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TLP172AM
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Toshiba Electronic Devices & Storage Corporation
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Photorelay (MOSFET output, 1-form-a), 60 V/0.5 A, 3750 Vrms, 4pin SO6 |
Datasheet
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54122-106501000LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch |
PDF
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10132650-11JLF
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Amphenol Communications Solutions
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ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 16 column, 320 position, Right Angle Header, Right Guide Pin. |
PDF
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L17H1650114
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=15.88mm (0.625in), 25/25 (Socket/Pin), Flash Gold, Bright Tin Shell, M3 Threaded Rear Insert, 4* 4-40 Threaded Hole |
PDF
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10052626-501LF
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Amphenol Communications Solutions
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Metral® Accessories, Backplane Connectors, Guide Module with Ground spring ,5 Row |
PDF
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