suffix and in 20-lead small-outline packages (M, M96, and NSR suffixes). The CD74ACT623 is supplied in 20-lead small-outline

Contextual Info: Data sheet acquired from Harris Semiconductor SCHS286A − October 2003 The CD74AC623 is supplied in 20-lead dual-in-line plastic packages E suffix and in 20-lead small-outline packages (M, M96, and NSR suffixes). The CD74ACT623 is supplied in 20-lead small-outline

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L20.4.0x5.5 20 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 5, 3/15 0.10 10X 0.50 2.10 4.00 0.300 A 0.66 R0.0750 0.30 B 11 4 20 10 X 0.50 2X1.30 5.50 R0.0750 2.20 PIN #1 INDEX AREA 6 0.10 10 2X

Contextual Info: HV202 HV203 Supertex inc. M Low Charge Injection 8-Channel High Voltage Analog Switch Ordering Information_ < z z TJ T I < Package Options 20-pin plastic DIP 28-lead plastic chip carrier 48-lead TQFP Die In waffle pack 200V

Contextual Info: Plastic Packages for Integrated Circuits Shrink Small Outline Plastic Packages SSOP Quarter Size Outline Plastic Packages (QSOP) N INDEX AREA H 0.25(0.010) M 2 GAUGE PLANE INCHES SYMBOL 3 0.25 0.010 SEATING PLANE -A- 20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE

M2015-20

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M20.15 20 LEAD QUARTER SIZE OUTLINE PLASTIC PACKAGE QSOP Rev 2, 1/11 20 INDEX AREA 1 2 0.244 (6.19) 0.157 (3.98) 0.228 (5.80) 0.150 (3.81) 4 3 GAUGE PLANE TOP VIEW 6 0.050 (1.27) 0.25 0.010

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing L20.4.0x5.5 20 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 1, 2/07 2.10 5.50±0.05 A 0.50 BSC 0.30 B 0.30 0.66 10X 0.50 1.30 PIN 1 INDEX AREA 2.20 4.00±0.05 0.25 10X 0.25 PIN 1 INDEX AREA 4.50 REF.

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing M20.3 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE SOIC Rev 3, 2/11 20 INDEX AREA 7.60 7.40 1 2 10.65 10.00 0.25 (0.10) M B M 3 3 TOP VIEW 13.00 12.60 SEATING PLANE 2 2.65 2.35 5 0.75 1.27

MO-153-AC

Abstract: m2017
Contextual Info: Plastic Packages for Integrated Circuits Thin Shrink Small Outline Plastic Packages TSSOP M20.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 20 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE B M SYMBOL 3 L 0.05(0.002) -A- SEATING PLANE A D

MO-150-AE

Abstract: jedec MO-150 ansi y14.5m-1982
Contextual Info: Plastic Packages for Integrated Circuits Shrink Small Outline Plastic Packages SSOP M20.209 (JEDEC MO-150-AE ISSUE B) N 20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 0.25 0.010 SEATING PLANE -A- SYMBOL GAUGE

AT224-3

Abstract: TC16-1TG2
Contextual Info: Surface Mount RF Transformer 50Ω TC16-1TG2+ 20 to 300 MHz Maximum Ratings Operating Temperature Storage Temperature RF Power DC Current Features • suitable for tin/lead and RoHS solder systems • plastic base with leads • aqueous washable -20°C to 85°C

RPE117-z5u

Abstract: "logarithmic amplifier" rpe113 "2 khz square wave" RPE117 fm modulation application circuit RPE11 FULL WAVE RECTIFIER and waveforms Full wave rectifier datasheet photomultiplier
Contextual Info: PIN CONFIGURATIONS 20-Lead Plastic DIP N 20-Lead Cerdip (Q) –INPUT 1 20 +INPUT ATN LO 2 19 ATN OUT ATN COM 3 18 CKT COM ATN COM 4 ATN IN 5 TOP VIEW 15 RG2 (Not to Scale) 14 LOG OUT –VS 7 ITC 8 13 LOG COM BL2 9 12 +VS –OUTPUT 10 The AD641 is not a logarithmic building block, but rather a

rpe113

Abstract: 5962-9559801MRA AD641 AD641A AD641AN AD641AP AD641S AD846 P-20A Bl16
Contextual Info: PIN CONFIGURATIONS 20-Lead Plastic DIP N 20-Lead Cerdip (Q) –INPUT 1 20 +INPUT ATN LO 2 19 ATN OUT ATN COM 3 18 CKT COM ATN COM 4 ATN IN 5 TOP VIEW 15 RG2 (Not to Scale) 14 LOG OUT –VS 7 ITC 8 13 LOG COM BL2 9 12 +VS –OUTPUT 10 The AD641 is not a logarithmic building block, but rather a

EIGHT MOSFET ARRAY

Abstract: EIGHT n-channel MOSFET ARRAY
Contextual Info: A N 04 inc. G a te P ro te cte d Preliminary 8 Channel MOSFET Array Monolithic N-Channel Enchancement Mode Ordering Information Order Number / Package BVdss/ ^DS ON (min) 160V (max) 350n 200V 300V Plastic SOW-20* Diet — 18-Lead Plastic DIP AN0416NA AN0416WG

MS-013-AC

Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M

Contextual Info: P2000A . P2000M Type Axial Lead Diode Standard silicon rectifier diodes Forward Current: 20 A Reverse Voltage: 50 to 1000 V P2000A . P2000M Features • Max. solder temperature: 260°C • Plastic material has UL classification 94V-0 Typical Applications*

OP42

Abstract: TL072 AD712 LT1057 MC34082 OP215 OP249 pm7545 c3999
Contextual Info: a Dual, Precision JFET High-Speed Operational Amplifier OP249 PIN CONNECTIONS +IN A 3 A B – + + – 4 V– 8 V+ 7 OUT B 2 1 20 19 NC 3 V+ NC OUT A 1 –IN A 2 NC 20-Terminal LCC RC Suffix 8-Lead Cerdip (Z Suffix), 8-Lead Plastic Mini-DIP (P Suffix) OUT A

ISL83204A application note

Abstract: bho 270 ISL83204A ISL83204AIBZ ISL83204AIPZ
Contextual Info: ISL83204A Data Sheet March 20, 2007 60V/2.5A Peak, High Frequency Full Bridge FET Driver The ISL83204A is a high frequency, medium voltage Full Bridge N-Channel FET driver IC, available in 20 lead plastic SOIC and DIP packages. The ISL83204A includes an input

Solder bar of Senju M705

Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Contextual Info: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold

Contextual Info: EH1520SJETTS-20.000M EH15 20 SJ ET RoHS TS -20.000M Series RoHS Compliant 3.3V Plastic J-Lead SMD LVCMOS High Frequency Oscillator Nominal Frequency 20.000MHz Frequency Tolerance/Stability ±20ppm Maximum Package Pin 1 Connection Tri-State High Impedance

Contextual Info: EH1520SJETTS-25.000625M EH15 20 SJ ET RoHS TS -25.000625M Series RoHS Compliant 3.3V Plastic J-Lead SMD LVCMOS High Frequency Oscillator Nominal Frequency 25.000625MHz Frequency Tolerance/Stability ±20ppm Maximum Package Pin 1 Connection Tri-State High Impedance