13442 Search Results

Hitachi ED 101

Abstract: ha13441 Ha 13441 0068nF 13441 HDD 3 PIN BRUSHLESS motor power supply
Contextual Info: HA13441, 13442 Three-Phase Brushless DC Motor Driver Description HA 13440MP/H A 13441 /H A 13442 The HA13441 and 13442 are three-phase brushless DC motor drive ICs of 2 A/phase or 4 A/phase. Functions SP-23TA 2 A/phase (4 A/phase) three phase output circuit

1S1072

Abstract: 1327FP E26226 1327F
Contextual Info: 8 5 6 7 2/4/08 CMS 12/4/01 CMS 1/7/02 AMS ECRN 14225 - REMOVE OBS. P/N'S 9.9 .39 DOVETAILS ALLOW STACKING IN VERTICAL, HORIZONTAL, OR IN BLOCK CONFIGURATIONS. 1 ECRN 13442- ADDED NEW CAT. NO'S. ECRN 13448 1.3 R.05 24.6 .97 2 C CAT. NO. 1327FP 1327G5FP 1327G6FP

Contextual Info: THIS DRAWING AND DESIGN HEREON CON­ STITUTES A PROPRIETARY DESIGN OF PACKARD ELECTRIC DIVISION AND IS NOT TO BE DUPLICATED OR REPRODUCED WITH­ OUT AUTHORITY OF PACKARD ELECTRIC DIVISION. DATE SYM 01AUS0 □R AUTHORITY CK 8<]0005 DBB DBB 134425 BKD JC 135770 AfU A H

ha13441

Abstract: HA13441S ha13 HA13441 notes ha 13441 TRANSISTOR c104 hdd motor hitachi HA13442 HA13441V HA13442S
Contextual Info: HA13441, 13442 Three-Phase Brushless DC Motor Driver Description The HA 13441 and HA 13442 are three-phase brushless DC motor drive ICs of 2 A/phase or 4 A/phase. Functions • • • • • • • • • • • • • 2 A/phase 4 A/phase three phase output circuit

1327F

Abstract: 1S1072 E26226 1327G8FP 1327G16FP 1-9597S18
Contextual Info: 8 6 7 5 2/4/08 AMS 4/11/08 AMS ECRN 14225 - REMOVE OBS. P/N'S ECRN 14225 - ADD 1327G16FP CMS 12/4/01 CMS 1/7/02 ECRN 13442- ADDED NEW CAT. NO'S. ECRN 13448 1 9.9 .39 DOVETAILS ALLOW STACKING IN VERTICAL, HORIZONTAL, OR IN BLOCK CONFIGURATIONS. 24.6 .97 C CAT. NO.

Contextual Info: HA13441, 13442 Three-Phase Brushless DC Motor Driver Description The HA 13441 and HA 13442 are three-phase brushless DC motor drive ICs of 2 A/phase or 4 A/phase. Functions • • • • • • • • • • • • • 2 A/phase 4 A/phase three phase output circuit

Contextual Info: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S1B21 Microcontroller D ATA SHE E T D S -LM3S 1B 21 - 1 3 4 4 2 . 2 5 4 9 S P M S 222H C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated

Contextual Info: TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S9B81 Microcontroller D ATA SHE E T D S -LM3S 9B 81 - 1 5 8 5 2 . 2 7 4 3 S P M S 223J C o p yri g h t 2 0 07-2014 Te xa s In stru me n ts In co rporated Copyright Copyright © 2007-2014 Texas Instruments Incorporated All rights reserved. Stellaris and StellarisWare® are registered trademarks of Texas Instruments

Contextual Info: NRND: Not recommended for new designs. TE X AS I NS TRUM E NTS - P RO DUCTION D ATA Stellaris LM3S5951 Microcontroller D ATA SHE E T D S -LM3S 5951 - 1 3 4 4 2 . 2 5 4 9 S P M S 186M C o p yri g h t 2 0 07-2012 Te xa s In stru me n ts In co rporated

Contextual Info: MATERIAL DECLARATION SHEET Material # 4609M-LF Series Product Line Networks Date 05/17/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.1663 0.0019 0.0414 0.0138 0.0221

pwr4525

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR4525 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY ENCAPSULANT

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR2615 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY Headquarters Riverside CA

06852

Contextual Info: MATERIAL DECLARATION SHEET Material # 4609H-LF Series Product Line Networks Date 05/18/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.2328 0.0027 0.0580 0.0193 0.0310

Contextual Info: MATERIAL DECLARATION SHEET Material # Model 4416T-L Product Line Networks Date 02-January-2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.14324 0.000026 0.000013 0.000037

Contextual Info: MATERIAL DECLARATION SHEET Material Number 85L CP Dual Cup Product Line Panel Control Compliance Date September 30, 2005 RoHS Compliant Yes MSL N/A Subpart mass of total wt. (%) 72 Material Mass % of total unit wt. 3.920 25 1.361 5.455 7440-50-08 3 0.163

CRT0603 marking

Contextual Info: MATERIAL DECLARATION SHEET Material Number Model CRT0603 Product Line Chip Resistors Compliance Date 18-June-2009 RoHS Compliant Yes MSL 1 Construction Element subpart Homogeneou s Material Material weight [g] Homogeneous Material\ Substances Ceramic Substrate

diode marking 226

Abstract: marking 7c fiber glass
Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-RD Product Line PTC resistors Date 01/13/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] 0.674 Materials CAS if applicable Average mass [%] Barium

Contextual Info: MATERIAL DECLARATION SHEET Material # 4610M-LF Series Product Line Networks Date 05/17/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.1848 0.0022 0.0460 0.0153 0.0246

2587

Contextual Info: MATERIAL DECLARATION SHEET Material # 4610H-LF Series Product Line Networks Date 05/18/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.2587 0.0030 0.0644 0.0214 0.0344

4416P-LF

Abstract: 4416plf 4416pl
Contextual Info: MATERIAL DECLARATION SHEET Material # 4416P-LF Series Product Line Networks Date 05/13/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.14324 0.00048 0.00027 0.00002

diode marking 226

Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-RQ Product Line PTC resistors Date 01/13/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] Materials CAS if applicable Average mass [%] Barium oxide

1031

Contextual Info: MATERIAL DECLARATION SHEET Model # 2039-xx-SMLF Product Line GDT Date 04/01/2008 RoHS Compliant Yes No. Construction element Material group Material weight [g] Materials CAS if applicable Average mass [%] Sum [%] 1 Electrodes SM Copper Alloy 0.1525 Copper

Contextual Info: MATERIAL DECLARATION SHEET Material # Product Line Date RoHS Compliant CRH1206-LF Series Chip Resistors 04/12/2005 Yes No. Construction Element Material Group Material Weight [g] Materials 1 Ceramic Substrate 0.0085880 2 Top Conductor Silver if applicable

titanium oxide

Contextual Info: MATERIAL DATA SHEET Material CM160808 Series Product Line Date Laser-Cut Chip Inductors 17-December-2004 No. Construction element Material group 1 Ceramic Core Alumina 2 Conductor Coating resign Copper Epoxy Material weight mg 2.39 (ref.) 1.26 (ref.) 0.32