16P8R 0805 Search Results

16P8R 0805 Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
G832MB110805022HR		Amphenol Communications Solutions	0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black.	PDF
G832MB010805022HR		Amphenol Communications Solutions	0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash Black.	PDF
G832MC110805022HR		Amphenol Communications Solutions	0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 7.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, Gold Flash Black.	PDF
57102-G08-05		Amphenol Communications Solutions	Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 10 Positions - 2mm (0.079inch) - Vertical	PDF
55508-050LF		Amphenol Communications Solutions	Minitek® 2.00mm, Board to Board Connector, Low Profile, PCB Mounted Receptacle , Vertical , Surface Mount, Top Entry, Double row, 50 Positions, 2.00mm (0.079in) Pitch.	PDF

16P8R 0805 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
audio system ads 5002 Abstract: mini ups project RA8E 5kv 15j 74 A03413 82855gme 2N7D02 mini ups project file gds c50 1NTC Contextual Info: > ¿ W A, -i. w V SMBUS DIAGRAM SYSTEM BLOCK DIAGRAM TTDr1 DDR SO - DIMM X 2 DDR 333/266 BATTERY INTEL CPU ULV Pentium-M 753/733/723 ULV Celeron-M (373/353) UBGA478 THERMAL SENSOR 4 0 0 M HZ F S B 1st IDE BUS MASTER GMCH-GME/GM DAC Intel 82855GME/GM FC - BGA732	OCR Scan	UBGA478 82855GME/GM BGA732 82801DBM UBGA421 02MICR0 OZ711MP1B OZ2211 RTL8100CL ALC655 audio system ads 5002 mini ups project RA8E 5kv 15j 74 A03413 82855gme 2N7D02 mini ups project file gds c50 1NTC	PDF
mil-std-202 method 304 Abstract: CR25 resistor TRA05 16p8r 0603 CR25 RESISTOR CR25 m108 CR25 FILM RESISTORS 16p8r RA03 Contextual Info: Viking THICK FILM CHIP RESISTOR－CR Construction Part Numbering  Product Type Product Type CR Code T  TCR Thick Film Chip Resistor  Dimensions LxW Codes 25 10 12 06 05 03 02 Dimensions (LxW) 6.3×3.2mm 5.0×2.5mm 3.1×2.5mm 3.1×1.55mm 2.0×1.25mm	Original	100ppm 200ppm 250ppm 400ppm 500ppm MIL-R-55342D MIL-STD-202, 45minutes mil-std-202 method 304 CR25 resistor TRA05 16p8r 0603 CR25 RESISTOR CR25 m108 CR25 FILM RESISTORS 16p8r RA03	PDF
FS DMO 365 RN Abstract: mxj A1 connector LS 2027 audio amp MA81C WDA42 lx4 d09 st3pc 13T4 0601N D1661 Contextual Info: Model : F17P R:1 Intel Pentium 4 LGA775 +PT880+VIA8235 C E PCB STACK UP LAY1 LAY 2 LAY 3 LAY 4 LAY 5 LAY 6 LAY 7 LAY 8 LAY 9 LAY10 TOP GND INI IN2 GND1 VCC IN3 IN4 GND2 BOTTOM Revision History A O R IG IN A L RE LEA SE fe . cCL V?, o . ^ •Pff' j L	OCR Scan	LGA775) PT880 VIA8235 LAY10 -F4011 35-A05502-00A F17P-PCB-IV-LED -E4985 F17P-PCB 35-A05002-00D FS DMO 365 RN mxj A1 connector LS 2027 audio amp MA81C WDA42 lx4 d09 st3pc 13T4 0601N D1661	PDF
TC227 Abstract: IR sensor LFN 2N700Z S14800 U53D LS 2027 audio amp a-b osai em 231 rtd aa2c SOT23-5 LM2729 Contextual Info: Model: R15B R:0 Intel Banias+855PM+ICH4 PCB STACK UP LAY1 TOP LAY2 GND LAY3 IN1 LAY4 IN2 LAYS GND1 LAY6 VCC LAY7 IN3 LAY8 IN4 LAY9 GND2 LAY10 BOTTOM Revision History A Page Page Page Page Page Page Page Page Page Page Page ORIGINAL RELEASE 1 2 3 4 5 6 7 8	OCR Scan	855PM LAY10 LM27281 LP2996 1AX1737 LM2729 SI4800 TC227 IR sensor LFN 2N700Z S14800 U53D LS 2027 audio amp a-b osai em 231 rtd aa2c SOT23-5 LM2729	PDF
YAGEO CHIP RESISTORS Mounting Abstract: 0402 8p4r YC158 2512 resistor YAGEO CHIP RESISTORS MARKING yageo Phycomp 1206 capacitor RC0402 yageo YC124 YAGEO mass YAGEO RC0603 yageo 0201 mass Contextual Info: DATA SHEET THICK FILM CHIP RESISTORS Product Specification – Mar 25, 2008 V.7 Introduction Product specification Chip Resistor Surface Mount Thick film technology INTRODUCTION Data in data sheets is presented - whenever possible -according to a 'format', in which the following	Original		PDF
YAGEO CHIP RESISTORS Mounting Abstract: 0402 8p4r YC158 yc248 YAGEO RC0603 8P4R 16p8r 0603 2512 resistor YC162 Yageo pulse load Contextual Info: DATA SHEET THICK FILM CHIP RESISTORS Product Specification – Mar 25, 2008 V.7 Introduction Product specification Chip Resistor Surface Mount Thick film technology INTRODUCTION Data in data sheets is presented - whenever possible -according to a 'format', in which the following	Original		PDF
8c628 Abstract: DOT040 LM393 AE C624 74164 pin assignment U24E FD500 PVD01 IVD09 Contextual Info: - Ì- ‘- i- 1-i- i _- 1- s-	OCR Scan	M2N1SMDC110 M1NISMD0C14-2 FD501 DOT040 D0nr040 DCT040 8c628 DOT040 LM393 AE C624 74164 pin assignment U24E FD500 PVD01 IVD09	PDF
SB0061 Abstract: AP239 sick wl 33-01 F11YT1 DIODE E BUG C552 intel dg41 diode BUG C332 04D2R 1R32Z intel dg41 vw Contextual Info: Twinhead Model : F11YT1 R:0 Intel Yonah ULV+Calistoga 945GM+ICH7-M Revision History A ORIGINAL RELEASE B 2006/01/12 Rev :B release. C 2006/03/17 Rev:C release. 2006/03/31 Rev :0 release. PCB STACK UP LAY1 LAY2 LAY3 LAY4 LAY5 LAY6 LAY7 LAY8 TOP GND IN1 VCC	OCR Scan	F11YT1 945GM PG16CLKGEN PG19LAN M38857 GMD15 M56EN 0402R 124PS CN129S12421A0 SB0061 AP239 sick wl 33-01 DIODE E BUG C552 intel dg41 diode BUG C332 04D2R 1R32Z intel dg41 vw	PDF
RBS 6402 Abstract: smd code 1Bs smd fuse marking code TN solar cell cnc TRANSISTOR SMD MARKING CODE kn smd transistor 5Bs smd transistor marking DK RH smd transistor marking cf rh RBS 2202 telecom rbs 6102 Contextual Info: Contents 2011 RoHS Compliant CERAMIC METALIZED SUBSTRATE Ceramic Metalized Substrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . F1-F2 CIRCUIT PROTECTION PRODUCTS Page Over-Current Protection CF/CFS	Original		PDF