144 BGA Search Results

Contextual Info: Product Number: 599-10-144-07-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 " Gold over 100 μ" Nickel 144-07-001 13 X 13 # Of Pins Mill-Max Part Number 144 599-10-144-07-001429 RoHS Compliant LOOSE PIN:

Contextual Info: Product Number: 599-10-144-07-001429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 144-07-001 13 X 13 # Of Pins Mill-Max Part Number 144 599-10-144-07-001429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

Contextual Info: VSC3144-12 PRODUCT BRIEF 10.709 Gbps 144 x 144 Asynchronous Crosspoint Switch BLOCK DIAGRAM: Switch Core Inputs [143:0] EQ EQ Outputs [143:0] VSC3144-12 Programming Interface Features Benefits 10.709 Gbps 144 × 144 strictly nonblocking switch matrix with

Contextual Info: VSC3144-11 PRODUCT BRIEF 10.709 Gbps 144 x 144 Asynchronous Crosspoint Switch BLOCK DIAGRAM: Switch Core Inputs [143:0] EQ EQ Outputs [143:0] VSC3144-11 Programming Interface Features Benefits 10.709 Gbps 144 × 144 strictly nonblocking switch matrix with

1072-pin

Abstract: VSC3144 IQ2200
Contextual Info: DATA INTERCONNECT VSC3144 6.5 Gbps 144 x 144 Asynchronous Crosspoint Switch BLOCK DIAGRAM: Switch Core Inputs [143:0] EQ EQ Outputs [143:0] VSC3144 Programming Interface F E AT U R E S : BENEFITS: ` 6.5 Gbps 144 × 144 strictly nonblocking switch matrix with multicast and

the circuit diagram of pacemaker

Abstract: VSC3040 IQ2200 1072-pin
Contextual Info: DATA INTERCONNECT VSC3040 11 Gbps 144 x 144 Asynchronous Crosspoint Switch BLOCK DIAGRAM: Switch Core Inputs [143:0] EQ EQ Outputs [143:0] VSC3040 Programming Interface F E AT U R E S : BENEFITS: ` 11 Gbps 144 × 144 strictly nonblocking switch matrix with multicast and

144 bga

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC To Top / Package Lineup / Package Index BGA-144P-M02 144-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 13 Sealing method Plastic mold BGA-144P-M02 144-pin plastic FBGA (BGA-144P-M02)

Contextual Info: CY7C4122KV13/CY7C4142KV13 144-Mbit QDR -IV XP SRAM 144-Mbit QDR™-IV GT SRAM Features • Configurations CY7C4122KV13 – 8 M x 18 144-Mbit density 8 M × 18, 4 M × 36 [1] ■ Total Random Transaction Rate of 2132 MT/s ■ Maximum operating frequency of 1066 MHz

Contextual Info: CY7C4122KV13/CY7C4142KV13 144-Mbit QDR -IV XP SRAM 144-Mbit QDR™-IV GT SRAM Features • Configurations CY7C4122KV13 – 8 M x 18 144-Mbit density 8 M × 18, 4 M × 36 [1] ■ Total Random Transaction Rate of 2132 MT/s ■ Maximum operating frequency of 1066 MHz

Contextual Info: CY7C4121KV13/CY7C4141KV13 144-Mbit QDR -IV HP SRAM 144-Mbit QDR™-IV HP SRAM Features • Configurations 144-Mbit density 8 M x 18, 4 M × 36 [1] CY7C4121KV13 – 8 M × 18 ■ Total Random Transaction Rate of 1334 MT/s ■ Maximum operating frequency of 667 MHz

Contextual Info: CY7C4121KV13/CY7C4141KV13 144-Mbit QDR -IV HP SRAM 144-Mbit QDR™-IV HP SRAM Features • Configurations 144-Mbit density 8 M x 18, 4 M × 36 [1] CY7C4121KV13 – 8 M × 18 ■ Total Random Transaction Rate of 1334 MT/s ■ Maximum operating frequency of 667 MHz

