132 PIN PGA SOCKET Search Results

Contextual Info: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: •Convert surface mount PQFP packages to an Amp interstitial PGA footprint. •Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board

n03n

Abstract: DSP56002 ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors
Contextual Info: Order this document by DSP56002/D MOTOROLA - SEMICONDUCTOR TECHNICAL DATA Advance Information 24-Bit General Purpose Digital Signal Processor DSP56002 Pin Grid Array PGA Available in a 132 pin ceramic throughhoie package. Plastic Quad Flat Pack (PQFP) Available in a 132 pin, small footprint,

18022

Abstract: 132 pin PGA socket
Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

mounting pad PQFP

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

132 pin PGA socket

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using

amp pga socket

Abstract: DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket
Contextual Info: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

amp pga socket

Abstract: AMS-QQ-N-290
Contextual Info: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,

pga 132 packaging

Abstract: 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket
Contextual Info: Int*l386 DX MICROPROCESSOR 8. MECHANICAL DATA 8.2 PACKAGE DIMENSIONS AND MOUNTING 8.1 INTRODUCTION The initial Intel386 OX package is a 132-pin ceramic pin grid array PGA . Pins of this package are ar­ ranged 0.100 inch (2.54mm) center-to-center, In a

A80960JD-33

Abstract: A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75 NG80960JT-100 NG80960JT-75
Contextual Info: 80960Jx 3.3 V Microprocessor 1.0 Packaging Information: 80960Jx 3.3 V Processors The 80960Jx is offered with four speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC = 3.3 V ± 0.15 V over a case temperature range of

intel packaging handbook 240800

Abstract: AD9132 AD27 AD30 AD1981
Contextual Info: 80L960JA/JF Microprocessor 1.0 Packaging Information: 80L960JA/JF Processor The 80L960JA/JF will be offered in several speed and package types. The 132-pin Pin Grid Array PGA device will be specified for operation at VCC = 3.3 V ± 5% over a case temperature range of

68020 motorola

Abstract: motorola 68020
Contextual Info: 45.72mm [1.800"] Adapter to target PCB orientation A1 A1 ADAPTER PGA TOP 45.72mm [1.800"] Pin 1 2.54mm typ. [0.100"] Target PCB 132 position QFP land pattern 6.88mm [0.271"] 1 5.89mm [0.232"] 3 15.19mm[0.598"] Assembled 2 1 0.65mm typ. [0.026"] 26.54mm [1.045"]

A80960JC-33

Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66 NG80960JC-40
Contextual Info: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of

A80960JC-33

Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66
Contextual Info: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of

motorola 68020

Contextual Info: 45.72mm [1.800"] Adapter to target PCB orientation A1 A1 ADAPTER PGA TOP 45.72mm [1.800"] Pin 1 2.54mm typ. [0.100"] Target PCB 132 position QFP land pattern 6.88mm [0.271"] 1 5.89mm [0.232"] 3 17.25mm[0.679"] Assembled 2 1 0.64mm typ. [0.025"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

68302

Abstract: QFE132SA SF-QFJ132SA-L-01
Contextual Info: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.600" (assembled) Surface mount base: (included) see SF-QFJ132SA-L-01 drawing for greater detail 0.250" 0.025" pitch 1.040" Side View Target PCB 132 position QFP Land Pattern

68302

Abstract: motorola ST 1076 QFE132SA SF-QFJ132SA-G-02 land pattern QFP 132
Contextual Info: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.630" (assembled) Surface mount base: (included) see SF-QFJ132SA-G-02 drawing for greater detail 0.276" 0.025" pitch 1.076" Side View Target PCB 132 position QFP Land Pattern

footprint 8M1-A

Contextual Info: Zero Insertion Force PGA Test and Burn-in Sockets cont. Grid Size No. of Pins Dim. “C” 12 x 12* 144 1.100 [27.94] 13 x 13 169 1.200 [30.48] 14 x 14* 196 1.300 [33.02] 15 x 15 225 1.400 [35.56] 16 x 16* 256 1.500 [38.10] 17 x 17 289 1.600 [40.64] 18 x 18*

Preci-Dip Durtal SA

Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
Contextual Info: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin

footprint pga 84

Abstract: footprint pga 208 e-tec pcp
Contextual Info: PGA/PGI Series - Pin Grid Array Sockets E-tec offers any configuration from 5 x 5 upwards. You may choose between open frame and closed frame socket bodies. The E-tec PGA sockets with Insulator code “S” will be supplied either in PBT plastic or FR4 Epoxy depending on material

footprint pga 84

Abstract: PGA 145 socket 8x8 64 footprint footprint pga 208 X18180 X1388 8x8 68 footprint 84 pin PGA socket
Contextual Info: PGA/PGI Series - Pin Grid Array Sockets E-tec the Swiss connection E-tec offers any configuration from 5 x 5 upwards. You may choose between open frame and closed frame socket bodies. The E-tec PGA sockets with Insulator code “S” will be supplied either in PBT plastic or FR4 Epoxy depending on material

ZIF pga 84

Abstract: PGA 145 socket QFP 128 pin Socket PA-QFJ172SB-P-Z-01 ZIF qfp 172
Contextual Info: Page 1 of 2 Use if QFP Pin 1 is lower left when device is placed on ZIF socket Top ViewQFP Socket 129 87 86 130 44 172 QFP PIN 1in lower left corner QFP PIN 1 43 A1 Top ViewPGA Base A17 126 125 129 128 127 121 113 110 109 103 97 91 88 87 90 89 85 130 123

footprint 8M1-A

Contextual Info: ADVANCED INTERCONNECTIONS PGA Footprints 5 Energy Way, P.O. Box 1019, W e st Warw ick, Rl 02893 • Tel. 4 0 1 -8 2 3 -5 20 0 • FAX 401-823-8723 PGA Socket and Adapter Footprints 8 Pins Footprint Number 8" _J ^ 9 Pins Footprint Num ber 9* L .300 Sq. f 7.62