14 PIN IC DIL DATASHEET Search Results

AG1170P-S3

Abstract: AG1170-S5 AG1170-D3 AG1170P-S5 AN1170-14 AN1170 600R 800R AG1170-D5
Contextual Info: V1.12 August 2009 Datasheet Silvertel Pb Ag1170 +5V / +3.3V Low Power Ringing SLIC FEATURES • A highly featured low power SLIC in a 14 pin SIL or 21 pin DIL format. • Integral high efficiency DC/DC converter. Single +5V or +3.3V supply voltage. • Highly integrated with an on-board

Contextual Info: 4TE 3> • Söbfl4Sb Ü O D im 474 H H MHS ^ 6 - Z 3 - / Z - nllll H w l l S B MATRA September 1990 M H S HM 65764 DATASHEET 8 k X8 HIGH SPEED CMOS SRAM FEATURES . ■ . . ■ FAST ACCESS TIME INDUSTRIAL/MILITARY : 35/45/55 ns max COMMERCIAL : 15*/20/25/35/45/55 ns (max)

Contextual Info: I lliiíilll R I S September 1989 HM 65728 DATASHEET 2 kX 8 HIGH SPEED CMOS SRAM FEATURES . . . . 300 AND 600 MILS WIDTH PACKAGE TTL COMPATIBLE INPUTS AND OUTPUTS ASYNCHRONOUS CAPABLE OF WITHSTANDING GREATER THAN 2000 V ELECTROSTATIC DISCHARGE . SINGLE 5 VOLT SUPPLY

jm20329

Abstract: JM20329 USB to SATA Bridge jmicron make sata to usb cable diagram 1/serial/make sata to usb cable diagram usb to sata 10nF cap "JM20329" 9346 EEPROM 2.5 sata hdd pin out
Contextual Info: JMicron/JM20329 JM20329 Hi-Speed USB to SATA Bridge Datasheet Rev. 1.0 Version 1.0 JMicron 2007. All rights reserved. Page 1 May 2007 Copying prohibited. JMicron/JM20329 Revision History Version Date 0.8 2007/3/20 Initialization of this document for JM20329.

VNC2-32

Abstract: V2DIP2-32 VNCL2-32Q
Contextual Info: Future Technology Devices International Ltd. V2DIP2-32 VNC2-32Q Development Module Datasheet Document Reference No.: FT_000164 Version 1.0 Issue Date: 2010-04-16 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

VNC2

Contextual Info: Future Technology Devices International Ltd. V2DIP2-32 VNC2-32Q Development Module Datasheet Document Reference No.: FT_000164 Version 1.0 Issue Date: 2010-04-16 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

THERMISTORS nsp 037

Abstract: Thyristor TAG 9118 ICA 0726 0148 Transformer a1273 y k transistor AM97C11CN transistor SK A1104 PM7A2Q B8708 bzy79 yh 5032
Contextual Info: INDEX OF COMPONENTS A Section/Page No. A.C. Adaptor. Adaptor Kits BNC e tc . Adhesive Tapes. Adhesives, Various. Aerosols.

mte maxim

Contextual Info: MTE T> m S ñ b ñ 4Sh D0D11S1 5T7 • I1MHS nllll H v l M i v MATRA September 1990 M H S HM 65787 DATASHEET 64 K X 1 HIGH SPEED CMOS SRAM FEATURES ■ FAST ACCESS TIME INDUSTRIAL/MILITARY : 25/35/45/55 ns COMMERCIAL : 15*/20/25/35/45 ns . LOW POWER CONSUMPTION

VNC2-32

Abstract: u1M code vnc2 ftdi spi example
Contextual Info: Future Technology Devices International Ltd. V2DIP1-32 VNC2-32Q Development Module Datasheet Document Reference No.: FT_000163 Version 1.0 Issue Date: 2010-04-16 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

vinculum hid

Abstract: J222 J229 VNC2 j126 V2DA
Contextual Info: Future Technology Devices International Ltd. V2DIP2-64 VNCL2-64Q Development Module Datasheet Document Reference No.: FT_000166 Version 1.0 Issue Date: 2010-04-19 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

J222

Abstract: J226 J215
Contextual Info: Future Technology Devices International Ltd. V2DIP1-64 VNCL2-64Q Development Module Datasheet Document Reference No.: FT_000165 Version 1.01 Issue Date: 2010-05-25 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

VNC2-64Q1A

Contextual Info: Future Technology Devices International Ltd. V2DIP1-64 VNCL2-64Q Development Module Datasheet Document Reference No.: FT_000165 Version 1.0 Issue Date: 2010-04-19 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

VNC1L

Abstract: VDIP2 VNC2-48 J114 V2DIP1-48
Contextual Info: Future Technology Devices International Ltd. V2DIP2-48 VNC2-48 Development Module Datasheet Document Reference No.: FT_000237 Version 1.0 Issue Date: 2010-04-16 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

