|
54112-409241000LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
54242-108241000LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 24 Positions, 2.54mm (0.100in) Pitch. |
PDF
|
|
|
20021824-100A0T1LF
|
|
Amphenol Communications Solutions
|
Minitek127®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 100 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch. |
PDF
|
|
|
68024-100HLF
|
|
Amphenol Communications Solutions
|
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail. |
PDF
|
|
|
59112-G24-10-035LF
|
|
Amphenol Communications Solutions
|
Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 20 Positions. |
PDF
|
|