Contextual Info: CY7C4122KV13/CY7C4142KV13 144-Mbit QDR -IV XP SRAM 144-Mbit QDR™-IV XP SRAM Features • Configurations CY7C4122KV13 – 8 M x 18 144-Mbit density 8 M × 18, 4 M × 36 [1] ■ Total Random Transaction Rate of 2132 MT/s ■ Maximum operating frequency of 1066 MHz

Contextual Info: CY7C4121KV13/CY7C4141KV13 144-Mbit QDR -IV HP SRAM 144-Mbit QDR™-IV HP SRAM Features • Configurations 144-Mbit density 8 M x 18, 4 M × 36 [1] CY7C4121KV13 – 8 M × 18 ■ Total Random Transaction Rate of 1334 MT/s ■ Maximum operating frequency of 667 MHz

1779A

Abstract: AT91M42800A AT91M42800A-33AI AT91M42800A-33CI
Contextual Info: Errata Sheet This Errata Sheet refers to: 1. The following datasheets: AT91M42800A Summary, Rev. 1779AS–06/01 AT91M42800A, Rev. 1779A–06/01 2. 144-lead TQFP and 144-ball BGA devices with the following markings: AT91 ARM Thumb® Microcontrollers Internal Product

Contextual Info: Product Number: 599-11-144-07-001442 Description: BGA Socket 0.8mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 " Gold over 100 μ" Nickel Inner Contact Plating: 10 μ" Gold over 50 μ" Nickel 144-07-001

BGA144P-M02

Contextual Info: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 144 PIN PLASTIC BGA-144P-M02 144-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 13 Package width x package length 12.00 × 12.00 mm Sealing method Plastic mold Mounting height 1.45 mm MAX

144-TERMINAL

Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

PCI1510ZGU

Abstract: 82365SL PCI1510 PCI1510GGU PCI1510PGE PCI1510PGEG4 TPS2211A QFP Package 144 lead
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

82365SL

Abstract: PCI1510 PCI1510GGU PCI1510GVF PCI1510PGE PCI1510PGEG4 PCI1510ZGU TPS2211A MTQF017A
Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

Contextual Info: Product Number: 599-11-144-07-001442 Description: BGA Socket 0.8mm Grid; BGA Socket Surface Mount Accepts .008-.013" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 144-07-001 13 X 13

SLLA229

Contextual Info: PCI1510 GGU/GVF PGE/ZGU/ZVF www.ti.com SLLA229 – JUNE 2006 PC Card Controllers FEATURES • • • • • • • • A 144-terminal low-profile QFP PGE , 144-terminal MicroStar BGA ball-grid array (GGU/ZGU) package, or a 209-terminal PBGA (GVF/ZVF) package

M21151-13

Abstract: M21151 M21131 3AK27 XPS M32 m21151-12 AA10 GR-253 51T10 inn85
Contextual Info: Preliminary Information This document contains information on a product under development. The parametric information contains target parameters that are subject to change. M21151 144 x 144 DC—3.2 Gbps Crosspoint Switch with Programmable Input Equalization and Output Pre-emphasis

actel cqfp 84

Abstract: actel a1020b RT1425A actel a1010b actel 172 cqfp
Contextual Info: Package Options: User I/Os per Package January 1999 1999 Actel Corporation 1 Commercial/Industrial Devices RQFP VQFP TQFP BGA CPGA CQFP 129 172 172 125 176 34 57 69 69 72 83 72 72 57 125 125 152 125 176 176 202 176 176 202 57 78 112 129 78 144 78 112 144

MPC860

Abstract: REF10 STSI-144 TSI-16 0X0828
Contextual Info: Advance Information April 2003 STSI-144 Scalable Time-Slot Interchanger System Design Guide 1 Introduction 1.1 Related Documents This document is a detailed description on how to design using the STSI-144 scalable time-slot interchanger chip. Included is information for the