20-LEAD PLASTIC SOL Search Results

sc6038

Abstract: SC-6038 K 2941 SOT393-1 DBS13P DIP20 DIP28 HDIP18 LQFP100 LQFP48
Contextual Info: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP Soldering 1816 1818 1822 1823 1827 1830 1836 1839 1841 1849 1851 1852 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL

CLCC68

Abstract: CQFP80 CDIP40 package cdip28 PLCC68 package ANSI Y14.5 cqfp package outline PLCC28 package CDIP24 CDIP28 package
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PACKAGE INFORMATION Page Index - CDIP CLCC CQFP DBS DIP HDIP PLCC QFP SIL SO SSOP - Soldering - Package outlines Package information 1995 Oct 25 File under Integrated Circuits, IC18 Philips Semiconductors

Contextual Info: S7E D • 345T325 bOb « F G R S DO-15 F- 126 58 A Plastic Dimensions in mm. e q03 oo Si Q1 m . ti_ - t Voltage 1.000 V. 8 Current 1.5 A. at 45°C. • Fast Recovery Diodes Mountir g instructions • Diffused junction 1. Min. c istance from b o d y to soldering p oint,

fagor ba 159

Contextual Info: S7E D • FAGOR 345^325 D00Ü732 nfl IFGRS BA 157 BA 159 FAGOR e l e c t r o n i c s Dimensions in mm. D O-15 F - 126 58 A 2 Plastic Voltage 400 to 1.000 V. Current 1.0 A. at 50°C. • Fast Recovery Diodes Mounting instructions • Diffused junction 1. Min. distance from body to soldermg point,

RCWP25

Abstract: rCWP0402 RCWP055
Contextual Info: RCWP www.vishay.com Vishay Dale Thick Film Chip Resistors, Industrial FEATURES MECHANICAL SPECIFICATIONS Resistive element Ruthenium oxide Encapsulation Epoxy Substrate 96 % alumina Termination Solder-coated nickel barrier Solder finish Pure tin or tin/lead solder alloy

Contextual Info: S7E ]> 1 - A l i O I K 345=1325 DD0Gb73 Ô2T • F 6 R S _ GP15A GP15M FAGOR ELECTRONICS Dimensions in mm. DO-15 Plastic Mounting instructions 1. Mm. distance from body to soldenng point, 4 mm. 2. Max. solder temperature, 350°C. 3. Max. soldering time, 3,5 sec.

Contextual Info: 'I M Ü ilJ i u i U l i s ï Straight FEATURES . • • ■ ■ Excellent for high density applications Minimizes PC Board stacking height IR, vapor phase and wave solder compatible Chamfered entry prevents pin stubbing Mates with Crane's PGM, IPGM, MPGM Series headers

Contextual Info: S7E D 3MST35S GDDObflM bGS H F 6 R S 1N4933GP. 1N4937GP F A G O R ^ p FAGOR ELECTRONICS "T-03-'3> Dimensions in mm. DO-41 Plastic Voltage 50 to 600 V. Current 1.0 A. at 75 °C. Mounting instructions 1Glass passivated junction 1. Min. distance from body to soldering point,

Contextual Info: FAGOR 57E D Dimensions in mm. • 345^325 OGOÜb?! TS7 « F G R S 1N5391GP.1N5399GP FASOR ELECTRONICS DO-IS Plastic 'T-Q\-i5 Current 1.5 A. at 70°C. Voltage 50 to 1.000 V. Mounting instructions • Glass passivated junction 1. Min. distance from body to soldering point,

Contextual Info: • 345^325 OOODbflb Mflfl ■ F G R S RGP10A FA G O R RGP10M FA60R ELECTRONICS 'T'-Ql-13 Recovery i Dimensions in mm. DO-41 Plastic Current 1.0 A. at 55 °C. Voltage 50 to 1.000 V. Mounting instructions • Glass passivated junction 1. Min. distance from body to soldering point,

SB1501

Abstract: sb1504 SB-15 SB15005 SB1502 SB1510 SB1510 bridge
Contextual Info: SB15005 THRU SB1510 15.0 AMP SILICON BRIDGE VO LTAG E RANGE FEATURES 50 to 1000 Volts * Universals 4 -w a y term inals: sn a p -o n , w rap-aro un d, CURRENT solder or P.C. board m ounting * T his series is UL recognized under com ponent index, 15.0 Amperes

