121412HC02 Search Results
121412HC02 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : TSSOP 16L Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Content in % 60.000% 32.000% Silver Spot Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN |
Original |
TSSOP-16LD-PBY-RS-13 121412HC02 |