144 PGA Search Results

MC39I

Abstract: MC143 MC16 mc-14 MC119 MC151 FB13 XC73144 N649-I mc12
Contextual Info:  XC73144 144-Macrocell CMOS CPLD June 1, 1996 Version 1.0 Product Specification Features description. To minimize power dissipation, unused Function Blocks are turned off and unused macrocells in used Function Blocks are configured for low power operation.

XC2064

Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
Contextual Info: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP

144 QFP body size

Abstract: ASTM-B16-85
Contextual Info: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

144 QFP body size

Contextual Info: P/N 1110087 144-Pin VQFP-to-PGA Adapter FEATURES • Convert surface-mount VQFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,

XC5200

Abstract: XC5202 XC5204 XC5206 XC5210 XC5215 XC3020A - PQ100
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

ccii

Abstract: rta2 PLH11L 72F14 ML/82x33/587/OS/TL/F/1553 bus controller
Contextual Info: UT1553 BCRTMP □ Tune tagging and message logging in RT mode F eatures □ Packaged in 144-pin pingrid array, 132-lead flatpack □ Comprehensive MIL-STD-1553 dual-redundant Bus Controller BC and Remote Terminal (RT) functions □ Low-power CMOS technology

XC3030A

Abstract: XC3020A XC3020L XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

AMS-QQ-N-290

Abstract: ASTM-B16-00
Contextual Info: P/N 97-68340 for Motorola 68340 144-Pin QFP-to-PGA Adapter FEATURES • Convert surface mount QFP packages to a 15x15 PGA footprint • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs • Pins are mechanically fastened and soldered to board using Aries’ patented process,

XC3042A PQ100

Abstract: WC68 XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L wc84 XC3064L
Contextual Info: 44 12 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

304 MQFP

Abstract: MQ240 XC3030A
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC9572 VQ44

Abstract: XC3020A XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A
Contextual Info: 44 64 68 84 100 120 132 144 156 160 164 175 24 176 191 196 208 223 225 228 240 256 299 304 352 411 432 475 559 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC VQFP PLASTIC LCC CERAMIC LCC PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC PQFP PLASTIC TQFP

XC2064

Abstract: XC2018 PC84 XC3030A XC3064 XC2018 XC3020 XC3020A XC3030 XC3042 XC3090
Contextual Info: 44 10 ◆ = New since last issue of XCELL 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

A3818

Abstract: A5232 A5690 UT1553 McDonnell standards 1553L
Contextual Info: UT1553 BCRTMP ❐ ❐ ❐ ❐ FEATURES Time tagging and message logging in RT mode Packaged in 144-pin pingrid array, 132-lead flatpack Low-power CMOS technology Full military operating temperature range, -55°C to +125°C, screened to the specific test methods listed

apic - s03

Abstract: 243292 80286 microprocessor pin .doc format AM34 Diode T3 D46 PP0115 intel pentium MMX simd 1997 SL Enhanced Mobile Pentium Processor with MMX Technology Voltage Reduction Power Supply Design Considerations a
Contextual Info: MOBILE PENTIUM PROCESSOR WITH MMX TECHNOLOGY Maximum Operating Frequency iCOMP ® Index 2.0 Rating 150 MHz 166 MHz 144 160 Note: Contact Intel Corporation for more information about iCOMP ® Index 2.0 ratings. Support for MMX™ Technology Compatible with Large Software Base

Contextual Info: H XC73144 144-Macrocell CMOS EPLD M U N ÎT Product Specifications Features • High-Performance EPLD - 7.5 ns pin-to-pin speed on all fast inputs - 100 MHz maximum clock frequency • Advanced Dual-Block architecture - Four Fast Function Blocks - Twelve High-Density Function Blocks

zkb* vac

Abstract: UIC 4102 ZKB505/105 0.5 MIETEC CMOS ALCATEL PABX MTC-2071 zkb505 circuit diagram pabx alcatel LT 6242 lts 543 series pin diagram
Contextual Info: MTC-20172 'S' Interface Circuit for ISDN SIC Data Sheet & Reference Manual Rev. 1.1 February 1997 Application Specific Standard Products Features • Single chip 4 wire S0-interface for ISDN • Basic access at 144 kbits/s, with 2B+D • Complying with CCITT I.430

Contextual Info: Y p o n o n o H XILINX Military Logic Cell Array Product Specification. See Note 1. FEATURES Part Number Logic ConflgCapacity urable gates Logic Blocks User I/Os XC3090 9000 144 • MIL-STD-883 Class B Processing. Complies with paragraph 1.2.1 • Field-programmable gate array

44 pin TQFP Test Clip

Abstract: TQFP 100 socket
Contextual Info: Model 6151 144 Pin TQFP Test Clip 0.50mm Lead Pitch Pomona This new TQFP test clip provides the user with an easy means to connect test instruments to fine pitch plastic TQFP and SQFP chip leads. • Connects to high density plastic TQFP or SQFP surface mounted

Contextual Info: Zero Insertion Force PGA Test and Burn-in Sockets cont. * * * * * Grid Size 12 x 12 13 x 13 14 x 14 15 x 15 16 x 16 17 x 17 18 x 18 19 x 19 20 x 20 21 x 21 No. of Pins 144 169 196 225 256 289 324 361 400 441 Dim. “C” 1.100 [27.94] 1.200 [30.48] 1.300 [33.02]

L9145

Abstract: EPF10K10 EPF10K100 EPF10K100A EPF10K10A EPF10K30 EPF10K50V EPF10K70
Contextual Info: EPF10K10A Device Pin-Outs ver. 1.0 Pin Name 100-Pin TQFP 144-Pin TQFP MSEL0 2 MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4) DATA7 (4) DATA6 (4) DATA5 (4) DATA4 (4)

PCB footprint cqfp 132

Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336