Contextual Info: M l M A I S September 1989 HM 65764 DATASHEET 8 k X 8 HIGH SPEED CMOS SRAM FEATURES 300 AND 600 MILS WIDTH PACKAGE TTL COMPATIBLE INPUTS AND OUTPUTS ASYNCHRONOUS CAPABLE OF WITHSTANDING GREATER THAN 2000 V ELECTROSTATIC DISCHARGE SINGLE 5 VOLT SUPPLY FAST ACCESS TIME

vinculum hid

Abstract: VDIP2 J120
Contextual Info: Future Technology Devices International Ltd. V2DIP2-48 VNC2-48 Development Module Datasheet Document Reference No.: FT_000237 Version 1.01 Issue Date: 2010-05-25 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

Contextual Info: 4RE D Sñtjfl4Sb □□□llT'ì bfib M M M H S fililíI V r H I September 1990 MATRA M H S HM 65790 DATASHEET 16 K X 4 HIGH SPEED CMOS SRAM SEPARATE I/O FEATURES 300 MILS WIDTH PACKAGE TTL COMPATIBLE INPUTS AND OUTPUTS ASYNCHRONOUS CAPABLE OF WITHSTANDING GREATER THAN

Contextual Info: IlM lI Septem ber 198£ HM 65791 DATASHEET 16 K x 4 HIGH SPEED CMOS SRAM SEPARATE I/O AND TRANSPARENT WRITE FEATURES FAST ACCESS TIME MILITARY : 35/45 ns max COMMERCIAL : 25/35/45 ns (max) LOW POWER CONSUMPTION ACTIVE : 267 mW (typ) STANDBY : 75 mW (typ)

Contextual Info: IIIÍMÍIII Preliminary September 1989 HM 65797 DATASHEET 256 K X 1 H IG H S P E E D C M O S SRAM FEATURES 300 MILS WIDTH PACKAGE TTL COMPATIBLE INPUTS AND OUTPUTS ASYNCHRONOUS CAPABLE OF WITHSTANDING GREATER THAN 2000V ELECTROSTATIC DISCHARGE SINGLE 5 VOLT SUPPLY

J222

Abstract: VNCL2-64Q VNC2-64Q1A
Contextual Info: Future Technology Devices International Ltd. V2DIP1-64 VNCL2-64Q Development Module Datasheet Document Reference No.: FT_000165 Version 1.0 Issue Date: 2010-04-19 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

scr gate driver ic

Abstract: HEXFET Power MOSFET designer manual "MOS Controlled Thyristors" UC1710 application notes mosfet discrete totem pole drive CIRCUIT IRFP460 transistor databook HEXFET Power MOSFET Designers Manual irfp460 igbt SCR gate drive circuit datasheet irfp460 mosfet
Contextual Info: U-137 APPLICATION NOTE PRACTICAL CONSIDERATIONS IN HIGH PERFORMANCE MOSFET, IGBT and MCT GATE DRIVE CIRCUITS BILL ANDREYCAK INTRODUCTION The switchmode power supply industry’s trend towards higher conversion frequencies is justified by the dramatic improvement in obtaining higher power densities. And as these frequencies are pushed towards

HEXFET Power MOSFET Designers Manual

Abstract: "MOS Controlled Thyristors" HEXFET Power MOSFET designer manual mosfet discrete totem pole drive CIRCUIT UC1710 application notes IRFP460 transistor databook UC1770 mosfet discrete totem pole CIRCUIT scr gate driver ic uc1710
Contextual Info: U-137 APPLICATION NOTE PRACTICAL CONSIDERATIONS IN HIGH PERFORMANCE MOSFET, IGBT and MCT GATE DRIVE CIRCUITS BILL ANDREYCAK INTRODUCTION The switchmode power supply industry’s trend towards higher conversion frequencies is justified by the dramatic improvement in obtaining higher power densities. And as these frequencies are pushed towards

Contextual Info: T> m SñbñMSb OGQllD? n llll I f T MATRA MTT « M f l H S l i i September 1990 il H S HM 65767 DATASHEET 16 K X 1 HIGH SPEED CMOS SRAM FEATURES . . . . 300 MILS WIDTH PACKAGE TTL COMPATIBLE INPUTS AND OUTPUTS ASYNCHRONOUS CAPABLE OF WITHSTANDING GREATER THAN

V2DA

Abstract: VDIP1
Contextual Info: Future Technology Devices International Ltd. V2DIP1-48 VNC2-48 Development Module Datasheet Document Reference No.: FT_000236 Version 1.0 Issue Date: 2010-04-15 Future Technology Devices International Ltd FTDI Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom

SOT23W-3

Abstract: transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket EK QFN MS-018AC qfn 44 PACKAGE footprint qsop 16 pcb footprint SOT23 MARK EW
Contextual Info: Product Information Allegro Package Designations This document provides reference information as an aid to differentiating the device package types used by Allegro MicroSystems. It provides cross references to the package designation, an Allegro code that is integrated into the device part number: