157 BGA SOCKET Search Results

reflow temperature rohs bga

Abstract: 0.65mm pitch BGA
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

0.65mm pitch BGA

Abstract: ASTM-B-488 157 BGA socket
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

94vo fr4

Abstract: 157 BGA socket adapter bga
Contextual Info: ADVANCED Ball Grid Array Socketing System INTERCONNECTIONS ® 5EnergyWay,P . BGAAdapters BGA Ball Grid Array BGA Adapter BGA Adapter Solder

pitch 0.75mm BGA

Contextual Info: Ball Grid Array BGA Adapters 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com Standard Adapter (A) Now Available In 0.75mm Pitch • Mates with Standard Socket (S)

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

BGA 731

Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)

Contextual Info: Ball Grid Array Socketing System ADVANCED INTERCONNECTIONS 5 Energy Way, P.0. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850 / 401-823-5200 • Fax 401-823-8723 •Email advintcorp@aol.com • Internet http://www.advintcorp.com BGA Adapters Features:

PCT-GF30

Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
Contextual Info: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount

35x35 bga

Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
Contextual Info: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board

bga PCB footprint

Contextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board

BGA 731

Abstract: bga thermal cycling reliability material for ball grid array packaging
Contextual Info: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board

BGA reflow guide

Abstract: pitch 0.75mm BGA 1024 ball bga
Contextual Info: Ball Grid Array BGA Adapters 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com BGA Adapters Standard Adapter (A): Extraction Slot Adapter (AX):

638 pin micro PGA

Contextual Info: C a t a l o g 16 P r e v i e w RoHS C om pliant IC Sockets S Adapters • O .C 75[l.Q 33 - 1.752 4.4.50] S( 1 fi0 0 [4 0 .fi4 : SÌJ 52 EO. SP. 9 0.C50[ t . & P /N : 5 3 9 7 - 5 6 0 « KM ! £ < • i ss Table o f Contents Table o f Contents B6A Socketing Systems

Contextual Info: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter

Contextual Info: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE

eutectic 157

Contextual Info: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE

BGA reflow guide

Abstract: 1024 ball bga
Contextual Info: Ball Grid Array BGA Adapters ADVANCED INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advintcorp.com • Internet http://w ww .advintcorp.com BGA Adapters Standard Adapter (A):

Contextual Info: ADVANCED aKJA« INTERCONNECTIONS. LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 » Fax 401-823-8723 •Email info@advintcorp.com • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications

eutectic 157

Abstract: advanced 94vo fr4
Contextual Info: SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Website: www.bgasockets.com SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE BGA LGA ADVANCED

PGA socket 479

Contextual Info: This document was generated on 01/11/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: Replacement Part Number: 0471719110 Obsolete 1.27mm .050" Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)

68230A

Abstract: pal16v8q PAL16R8ACN 99029 PAL16V8Q-15JC4 PAL16V8Z AM993 17640 8253 amd thermal analysis on pcb
Contextual Info: 9/5/01 PKG. TYPE CD 016 PD 016 PD 016 CD 020 CD 020 CD 020 CD 020 CD 020 PD 020 PD 020 Page 1 Thermal Resistance Analysis Update LD. FRM. NUMBER 18543 405 563 461 480 480 480 18550 590 590 X PAD DIM. MILS 167 140 150 127 160 160 160 167 150 150 MSD Advanced Assembly Technology

Contextual Info: ADVANCED B G A S o c k e ts /A d a p te r s INTERCONNECTIONS6 5 Energy Way, P.O. Box 1019, W est W arwick, Rl 02893 'T e l. 80 0-4 2 4 -9 8 5 0 /4 0 1 -8 2 3 -5 2 0 0 • Fax 401-823-8723 • Email advintcorp@ aol.com • Internet http://w w w .advintcorp.com

SKs smd 69

Abstract: smd SKs Z KS78 HLS8 1.27mm pitch connector smd lcc 28 socket PGA 145 socket TEXTOOL PGA DECOUPLING CAPACITOR TEXTOOL
Contextual Info: ADVANCED INTERCONNECTIONS. Table of Contents 5 Energy Way, P.O. Box 1019, West Warwick, R[ 02893 USA Tel. 8 0 0 -4 2 4 -9 8 5 0 /4 0 1 -8 2 3 -5 2 0 0 Fax 401-823-8723 Email advintcorp@ aol.com • Internet http://ww w .advintcorp.com DIP Section pages 8 - 39