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CSD17312Q5
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Texas Instruments
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30V, N ch NexFET MOSFET™, single SON5x6, 1.7mOhm 8-VSON-CLIP -55 to 150 |
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69173-123HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm (0.100in) Pitch. |
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69173-126HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100in) Pitch. |
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69173-129HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm (0.100in) Pitch. |
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10146173-126KLF
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Amphenol Communications Solutions
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Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 26 position |
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69173-120HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in) Pitch. |
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