132 PIN PGA SOCKET Search Results

Contextual Info: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: •Convert surface mount PQFP packages to an Amp interstitial PGA footprint. •Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board

n03n

Abstract: DSP56002 ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors
Contextual Info: Order this document by DSP56002/D MOTOROLA - SEMICONDUCTOR TECHNICAL DATA Advance Information 24-Bit General Purpose Digital Signal Processor DSP56002 Pin Grid Array PGA Available in a 132 pin ceramic throughhoie package. Plastic Quad Flat Pack (PQFP) Available in a 132 pin, small footprint,

18022

Abstract: 132 pin PGA socket
Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

amp pga socket

Abstract: AMS-QQ-N-290
Contextual Info: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

pga 132 packaging

Abstract: 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket
Contextual Info: Int*l386 DX MICROPROCESSOR 8. MECHANICAL DATA 8.2 PACKAGE DIMENSIONS AND MOUNTING 8.1 INTRODUCTION The initial Intel386 OX package is a 132-pin ceramic pin grid array PGA . Pins of this package are ar­ ranged 0.100 inch (2.54mm) center-to-center, In a

A80960JD-33

Abstract: A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75 NG80960JT-100 NG80960JT-75
Contextual Info: 80960Jx 3.3 V Microprocessor 1.0 Packaging Information: 80960Jx 3.3 V Processors The 80960Jx is offered with four speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC = 3.3 V ± 0.15 V over a case temperature range of

68020 motorola

Abstract: motorola 68020
Contextual Info: 45.72mm [1.800"] Adapter to target PCB orientation A1 A1 ADAPTER PGA TOP 45.72mm [1.800"] Pin 1 2.54mm typ. [0.100"] Target PCB 132 position QFP land pattern 6.88mm [0.271"] 1 5.89mm [0.232"] 3 15.19mm[0.598"] Assembled 2 1 0.65mm typ. [0.026"] 26.54mm [1.045"]

A80960JC-33

Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66 NG80960JC-40
Contextual Info: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of

Wakefield Thermal Solutions TYPE 120

Abstract: intel packaging handbook 240800 Diode Mark N10 f 6061 A80960JD-33 A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75
Contextual Info: 80960JA/JF/JD/JT 3.3 V Microprocessor 1.0 Packaging Information: 80960Jx 3.3 V Processors The 80960Jx is offered with four speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC = 3.3 V ± 0.15 V over a case temperature range of

A80960JC-33

Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66
Contextual Info: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of

68302

Abstract: QFE132SA SF-QFJ132SA-L-01
Contextual Info: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.600" (assembled) Surface mount base: (included) see SF-QFJ132SA-L-01 drawing for greater detail 0.250" 0.025" pitch 1.040" Side View Target PCB 132 position QFP Land Pattern

68302

Abstract: motorola ST 1076 QFE132SA SF-QFJ132SA-G-02 land pattern QFP 132
Contextual Info: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.630" (assembled) Surface mount base: (included) see SF-QFJ132SA-G-02 drawing for greater detail 0.276" 0.025" pitch 1.076" Side View Target PCB 132 position QFP Land Pattern

Preci-Dip Durtal SA

Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
Contextual Info: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin

footprint pga 84

Abstract: footprint pga 208 e-tec pcp
Contextual Info: PGA/PGI Series - Pin Grid Array Sockets E-tec offers any configuration from 5 x 5 upwards. You may choose between open frame and closed frame socket bodies. The E-tec PGA sockets with Insulator code “S” will be supplied either in PBT plastic or FR4 Epoxy depending on material

footprint 8M1-A

Contextual Info: ADVANCED INTERCONNECTIONS PGA Footprints 5 Energy Way, P.O. Box 1019, W e st Warw ick, Rl 02893 • Tel. 4 0 1 -8 2 3 -5 20 0 • FAX 401-823-8723 PGA Socket and Adapter Footprints 8 Pins Footprint Number 8" _J ^ 9 Pins Footprint Num ber 9* L .300 Sq. f 7.62

15x15

Abstract: PGS49 13x13
Contextual Info: 2.54 A High-precision sockets for IC-PGA Pin configuration component side B C art. no. PGS 25 5x5 . art. no. PGS 36 6x6 . art. no. PGS 49 7x7 . art. no. PGS 44 8x8 . art. no. PGS 48 8x8 . art. no. PGS 64 8x8 . art. no. PGS 56 9x9 . art. no.

PGA zif socket 478

Abstract: pcps PCPS-299S1-003
Contextual Info: PCPS SERIES CONNECTORS 2.54mm .100" Pitch; Sockets for Pin Grid Array Packages The PCPS S eries are s o c k e ts fo r 2.54mm (.100") c e n te r pin grid a rra y -ty p e LSIs. T he Z e ro -ln s e rtio n -F o rc e (ZIF) m e ch a n ism en a b le s high d e n s ity LSI m o u n tin g /d is m o u n tin g by sin g le le v e r

Robinson Nugent CATALOG

Abstract: MC68461 SAB80286 WE32104 Z80000 IMST414 FGE2000 MCA2800ALS 82786 intel TC110G
Contextual Info: T Circuit C o m p o n en ts Inc. r MicrofQ 3000 PGA Decoupling Capacitors Micro/Q 3000 ceramic capacitors are a family of very low inductance decoupling capacitors specifically designed to be through-hole mounted under pin grid arrays PGAs , PGA sockets, and

Contextual Info: PGA Socket 709-8000 Series M aterial: In s u la to r: P o ly p h e n y le n e P P S U L 9 4 V -0 Colour, Black Contact: Body, brass 0.0002", tin over 0.0001" Cu Clip, Beryllium Copper, 0.00001" gold over Nickel E lectrical: Contact resistance; 10 milli Ohm s max

Robinson Nugent pga

Abstract: Robinson Nugent
Contextual Info: HIGH DENSITY Pin Grid Array Sockets PGA SERIES * High temp molded insulator body * Stand-offs available to eliminate intermittent solder connections * Precision screw machine sockets for high reliability * Available with solder, wire wrap and press-fit tails

Contextual Info: 0rt£C PGA SOCKET FOOTPRINTS INTERCONNECTION SPECIALISTS 5 X 5 .500 [1 2 .7 0 ] • • • • B • • A I J e 0• c• • • • • • • • • - E n c. B A • • • • 3 4 5 25 PINS 01 6 X * * * * • • • • • • • • • • •

Contextual Info: HIGH DENSITY_ Pin Grid Array Sockets PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermitte solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press tails

McKenzie technology

Abstract: burndy zif YAMAICHI 132 PGA MAXCONN ms McKenzie technology pga
Contextual Info: Sockets Below are two lists of manufactures known to offer sockets for Xilinx package types. This list does not imply an endorsement by Xilinx. Each user must evaluate the particular socket type. a compatible PGA socket with wire-wrap pins. Note that the board-layout then differs from a PGA board layout.

Contextual Info: HIGH DENSITY Pin Grid Array Sockets . ^ ^ 7 . PGA SERIES * High temp molded insulator body 9 Stand-offs available to eliminate intermittent solder connections 9 Precision screw machine sockets for high reliability 9 Available with solder, wire wrap and press-fit