144 BGA Search Results

Contextual Info: Product Number: 599-10-144-07-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel 144-07-001 13 X 13 # Of Pins Mill-Max Part Number 144 599-10-144-07-001429 RoHS Compliant LOOSE PIN:

Contextual Info: Product Number: 599-10-144-07-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 144-07-001 13 X 13 # Of Pins Mill-Max Part Number 144 599-10-144-07-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

Contextual Info: VSC3144-12 PRODUCT BRIEF 10.709 Gbps 144 x 144 Asynchronous Crosspoint Switch BLOCK DIAGRAM: Switch Core Inputs [143:0] EQ EQ Outputs [143:0] VSC3144-12 Programming Interface Features Benefits 10.709 Gbps 144 × 144 strictly nonblocking switch matrix with

Contextual Info: VSC3144-11 PRODUCT BRIEF 10.709 Gbps 144 x 144 Asynchronous Crosspoint Switch BLOCK DIAGRAM: Switch Core Inputs [143:0] EQ EQ Outputs [143:0] VSC3144-11 Programming Interface Features Benefits 10.709 Gbps 144 × 144 strictly nonblocking switch matrix with

144 bga

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC To Top / Package Lineup / Package Index BGA-144P-M02 144-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 13 Sealing method Plastic mold BGA-144P-M02 144-pin plastic FBGA (BGA-144P-M02)

Contextual Info: CY7C4122KV13/CY7C4142KV13 144-Mbit QDR -IV XP SRAM 144-Mbit QDR™-IV GT SRAM Features • Configurations CY7C4122KV13 – 8 M x 18 144-Mbit density 8 M × 18, 4 M × 36 [1] ■ Total Random Transaction Rate of 2132 MT/s ■ Maximum operating frequency of 1066 MHz

Contextual Info: CY7C4121KV13/CY7C4141KV13 144-Mbit QDR -IV HP SRAM 144-Mbit QDR™-IV HP SRAM Features • Configurations 144-Mbit density 8 M x 18, 4 M × 36 [1] CY7C4121KV13 – 8 M × 18 ■ Total Random Transaction Rate of 1334 MT/s ■ Maximum operating frequency of 667 MHz

Contextual Info: CY7C4122KV13/CY7C4142KV13 144-Mbit QDR -IV XP SRAM 144-Mbit QDR™-IV XP SRAM Features • Configurations CY7C4122KV13 – 8 M x 18 144-Mbit density 8 M × 18, 4 M × 36 [1] ■ Total Random Transaction Rate of 2132 MT/s ■ Maximum operating frequency of 1066 MHz

Contextual Info: Product Number: 599-11-144-07-001442 Description: BGA Socket 0.8mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 144-07-001

144-TERMINAL

Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

Contextual Info: Product Number: 599-11-144-07-001442 Description: BGA Socket 0.8mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 144-07-001 13 X 13

SLLA229

Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

PK084

Abstract: CS144 xilinx CS144 144 bga 144-BALL CSG144
Contextual Info: R Laminate Chip Scale BGA CS144/CSG144 Package PK084 (v1.1) May 31, 2006 144-BALL LAMINATE CHIP SCALE BGA, 0.80MM PITCH (CS144/CSG144) 144-BALL LAMINATE CHIP SCALE BGA, 0.80MM PITCH (CS144/CSG144) 2005, 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

EP20K100E

Abstract: t25 4 j5
Contextual Info: Pin Information for the APEX EP20K100E Device Version 1.5 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin FineLine BGA FineLine BGA 356-Pin BGA 8 8 8 — 8 — 8 8 8 8 8 — 8 8

T25 4 h5

Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
Contextual Info: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –

Contextual Info: NETWORK PRODUCT VSC3140 4.25 Gbps 144 x 144 Asynchronous Crosspoint Switch A P P L I C AT I O N S : Large 3 Stage CLOS Fabrics of up to 2,880x2,880 I/O Ports with up to 10Tb/s of Data Throughput DWDM Switches Wavelength Routers Storage Area Network SAN Switch Fabrics

AE23

Abstract: EP20K100E
Contextual Info: EP20K100E I/O Pins ver. 1.1 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin 208-Pin 240-Pin 144-Pin TQFP PQFP PQFP FineLine 1 (1) (1) BGA 324-Pin FineLine BGA 356-Pin BGA 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8

AA13

Abstract: AA15 AB16 EPF10K50E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Contextual Info: EPF10K50E Device Pin-Outs ver. 1.0 Pin Name 1 144-Pin TQFP MSEL0 (4) 77 MSEL1 (4) 76 nSTATUS (4) 35 nCONFIG (4) 74 DCLK (4) 107 CONF_DONE (4) 2 INIT_DONE (5) 14 nCE (4) 106 nCEO (4) 3 nWS (6) 142 nRS (6) 141 nCS (6) 144 CS (6) 143 RDYnBUSY (6) 11 CLKUSR (6)

AE23

Abstract: EP20K100E AF-1
Contextual Info: EP20K100E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 – 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – – – – 8 8 8 Pad Number Orientation Pin/Pad Function 144-Pin 208-Pin 240-Pin 144-Pin 324-Pin 356-Pin TQFP 1 PQFP (1) PQFP (1) FineLine BGA FineLine BGA BGA

PQFP-144

Abstract: EP20K30E
Contextual Info: EP20K30E I/O Pins ver. 1.1 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 208-Pin PQFP 144-Pin 1 (1) FineLine BGA 324-Pin FineLine BGA 8 8 8 8 8 8 8 8 1 2 3 4 5 6 7 8 9 10 11 12 13 14 8 8 8 8 7 7 15 16 17 18 19 20 21 22 23 24 25 26

xc9536tm

Abstract: FG456 CS144 CS280 CS48 FG256 FG676 XC9500 XC9536 XCV100
Contextual Info: ADVANCED Chip Scale & BGA Packaging New packaging technology for FPGAs and CPLDs reduces board space and increases I/Os. by Jay Aggarwal, Spartan Product Marketing Manager, Xilinx, jay.aggarwal@xilinx.com X ilinx recently announced new 144-ball and 280-ball, 0.8-millimeter pitch chip

Contextual Info: Errata Sheet V1.0 This Errata Sheet refers to: • The following datasheets: AT91M42800A Summary, Rev. 1779AS–06/01 AT91M42800A, Rev. 1779A–06/01 AT91M42800A, Electrical Characteristics, Rev. 1776A–08/01 • 144-lead TQFP and 144s-ball BGA devices with the following markings:

Contextual Info: Document Number: SCF5250EC Rev. 1.3, 07/2006 Freescale Semiconductor Data Sheet: Technical Data SCF5250 Package Information MAPBGA–196 LQFP-144 SCF5250 Integrated ColdFire Microprocessor Data Sheet 1 Introduction This document provides an overview of the SCF5250

SCF5250LAG100

Abstract: SCF5250AG120 SCF5250CAG120 SCF5250CPV120 SCF5250PV120 LQFP-144 SCF5250 memory stick m2 specs MAPBGA196 low cost processor
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: SCF5250EC Rev. 1.3, 07/2006 SCF5250 Package Information MAPBGA–196 LQFP-144 SCF5250 Integrated ColdFire Microprocessor Data Sheet 1 Introduction This document provides an overview of the SCF5250