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    1272/2008/EC Search Results

    1272/2008/EC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPN12008QM
    Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance Datasheet
    20083EB0BD
    Amphenol Communications Solutions Elite Backplane connectors, DO 8pair, 12position, NiS PDF
    75844-127-20LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. PDF
    75844-127-26LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch. PDF
    10127225-112500ULF
    Amphenol Communications Solutions ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, 2-Pair, 19 column, 12.5mm Plug Height, Press-Fit, Hermaphroditic. PDF