8251a usart interface from z80

Abstract: UDL TM 500 f922 verilog code for 8254 timer l912 256x32 POWER MODULE TM 31 udl 500 78K3 F5S4
Contextual Info: L4E75BS DÜHBÖGb 3ÔÔ B I N E C E CB-C7, 5-VOLT 0.8-M ICRON CELL-BASED CMOS ASIC NEC NEC Electronics Inc. August 1993 Description Figure 1. Integrated HDD Solution with CBC7 Cell-Based ASIC with Embedded 78K3 MPU, Compiled SRAMs and A/D Converters CB-C7 cell-based product family is a 0.8-micron drawn

circuit diagram of moving LED message display

Abstract: MVL-534BV
Contextual Info: T-1 3/4 φ5mm PACKAGE SOLID STATE LAMP MVL-534BV Description Package Dimensions The MVL-534BV, a blue source color device, is made with 5.05 (.200) GaN ( on SiC substrate) LED die. Unit: mm ( inches ) The package is T-1 3/4 (φ5mm) water clear plastic type.

TLP785GB

Abstract: 11-5L107 TLP785F TLP785 EN60747-5-2 TL-P785 TLP785 TLP78 BR 13005 A
Contextual Info: TLP785,TLP785F TOSHIBA Photocoupler GaAs IRED & Photo−Transistor TLP785,TLP785F Office Equipment Household Appliances Solid State Relays Switching Power Supplies Various Controllers Signal Transmission Between Different Voltage Circuits The TOSHIBA TLP785 consists of a silicone phototransistor optically

MSL-824HG-G

Contextual Info: SIDE LOOK PACKAGE SOLID STATE LAMP MSL-824HG-G Description Package Dimensions The MSL-824HG-G is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic. Units : mm Applications l

Contextual Info: HFE4225 Next Generation High Power LEDs, Plastic ST Package FEATURES • Industry standard ST fiber connector • 850 nm GaAIAs LED • Fiber Dip package style • High reliability construction • Straight plastic barrel and housing • Wave solderable

Contextual Info: 1N4001 Thru 1N4007 1 AMP PLASTIC SILICON RECTIFIER I FEATURES • Low cost • Diffused junction • Low leakage • Low forward voltage drop • High current capability • Easily cleaned with freon, alcohol, chlorothene and similar solvents • UL recognized 9 4 V -0 plastic material

Contextual Info: 1N5400 Thru 1N5408 3 AMP PLASTIC SILICON RECTIFIER I FEATURES • Low cost • Diffused junction • Low leakage • Low forward voltage drop • High current capability • Easily cleaned with freon, alcohol, chlorothene and similar solvents • UL recognized 9 4 V -0 plastic material

Contextual Info: GI850 thru GI858 Vishay General Semiconductor Fast Switching Plastic Rectifier FEATURES • Fast switching for high efficiency • Low forward voltage drop • Low leakage current • High forward surge capability • Solder Dip 260 °C, 40 seconds • Component in accordance to RoHS 2002/95/EC

Contextual Info: [ • SUBMINIATURE T-3/4 SOLID STATE LAMPS 9 OPTOELECTRONICS RED HIGH EFFICIENCY RED YELLOW HIGH EFFICIENCY GREEN PACKAGE DIMENSIONS MV6000 MV6700 MV6300 MV6400 DESCRIPTIO N These subminiature lamps are constructed as axial leaded devices. They complement the MV5XBL series.

ICX098BL

Abstract: Sony V12A V32B 31pixels ICX098B
Contextual Info: ICX098BL Diagonal 4.5mm Type 1/4 Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras Description The ICX098BL is a diagonal 4.5mm (Type 1/4) interline CCD solid-state image sensor with a square pixel array which supports VGA format. Progressive

transister

Abstract: NJL5901AR dvd optical pickup photo transister NJL5901R
Contextual Info: NJL5901AR COBP PHOTO REFLECTOR „ GENERAL DESCRIPTION NJL5901AR is the compact surface mount type photo reflector in which Lead Pb – free reflow soldering is possible. It is possible to perform reflow soldering temperature 260°C and 2 times. NJL5901R has realized the high output current and the

mf 420

Abstract: miniSMDC035 POLYSWITCH Motherboards laptop layout mf 420 5A MF-R400* "cross reference" miniSMDC075 POLYSWITCH 30V RXE040 MF-R090
Contextual Info: G S o l u t i o n s i d e Multifuse PTC Resettable Fuses REV. 2.1 Multifuse® Products Solutions Guide I. Introduction .2 Circuit

AS8SLC512K32PEC

Abstract: AS8SLC512K32 836PIN
Contextual Info: iPEM 16 Mb ASYNC SRAM AS8SLC512K32PEC 16Mb, 512Kx32 CMOS 3.3V, High Speed Static RAM Integrated Plastic Encapsulated Microcircuit FEATURES DESCRIPTION Integrated Real-Time Memory Array Solution No latency or refresh fycles Parallel Read/Write Interface User Configurable via multiple enables